SEMiX404GB12E4s
Absolute Maximum Ratings Symbol
IGBT VCES IC ICnom ICRM ICRM = 3xICnom VCC = 800 V VGE ≤ 20 V VCES ≤ 1200 V VGES tpsc Tj Inverse diode IF Tc = 25 °C Tc = 80 °C Tj = 150 °C Tj = 175 °C Tc = 25 °C Tc = 80 °C 1200 618 475 400 1200 -20 ... 20 10 -40 ... 175 440 329 400 IFRM = 3xIFnom tp = 10 ms, sin 180°, Tj = 25 °C 1200 1980 -40 ... 175 600 -40 ... 125 AC sinus 50Hz, t = 1 min 4000 V A A A A V µs °C A A A A A °C A °C V
Conditions
Values
Unit
SEMiX® 4s
Trench IGBT Modules
SEMiX404GB12E4s
Tj = 175 °C
IFnom
Features
• Homogeneous Si • Trench = Trenchgate technology • VCE(sat) with positive temperature coefficient • High short circuit capability • UL recognized, file no. E63532
IFRM IFSM Tj Module It(RMS) Tstg Visol
Typical Applications*
• AC inverter drives • UPS • Electronic Welding
Characteristics Symbol
IGBT VCE(sat) VCE0 rCE VGE(th) ICES Cies Coes Cres QG RGint td(on) tr Eon td(off) tf Eoff Rth(j-c) IC = 400 A VGE = 15 V chiplevel Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C VGE = 15 V Tj = 25 °C Tj = 150 °C 5 Tj = 25 °C Tj = 150 °C f = 1 MHz f = 1 MHz f = 1 MHz 24.6 1.62 1.38 2260 1.88 Tj = 150 °C Tj = 150 °C Tj = 150 °C 296 67 27 634 137 59.7 0.072 1.8 2.2 0.8 0.7 2.5 3.8 5.8 0.12 2.05 2.4 0.9 0.8 2.9 4.0 6.5 0.36 V V V V mΩ mΩ V mA mA nF nF nF nC Ω ns ns mJ ns ns mJ K/W
Conditions
min.
typ.
max.
Unit
Remarks
• Case temperature limited to TC=125°C max. • Product reliability results are valid for Tj=150°C • For short circuit: Soft RGoff recommended RGoff > 25 • Dynamic values apply to the following combination of resistors: RGon,main = 1,0 Ω RGoff,main = 1,0 Ω RG,X = 2,2 Ω RE,X = 0,5 Ω
VGE=VCE, IC = 15.2 mA VGE = 0 V VCE = 1200 V VCE = 25 V VGE = 0 V VGE = - 8 V...+ 15 V Tj = 25 °C VCC = 600 V IC = 400 A
RG on = 1.7 Ω Tj = 150 °C RG off = 1.7 Ω di/dton = 5800 A/µs Tj = 150 °C di/dtoff = 3700 A/µs Tj = 150 °C per IGBT
GB © by SEMIKRON Rev. 0 – 05.05.2010 1
SEMiX404GB12E4s
Characteristics Symbol Conditions
Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C rF Tj = 25 °C Tj = 150 °C IF = 400 A Tj = 150 °C di/dtoff = 4900 A/µs T = 150 °C j VGE = -15 V Tj = 150 °C VCC = 600 V per diode 1.1 0.7 2.0 2.6
min.
typ.
2.2 2.1 1.3 0.9 2.3 3.1 315 63 26.4
max.
2.52 2.5 1.5 1.1 2.5 3.4
Unit
V V V V mΩ mΩ A µC mJ
Inverse diode VF = VEC IF = 400 A VGE = 0 V chip VF0
SEMiX® 4s
Trench IGBT Modules
SEMiX404GB12E4s
IRRM Qrr Err Rth(j-c) Module LCE RCC'+EE'
0.14 22
K/W nH mΩ mΩ K/W
res., terminal-chip per module to heat sink (M5)
TC = 25 °C TC = 125 °C 3 to terminals (M6) 2.5
0.7 1 0.03 5 5 400
Features
• Homogeneous Si • Trench = Trenchgate technology • VCE(sat) with positive temperature coefficient • High short circuit capability • UL recognized, file no. E63532
Rth(c-s) Ms Mt w
Nm Nm Nm g Ω K
Typical Applications*
• AC inverter drives • UPS • Electronic Welding
Temperatur Sensor R100 B100/125 Tc=100°C (R25=5 kΩ) R(T)=R100exp[B100/125(1/T-1/T100)]; T[K]; 493 ± 5% 3550 ±2%
Remarks
• Case temperature limited to TC=125°C max. • Product reliability results are valid for Tj=150°C • For short circuit: Soft RGoff recommended RGoff > 25 • Dynamic values apply to the following combination of resistors: RGon,main = 1,0 Ω RGoff,main = 1,0 Ω RG,X = 2,2 Ω RE,X = 0,5 Ω
GB 2 Rev. 0 – 05.05.2010 © by SEMIKRON
SEMiX404GB12E4s
Fig. 1: Typ. output characteristic, inclusive RCC'+ EE'
Fig. 2: Rated current vs. temperature IC = f (TC)
Fig. 3: Typ. turn-on /-off energy = f (IC)
Fig. 4: Typ. turn-on /-off energy = f (RG)
Fig. 5: Typ. transfer characteristic
Fig. 6: Typ. gate charge characteristic
© by SEMIKRON
Rev. 0 – 05.05.2010
3
SEMiX404GB12E4s
Fig. 7: Typ. switching times vs. IC
Fig. 8: Typ. switching times vs. gate resistor RG
Fig. 9: Typ. transient thermal impedance
Fig. 10: Typ. CAL diode forward charact., incl. RCC'+EE'
Fig. 11: Typ. CAL diode peak reverse recovery current
Fig. 12: Typ. CAL diode recovery charge
4
Rev. 0 – 05.05.2010
© by SEMIKRON
SEMiX404GB12E4s
SEMiX 4s
spring configuration
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal.
© by SEMIKRON
Rev. 0 – 05.05.2010
5
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