SKAI90A2GD06-W24DI

SKAI 90 A2 GD06-W24DI Characteristics Symbol Visol VCC Conditions DC, t = 1 s DC supply voltage rms @ rated conditions: dV/dt = 10l/ min, 50% Glykol/ 50% H20, fsw = 4kHz, VCC = 350V, Vout = 200V, fout = 50 Hz, cos(phi) = 0.85, M = 0.93, Tcoolant = 65 °C, Tair = 65 °C Switching frequency DC Bus Capacitance EMI Capacitor; DC to enclosure DC+ to enclosure, DC- to enclosure DC+ to DC- min. typ. 3000 350 max. Unit V Electrical Data 450 V Inom 300 A HV SKAI 2 Three-phase IGBT inverter SKAI 90 A2 GD06-W24DI Target Data Features • • • • Optimized for HEV and EV high power density high overload capability Compact integration in IP67 Enclosure: V, I, T sensors Gate driver with protection features EMI filters Liquid cooling DC link capacitor fsw CDC Cy RF RBL Weight Height Width Length Mt Mc Mcg Me Mgnd 1 0.9 0.66 7.5 1 15 109 244 475 15 1.25 kHz mF µF M M kg mm mm mm Mechanical Data AC / DC terminals (M8 screw) Cover of terminal box (M5x16 flat-head-screw) AC / DC cable glands (recommended) Assembly of M8 screw enclosure; thread (l): > 15mm M6 screw Ground connection 13 3.5 14 4 10 15 4.5 20 14 Nm Nm Nm Nm Nm Nm mbar Typical Applications* • commercial application vehicle • hybrid vehicle • battery driven vehicle 13 14 100 15 No. 14282009 Hydraulical Data Pressure drop@ 10l/min, dp Tcoolant = 25°C p Operating pressure P Tstg Tno Tair Tcoolant IP Altitude Power dissipation to coolant; rated conditions storage temperature Non operating temperature range Operating range, derating for Tair > 85°C Operating range, derating for Tcoolant > 65°C Enclosure protection level With external connector protection VCC =450 V -40 -40 -40 -40 2 1.9 85 105 105 75 IP67 IP6K9K 5000 bar kW °C °C °C °C Environmental Data m HV SKAI 2 © by SEMIKRON Rev. 7 – 20.04.2011 1 SKAI 90 A2 GD06-W24DI Characteristics Symbol Vs ISO IS ViH ViL tPOR tpRESET Conditions Auxiliary supply voltage primary side Auxiliary supply current primary side without driving a gate (Vs = 24 V) Auxiliary supply current primary side, driving the gates (Vs = 24 V) Input signal voltage (HIGH) Input signal voltage (LOW) Power-on reset completed Error reset time Input-output turn-on propagation time Input-output turn-off propagation time Signal transfer prim - sec (total jitter) Short pulse suppression time Input impulse extension time Error input-output propagation time for DSCP error Error input-output propagation time for OCP error Error input-output propagation time for temperature error Top-Bot interlock dead time VCE monitoring blanking time Over temperature protection trip level (PCB) Over temperature protection trip level on ceramic-substrate Release temperature for PCB overtemperature trip level Release temperature for ceramic substrate overtemperature trip level Trip level of DC-link voltage monitoring Under voltage protection trip level of board primary side Threshold voltage level for driver reset after failure event Overcurrent trip level AC sensing range Gradient of output current sensing Bandwidth (3 dB) of AC current sensing Measurable DC-link-voltage Gradient of DC-link voltage sensing Bandwidth (3 dB) of DC-link voltage sensing Temperature sensing range on ceramic substrate Gradient of temperature sensing on ceramic-substrate Bandwidth of temperature sensing on ceramic-substrate min. 16 typ. 24 max. 32 450 1500 Unit V mA mA V V s s µs µs ns µs µs µs µs ms µs µs °C °C °C °C V Interface parameters 0.7 * Vs GND - 0.3 0.1 Vs + 0.3 0.3 * Vs 0.9 3 0.5 0.5 0.6 0.6 50 0.3 1.1 1 4 10 50 4 5 4.1 5.1 HV SKAI 2 Three-phase IGBT inverter SKAI 90 A2 GD06-W24DI Target Data Features • • • • Optimized for HEV and EV high power density high overload capability Compact integration in IP67 Enclosure: V, I, T sensors Gate driver with protection features EMI filters Liquid cooling DC link capacitor Controller switching parameters td(on)IO td(off)IO tjitter tSIS tet td(err)DSCP td(err)OCP td(err)TMP tTD tbl TPCBtrip TCStrip TRelPCBtrip TRelCStrip VDCtrip VVStrip VVSrst ITRIPSC Ioutsens mIoutsens BWIoutsens VDCsens mVDCsens BWVDCsens TCSsens mTCSsens BWTCSsens 0.2 0.9 0.2 0.25 1 Protection functions 100 120 90 85 450 14 16 850 -924 10.8 0 19.669 20.067 0.25 30 83.3 100 150 11.13 17 600 20.472 924 11.47 Typical Applications* • commercial application vehicle • hybrid vehicle • battery driven vehicle No. 14282009 V V APEAK A mV/A kHz V mV/V kHz °C mV/°C Hz HV SKAI 2 2 Rev. 7 – 20.04.2011 © by SEMIKRON SKAI 90 A2 GD06-W24DI Signal Connector PIN X1:01 X1:02 X1:03 Signal PWR_VP PWR_GND Function INPUT Auxiliary power supply / battery “+” Auxiliary power supply ground Specifications Supply voltage Vs Ground of auxiliary power supply HIGH, NOT CONNECTED (n.c.) or module not supplied with Auxiliary power = DC Link discharge active LOW = DC Link discharge disabled (internal pull-up resistor, external pull-up resistor required as well) X1:04 CMN_HALT INPUT/OUTPUT All connected units have to change the signal mode to „dominant“ if following happens: The unit is not ready to operate Error happened All connected units must be able to process (read) the signal. In case of recognised dominant signal, following steps need to be performed: The unit must be switched to a defined safe operation mode The unit must interrupt the main process unitl a recessive signal has been recognised LOW (dominant) = not ready to operate HIGH (recessive) = ready to operate X1:05 X1:06 CMN_TEMP_GND HB1_TOP Ground for temperature sensor signal CMN_TEMP INPUT Switching PWM signal [push/pull] INPUT Switching PWM signal [push/pull] INPUT Switching PWM signal [push/pull] INPUT Switching PWM signal [push/pull] INPUT Switching PWM signal [push/pull] INPUT Switching PWM signal [push/pull] GND Internally connected to PWR_GND Digital PWR_VP logic LOW = IGBT off HIGH = IGBT on X1:07 HB1_BOT Digital PWR_VP logic LOW = IGBT off HIGH = IGBT on X1:08 HB2_TOP Digital PWR_VP logic LOW = IGBT off HIGH = IGBT on X1:09 HB2_BOT Digital PWR_VP logic LOW = IGBT off HIGH = IGBT on X1:10 HB3_TOP Digital PWR_VP logic LOW = IGBT off HIGH = IGBT on X1:11 HB3_BOT Digital PWR_VP logic LOW = IGBT off HIGH = IGBT on X1:12 CAN_GND Ground of CAN bus DC_LINK_DISCHAR INPUT GE © by SEMIKRON Rev. 7 – 20.04.2011 3 SKAI 90 A2 GD06-W24DI PIN X1:13 X1:14 X1:15 X1:16 Signal PWR_VP PWR_GND CMN_GND CMN_TEMP Function INPUT Auxiliary power supply / battery “+” Auxiliary power supply ground Ground for CMN_DIAG, CMN_HALT, CMN_GPIO OUTPUT Temperature sensor signal CMN_TEMP Specifications Supply voltage Vs Ground of auxiliary power supply Internally connected to PWR_GND This pin is used to transmit the temperature sensor analog signal. Max. output current: 5 mA Nominal voltage range: 0…10 V X1:17 X1:18 X1.19 X1:20 X1:21 X1:22 X1:23 Reserved HB1_GND Reserved HB2_GND Reserved HB3_GND CAN_L Ground for HB3_TOP, HB3_BOT INPUT/OUTPUT CAN interface LOW line Internally connected to PWR_GND Input impedance = 121  Specification: ISO 11783 (2.5V, 250 kbit/sec minimum, quad twisted cable) or J1939/11 (250 kbit/sec minimum, twisted shielded pair). X1:24 X1:25 X1:26 PWR_VP PWR_GND CMN_DIAG INPUT Auxiliary power supply / battery “+” Auxiliary power supply ground INPUT/OUTPUT Single line CAN communication [dominant/recessive] Supply voltage Vs Ground of auxiliary power supply Dominant/Recessive diagnose input/output signal. All connected units can communicate using this serial signal for setting/getting parameters of the unit and reading error information from unit registers. This pin is used to transmit the DC-Link voltage level. Max. output current: 5 mA Nominal voltage range: 0….+10 V X1:28 X1:29 CMN_DCL_GND HB1_I Ground for DC-Link voltage signal CMN_DCL Internally connected to PWR_GND OUTPUT Current sensor out for HB1 [analog] Ground for HB1_I OUTPUT Current sensor out for HB2 [analog] Ground for HB2_I OUTPUT Current sensor out for HB3 [analog] Ground for HB3_I INPUT/OUTPUT CAN interface HIGH line Max. output current: 5 mA Nominal voltage range: -10 … +10 V Internally connected to PWR_GND Max. output current: 5 mA Nominal voltage range: -10 … +10 V Internally connected to PWR_GND Max. output current: 5 mA Nominal voltage range: -10 … +10 V Internally connected to PWR_GND Input impedance = 121  Specification: ISO 11783 (2.5V, 250 kbit/sec minimum, quad twisted cable) or J1939/11 (250 kbit/sec minimum, twisted shielded pair). Ground for HB2_TOP, HB2_BOT Internally connected to PWR_GND Ground for HB1_TOP, HB1_BOT Internally connected to PWR_GND X1:27 CMN_DCL OUTPUT DC-Link voltage signal [analog] X1:30 X1:31 HB1_I_GND HB2_I X1:32 X1:33 HB2_I_GND HB3_I X1:34 X1:35 HB3_I_GND CAN_H 4 Rev. 7 – 20.04.2011 © by SEMIKRON SKAI 90 A2 GD06-W24DI Power Connectors Terminal DC+ DCFunction HVDC Bus "+" HVDC Bus "-" cable harness cross section Cu / mm² ≤ 70 ≤ 70 L1 L2 L3 Coolant fittings Terminal IN OUT Phase L1 Phase L2 Phase L3 ≤ 70 ≤ 70 ≤ 70 Function Coolant Inlet Coolant Outlet © by SEMIKRON Rev. 7 – 20.04.2011 5 SKAI 90 A2 GD06-W24DI Fig. 1: Normalized output current vs. cos(phi) Fig. 2: Normalized output current vs. coolant temperature Fig. 3: Normalized output current vs. ambient temperature Fig. 4: Normalized output current vs. coolant flow Fig. 5: Overload capability Fig. 6: Legend 6 Rev. 7 – 20.04.2011 © by SEMIKRON SKAI 90 A2 GD06-W24DI Fig. 7: Pressure drop characteristic Fig. 8: Safe operating area Fig. 9: Normilized output current vs. output frequency © by SEMIKRON Rev. 7 – 20.04.2011 7 SKAI 90 A2 GD06-W24DI This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff. 8 Rev. 7 – 20.04.2011 © by SEMIKRON