SKCD31C120IHD

SKCD 31 C 120 I HD Absolute Maximum Ratings Symbol VRRM IF(AV) IFSM Tjmax Conditions Tj = 25 °C, IR = 0.1 mA Ts = 80 °C, Tj = 150 °C 10 ms sin 180° Tj = 25 °C Tj = 150 °C Values 1200 35 540 480 150 Unit V A A A °C CAL-DIODE I F = 55 A VRRM = 1200 V Size: 5,6 mm x 5,6 mm SKCD 31 C 120 I HD Electrical Characteristics Symbol i2t IR VF V(TO) rT Conditions Tj = 150 °C, 10 ms, sin 180° Tj = 25 °C, VRRM = 1200 V Tj = 125 °C, VRRM = 1200 V Tj = 25 °C, IF = 45 A Tj = 125 °C, IF = 45 A Tj = 125 °C Tj = 125 °C min. typ. max. 1152 0.10 4.00 Unit A2s mA mA V V V mΩ 1.50 1.50 0.92 13.4 1.77 1.77 Features • high current density • easy paralleling due to a small forward voltage spread • positive temperature coefficient • very soft recovery behavior • small switching losses • high ruggedness • compatible to thick wire bonding • compatible to standard solder processes Dynamic Characteristics Symbol trr trr Qrr Qrr Irrm Irrm Conditions Tj = 25 °C, 50 A, 600 V, 500 A/µs Tj = 125 °C, 50 A, 600 V, 500 A/µs Tj = 25 °C, 50 A, 600 V, 500 A/µs Tj = 125 °C, 50 A, 600 V, 500 A/µs Tj = 25 °C, 50 A, 600 V, 500 A/µs Tj = 125 °C, 50 A, 600 V, 500 A/µs min. typ. max. Unit µs ns µC 10 30 µC A A Typical Applications* • freewheeling diode for IGBT • particularly suitable for frequencies < 8 kHz Thermal Characteristics Symbol Tj Tstg Tsolder Tsolder Rth(j-s) 10 min. 5 min. sold. on 0,38 mm DCB, reference point on copper heatsink close to the chip 1 Conditions min. -40 -40 typ. max. 150 150 250 320 Unit °C °C °C °C K/W Mechanical Characteristics Symbol Raster size Area total Anode Cathode Wire bond Package Chips / Package Conditions Values 5.6 x 5.6 31.36 bondable (Al) solderable (Ag/Ni) Al, diameter ≤ 500 µm wafer frame 314 (5" Wafer) Unit mm2 mm2 pcs SKCD © by SEMIKRON Rev. 0 – 18.02.2010 1 SKCD 31 C 120 I HD This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal. 2 Rev. 0 – 18.02.2010 © by SEMIKRON