SKCD61C170IHD_10

SKCD61C170IHD_10

  • 厂商:

    SEMIKRON( 赛米控)

  • 封装:

  • 描述:

    SKCD61C170IHD_10 - CAL-DIODE - Semikron International

  • 详情介绍
  • 数据手册
  • 价格&库存
SKCD61C170IHD_10 数据手册
SKCD 61 C 170 I HD Absolute Maximum Ratings Symbol VRRM IF(AV) IFSM Tjmax Conditions Tj = 25 °C, IR = 0.1 mA Ts = 80 °C, Tj = 150 °C 10 ms sin 180° Tj = 25 °C Tj = 150 °C Values 1700 65 850 710 150 Unit V A A A °C CAL-DIODE IF = 100 A VRRM = 1700 V Size: 7,8 mm x 7,8 mm SKCD 61 C 170 I HD Electrical Characteristics Symbol i2t IR VF V(TO) rT Conditions Tj = 150 °C, 10 ms, sin 180° Tj = 25 °C, VRRM = 1700 V Tj = 125 °C, VRRM = 1700 V Tj = 25 °C, IF = 100 A Tj = 125 °C, IF = 100 A Tj = 125 °C Tj = 125 °C min. typ. max. 2520 0.10 Unit A2s mA mA V V V mΩ 1.73 1.78 1.03 7.4 2.02 2.05 Features • high current density • easy paralleling due to a small forward voltage spread • positive temperature coefficient • very soft recovery behavior • small switching losses • high ruggedness • compatible to thick wire bonding • compatible to standard solder processes Dynamic Characteristics Symbol trr trr Qrr Qrr Irrm Irrm Conditions Tj = 25 °C, 75 A, 1200 V, 800 A/µs Tj = 125 °C, 75 A, 1200 V, 800 A/µs Tj = 25 °C, 75 A, 1200 V, 800 A/µs Tj = 125 °C, 75 A, 1200 V, 800 A/µs Tj = 25 °C, 75 A, 1200 V, 800 A/µs Tj = 125 °C, 75 A, 1200 V, 800 A/µs min. typ. max. Unit µs ns µC 26 66 µC A A Typical Applications* • freewheeling diode for IGBT • particularly suitable for frequencies < 8 kHz Thermal Characteristics Symbol Tj Tstg Tsolder Tsolder Rth(j-s) 10 min. 5 min. sold. on 0,38 mm DCB, reference point on copper heatsink close to the chip 0.54 Conditions min. -40 -40 typ. max. 150 150 250 320 Unit °C °C °C °C K/W Mechanical Characteristics Symbol Raster size Area total Anode Cathode Wire bond Package Chips / Package Conditions Values 7.8 x 7.8 61 bondable (Al) solderable (Ag/Ni) Al, diameter ≤ 500 µm wafer frame 156 (5" Wafer) Unit mm2 mm2 pcs SKCD © by SEMIKRON Rev. 1 – 18.02.2010 1 SKCD 61 C 170 I HD This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal. 2 Rev. 1 – 18.02.2010 © by SEMIKRON
SKCD61C170IHD_10
1. 物料型号: - 型号为“SKCD 61 C 170 I HD”。

2. 器件简介: - 这是一个高电流密度、易于并联、具有正温度系数、非常软恢复特性、小开关损耗、高鲁棒性、兼容粗线键合和标准焊接工艺的器件。

3. 引脚分配: - 阳极(Anode):可键合(Al)。 - 阴极(Cathode):可焊接(Ag/Ni)。

4. 参数特性: - 绝对最大额定值: - VRRM:1700V。 - IF(AV):65A。 - IFSM:850A。 - Tjmax:150°C。 - 电气特性: - i2t:2520A²s(150°C,10ms,正弦波180°)。 - IR:0.10mA(25°C,VRRM=1700V)。 - VF:1.73V(25°C,IF=100A);1.78V(125°C,IF=100A)。 - V(TO):1.03V(125°C)。 - IT:7.4mA(125°C)。

5. 功能详解: - 动态特性包括高电流密度、小正向电压分散、正温度系数、非常软恢复行为、小开关损耗、高鲁棒性、兼容粗线键合和标准焊接工艺。

6. 应用信息: - 典型应用为IGBT的自由轮流通路二极管,特别适用于频率小于8kHz的场合。

7. 封装信息: - 封装尺寸:7.8mm x 7.8mm。 - 总面积:61mm²。 - 封装类型:晶圆框架。 - 每封装芯片数:156(5英寸晶圆)。
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