SKCD 81 C 120 I4F
Absolute Maximum Ratings Symbol
VRRM IF(AV) IFSM Tjmax
Conditions
Tj = 25 °C, IR = 0.18 mA Tc = 80 °C, Tj = 175 °C, Fi=PI/2 10 ms sin 180° Tj = 25 °C Tj = 150 °C
Values
1200 98 900 900 175
Unit
V A A A °C
CAL-DIODE
IF = 150 A VRRM = 1200 V Size: 9 mm x 9 mm
Electrical Characteristics Symbol
i²t IR VF
Conditions
Tj = 150 °C, sin 180°, 10 ms Tj = 25 °C, VRRM = 1200 V Tj = 150 °C, VRRM = 1200 V Tj = 25 °C, IF = 150 A Tj = 150 °C, IF = 150 A Tj = 175 °C, IF = 150 A
min.
typ.
max.
4050 0.18
Unit
A²s mA mA V V V V m V m
14.00 2.14 2.07 1.93 0.90 7.8 0.82 7.40
28.00 2.46 2.38 2.24 1.10 8.60 0.98 8.40
SKCD 81 C 120 I4F Features
• • • • max. junction 175 °C very low forward voltage drop positive temperature coefficient extreme soft recovery
V(TO) rT V(TO) rT
Tj = 150 °C Tj = 150 °C Tj = 175 °C Tj = 175 °C
Dynamic Characteristics Symbol
trr Err Irrm
Conditions
Tj = 150 °C, 150 A, 600 V, 3200 A/µs Tj = 150 °C, 150 A, 600 V, 3200 A/µs Tj = 150 °C, 150 A, 600 V, 3200 A/µs
min.
typ.
0.48 8.7 153
max.
Unit
µs mJ A
Typical Applications*
• freewheeling diode for IGBT
Thermal Characteristics Symbol
Tj Tstg Tsolder Tsolder Rth(j-c) 10 min. 5 min. Semitrans Assembly 0.32
Conditions
min.
-40 -40
typ.
max.
175 175 250 320
Unit
°C °C °C °C K/W
Mechanical Characteristics Symbol
Raster size Area total Anode Cathode Wire bond Package Chips / Package Metallization Metallization
Conditions
Values
9x9 81 bondable (Al) solderable (Ag/Ni) Al, typ. diameter = 300 µm wafer frame 179
Unit
mm2 mm²
pcs
SKCD © by SEMIKRON Rev. 0 – 16.03.2011 1
SKCD 81 C 120 I4F
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.
2
Rev. 0 – 16.03.2011
© by SEMIKRON
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