SKET33018E

VRSM VRRM VDRM (dv/dt)cr ITRMS (maximum values for continuous operation) 600 A 700 A 440 A (78 °C) SKET 400/08 D SKET 400/12 E SKET 400/14 E SKET 400/16 E SKET 400/18 E – – ITAV (sin. 180; Tcase = . . .) SEMIPACK® 4 Thyristor Modules SKET 330 SKET 400 V 900 1300 1500 1700 1900 2100 2300 V 800 1200 1400 1600 1800 2000 2200 V/µs 500 1000 1000 1000 1000 1000 1000 380 (68 °C) SKET 330/08 D SKET 330/12 E SKET 330/14 E SKET 330/16 E SKET 330/18 E SKET 330/20 E SKET 330/22 E Symbol Conditions ITAV ID IRMS ITSM i 2t tgd tgr (di/dt)cr tq IH IL VT VT(TO) rT IDD; IRD VGT IGT VGD IGD Rthjc I:\Marketin\FRAMEDAT\datbl\B01-Semipack\SKET330-400.fm SKET 330 SKET 400 Units A °C A A A A A2s A2s µs µs A/µs µs mA A V A V mΩ mA V mA V mA °C/W °C/W °C/W °C/W °C V~ Nm Nm m/s2 g sin. 180; (Tcase = . . .) B2/B6 Tamb = 35 °C; P 16/300 F W1/W3 Tamb = 35 °C; P 16/400 F Tvj = 25 °C; 10 ms Tvj = 130 °C; 10 ms Tvj = 25 °C; 8,3 ... 10 ms Tvj = 130 °C; 8,3 ... 10 ms Tvj = 25 °C VD = 0,67 . VDRM Tvj = 130 °C Tvj = 130 °C Tvj = 25 °C Tvj = 25 °C; RG = 33 Ω; typ./max. Tvj = 25 °C; (IT = . . .); max. Tvj = 130 °C Tvj = 130 °C Tvj = 130 °C; V = VDRM / VRRM Tvj = 25 °C; d.c. Tvj = 25 °C; d.c. Tvj = 130 °C; d.c. Tvj = 130 °C; d.c. cont. sin. 180 rec. 120 IG = 1 A diG/dt = 1 A/µs 330 400 (78) (84) 530 / 665 700 / 880 685 / 3 x 550 905 / 3 x 720 9 000 8 000 405 000 320 000 1 2 125 typ. 150 . . . 200 150 / 500 0,5 / 2 2,05 (1500) 1,2 0,55 120 3 200 0,25 10 0,09 0,095 0,11 0,02 – 40 ... + 130 3600 / 3000 5 (44 lb. in.) ± 15 %1) 17 (150 lb. in.) ± 15 %2) 5 . 9,81 940 A 36 1,7 (2400) 0,92 0,3 80 14 000 12 000 980 000 720 000 SKET Features • Heat transfer through aluminium nitride ceramic isolated metal baseplate • Precious metal pressure contacts for high reliability • With amplifying gate • UL recognized, file no. E 63 532 Typical Applications • DC motor control (e. g. for machine tools) • Temperature control (e. g. for ovens, chemical processes) • Professional light dimming (studios, theaters) Rthch Tvj; Tstg Visol M1 M2 a w Case 1) 2) a. c. 50 Hz; r.m.s; 1 s/1 min to heatsink SI (US) units to terminals approx. → page B 1 – 94 See the assembly instructions The screws must be lubricated © by SEMIKRON 030217 B 1 – 91 Fig. 1 a Power dissipation vs. on-state current and ambient temperature Fig. 1 b Power dissipation vs. on-state current and ambient temperature Fig. 5 Recovered charge vs. current decrease B 1 – 92 Fig. 6 Transient thermal impendance vs. time 0898 © by SEMIKRON © by SEMIKRON 0597 B 1 – 93 B 1 – 94 0597 © by SEMIKRON