SKM400GAL12E4
Absolute Maximum Ratings Symbol
IGBT VCES IC ICnom ICRM ICRM = 3xICnom VCC = 800 V VGE ≤ 15 V VCES ≤ 1200 V VGES tpsc Tj Inverse diode IF
SKM400GAL12E4
Conditions
Values
1200
Unit
V A A A A V µs °C A A A A A °C A A A A A °C A °C V
Tj = 175 °C
Tc = 25 °C Tc = 80 °C
618 475 400 1200 -20 ... 20
SEMITRANS®3
IGBT4 Modules
Tj = 150 °C
10 -40 ... 175
Tj = 175 °C
Tc = 25 °C Tc = 80 °C
440 329 400 1200 1980 -40 ... 175
IFnom
Features
• IGBT4 = 4. Generation (Trench)IGBT • VCEsat with positive temperature coefficient • High short circuit capability, self limiting to 6 x ICNOM • Soft switching 4. Generation CAL diode (CAL4)
IFRM IFSM Tj
IFRM = 3xIFnom tp = 10 ms, sin 180°, Tj = 25 °C
Freewheeling diode IF IFnom IFRM IFSM Tj Module It(RMS) Tstg Visol AC sinus 50Hz, t = 1 min 500 -40 ... 125 4000 IFRM = 3xIFnom tp = 10 ms, sin 180°, Tj = 25 °C Tj = 175 °C Tc = 25 °C Tc = 80 °C 440 329 400 1200 1980 -40 ... 175
Typical Applications
• • • • DC/DC – converter Brake chopper Switched reluctance motor DC – motor
Remarks
• Case temperature limited to Tc = 125°C max, recomm. Top = -40 ... +150°C, product rel. results valid for Tj = 150°
Characteristics Symbol
IGBT VCE(sat) VCE0 rCE VGE(th) ICES Cies Coes Cres QG RGint IC = 400 A VGE = 15 V chiplevel Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C VGE = 15 V Tj = 25 °C Tj = 150 °C 5 Tj = 25 °C Tj = 150 °C f = 1 MHz f = 1 MHz f = 1 MHz 24.6 1.62 1.38 2260 1.9 1.8 2.2 0.8 0.7 2.5 3.8 5.8 0.1 2.05 2.4 0.9 0.8 2.9 4.0 6.5 0.3 V V V V mΩ mΩ V mA mA nF nF nF nC Ω
Conditions
min.
typ.
max.
Unit
VGE=VCE, IC = 15.2 mA VGE = 0 V VCE = 1200 V VCE = 25 V VGE = 0 V VGE = - 8 V...+ 15 V Tj = 25 °C
GAL © by SEMIKRON Rev. 2 – 16.06.2009 1
SKM400GAL12E4
Characteristics Symbol
td(on) tr Eon td(off) tf Eoff Rth(j-c)
Conditions
VCC = 600 V IC = 400 A VGE = ±15 V RG on = 1 Ω RG off = 1 Ω di/dton = 9700 A/µs di/dtoff = 4300 A/µs per IGBT Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C IF = 400 A Tj = 150 °C di/dtoff = 8800 A/µs T = 150 °C j VGE = ±15 V Tj = 150 °C VCC = 600 V per diode Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C IF = 400 A Tj = 150 °C di/dtoff = 8800 A/µs T = 150 °C j VGE = ±15 V Tj = 150 °C VCC = 600 V per Diode Tj = 150 °C Tj = 150 °C Tj = 150 °C Tj = 150 °C Tj = 150 °C Tj = 150 °C
min.
typ.
242 47 33 580 101 56
max.
Unit
ns ns mJ ns ns mJ
0.072 2.2 2.15 1.3 0.9 2.3 3.1 450 68 30.5 0.14 2.2 2.15 1.3 0.9 2.3 3.1 450 68 30.5 0.14 15 20 2.52 2.47 1.5 1.1 2.5 3.4 2.52 2.47 1.5 1.1 2.5 3.4
K/W V V V V mΩ mΩ A µC mJ K/W V V V V mΩ mΩ A µC mJ K/W nH mΩ mΩ
SEMITRANS 3
IGBT4 Modules
SKM400GAL12E4
®
Inverse diode VF = VEC IF = 400 A VGE = 0 V chip VF0 rF IRRM Qrr Err Rth(j-c)
Features
• IGBT4 = 4. Generation (Trench)IGBT • VCEsat with positive temperature coefficient • High short circuit capability, self limiting to 6 x ICNOM • Soft switching 4. Generation CAL diode (CAL4)
Typical Applications
• • • • DC/DC – converter Brake chopper Switched reluctance motor DC – motor
Freewheeling diode VF = VEC IF = 400 A VGE = 0 V chip VF0 rF IRRM Qrr Err Rth(j-c) Module LCE RCC'+EE' Rth(c-s) Ms Mt w terminal-chip per module to heat sink M6
Remarks
• Case temperature limited to Tc = 125°C max, recomm. Top = -40 ... +150°C, product rel. results valid for Tj = 150°
TC = 25 °C TC = 125 °C 3 to terminals M6 2.5
0.25 0.5 0.02 0.038 5 5 325
K/W Nm Nm Nm g
GAL 2 Rev. 2 – 16.06.2009 © by SEMIKRON
SKM400GAL12E4
Fig. 1: Typ. output characteristic, inclusive RCC'+ EE'
Fig. 2: Rated current vs. temperature IC = f (TC)
Fig. 3: Typ. turn-on /-off energy = f (IC)
Fig. 4: Typ. turn-on /-off energy = f (RG)
Fig. 5: Typ. transfer characteristic
Fig. 6: Typ. gate charge characteristic
© by SEMIKRON
Rev. 2 – 16.06.2009
3
SKM400GAL12E4
Fig. 7: Typ. switching times vs. IC
Fig. 8: Typ. switching times vs. gate resistor RG
Fig. 9: Transient thermal impedance
Fig. 10: CAL diode forward characteristic
Fig. 11: CAL diode peak reverse recovery current
Fig. 12: Typ. CAL diode peak reverse recovery charge
4
Rev. 2 – 16.06.2009
© by SEMIKRON
SKM400GAL12E4
Semitrans 3
GAL
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX. This technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee expressed or implied is made regarding delivery, performance or suitability.
© by SEMIKRON
Rev. 2 – 16.06.2009
5
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