SKR16

SKR 16,3 x 18,2 Qu bond Absolute Maximum Ratings Symbol VRRM IF(AV) It IFSM Tjmax 2 Conditions Tj = 25 °C, IR = 0.4 mA Tc = 80 °C, Tj = 150 °C Tj = 150 °C, 10 ms, sin 180° 10 ms sin 180° Tj = 25 °C Tj = 150 °C Values 1600 305 130050 6600 5100 150 Unit V A A2s A A °C DIODE IF(DC) = 365 A VRRM = 1600 V Size: 16,3 mm x 18,2 mm Electrical Characteristics Symbol IR VF V(TO) rT Conditions Tj = 25 °C, VRRM Tj = 120 °C, VRRM Tj = 25 °C, IF = 320 A Tj = 125 °C, IF = 320 A Tj = 125 °C Tj = 125 °C Tj = 25 °C, ± 1 A min. typ. max. 0.4 2.2 Unit mA mA V V V mΩ µs 1 0.9 1.21 1.1 0.83 0.5 SKR 16,3 x 18,2 Qu bond trr 49 Thermal Characteristics Features • high current density due to mesa technology • high surge current • compatible to thick wire bonding • compatible to all standard solder processes Symbol Tj Tstg Tsolder Tsolder Rth(j-c) Conditions min. -40 -40 typ. max. 150 150 250 320 Unit °C °C °C °C K/W 10 min. 5 min. Semipack 2 assembly 0.185 Typical Applications • uncontrolled rectifier bridges Mechanical Characteristics Symbol Raster size Area total Anode Cathode Wire bond Package Chips / Package Conditions Values 16,3 x 18,2 296,66 bondable (Al) solderable (Ag/Ni) Al, diameter ≤ 500 µm tray 20 Unit mm mm2 pcs SKR © by SEMIKRON Rev. 0 – 02.10.2009 1 SKR 16,3 x 18,2 Qu bond This technical information specifies semiconductor devices. No warranty or guarantee expressed or implied is made regarding delivery, performance or suitability. 2 Rev. 0 – 02.10.2009 © by SEMIKRON