SemiWell Semiconductor
TN1215R
STANDARD TYPE
Silicon Controlled Rectifiers
Features
◆ ◆ ◆
Symbol
3. Gate
○ ○
▼
1 2 3
○
2. Anode
1. Cathode
Repetitive Peak Off-State Voltage : 600V R.M.S On-State Current ( IT(RMS)= 12 A ) Low On-State Voltage (1.3V(Typ.) @ ITM) D-PAK
General Description
2
Standard gate triggering SCR is suitable for the application where requiring high bidirectional blocking voltage capability and also suitable for over voltage protection ,motor control circuit in power tool,inrush current limit circuit and heating control system.
Absolute Maximum Ratings
Symbol
VDRM IT(AV) IT(RMS) ITSM I2 t di/dt PGM PG(AV) IFGM VRGM TJ TSTG
( TJ = 25°C unless otherwise specified ) Condition Ratings
600 Half Sine Wave : TC =108 °C 180° Conduction Angle 1/2 Cycle, 60Hz, Sine Wave Non-Repetitive t = 8.3ms 7.6 12 132 87 50 5 0.5 2 5.0 - 40 ~ 125 - 40 ~ 150
Parameter
Repetitive Peak Off-State Voltage Average On-State Current R.M.S On-State Current Surge On-State Current I2t for Fusing Critical rate of rise of on-state current Forward Peak Gate Power Dissipation Forward Average Gate Power Dissipation Forward Peak Gate Current Reverse Peak Gate Voltage Operating Junction Temperature Storage Temperature
Units
V A A A A 2s A/㎲ W W A V °C °C
Aug, 2003. Rev. 0
1/5
Copyright@SemiWell Semiconductor Co., Ltd., All rights are reserved.
TN1215R
Electrical Characteristics
Symbol Items
VAK = VDRM TC = 25 °C TC = 125 °C ITM = 24 A VAK = 6 V(DC), RL=10 Ω IGT Gate Trigger Current (2) TC = 25 °C ─ ─ 15 mA tp = 380㎲ ─ ─ ─ ─ ─ ─ 10 200 1.6 ( TC = 25 °C unless otherwise noted )
Conditions
Ratings Min. Typ. Max.
Unit
IDRM
Repetitive Peak Off-State Current Peak On-State Voltage (1)
㎂
VTM
V
VD =6 V(DC), RL=10 Ω VGT Gate Trigger Voltage (2) TC = 25 °C ─ ─ 1.5 V
VGD dv/dt
Non-Trigger Gate Voltage (1) Critical Rate of Rise Off-State Voltage
VAK = 12 V, RL=100 Ω TC = 125 °C Linear slope up to VD = VDRM 67% Gate open TC = 125 °C IT = 100mA , Gate Open
0.2 200
─ ─
─ ─
V
V/㎲
IH
Holding Current
TC = 25 °C
─
─
20
mA
Rth(j-c) Rth(j-a)
Thermal Impedance Thermal Impedance
Junction to case Junction to Ambient
─ ─
─ ─
1.3 70
°C/W °C/W
※ Notes : 1. Pulse Width ≤ 1.0 ms , Duty cycle ≤ 1% 2. RGK Current not Included in measurement.
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TN1215R
Fig 1. Gate Characteristics
Fig 2. Maximum Case Temperature
140
VGM(5V) PGM(5W)
o
10
1
Max. Allowable Case Temperature [ C]
120
θ = 180
o
Gate Voltage [V]
100
IGM(2A)
10
0
PG(AV)(0.5W)
25 C
o
80
π θ
360°
2π
60
θ
40 0
: Conduction Angl e
VGD(0.2V)
10
-1
10
-1
10
0
10
1
10
2
10
3
10
4
1
2
3
4
5
6
7
8
9
Gate Current [mA]
Average On-State Current [A]
Fi g 3. Typi cal Forward Voltage
10
2
Fi g 4. Th ermal R esponse
10
1
Transient Thermal Impedance [ C/W]
o
10
0
On-State Current [A]
125 C 10
1
o
10
-1
25 C
o
10
-2
10
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
10
-3
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
On-State Voltage [V]
Time (sec)
Fig 5. Typical Gate Trigger Voltage vs. Junction Temperature
10
10
Fi g 6. Typi cal Gate Tri gger Current vs. Junction Temperature
VGT(25oC)
VGT(toC)
IGT(25 C)
IGT(t C)
o
o
1
1
0.1 -50
0
50
100
o
150
0.1 -50
0
50
100
o
150
Junction Temperature[ C]
Junction Temperature[ C]
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TN1215R
Fi g 7. Typi cal Ho ldi ng C urrent
10
10 θ = 180
o
Fig 8. Power Dissipation
Max. Average Power Dissipation [W]
8 θ = 30 6
o
θ = 120 θ = 60
o
o
θ = 90
o
IH(25 C)
IH(t C)
o
o
1
4
2
0.1 -50
0
50
100
o
150
0 0 1 2 3 4 5 6 7
Junction Temperature[ C]
Average On-State Current [A]
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TN1215R
TO-252(D-PAK) Package Dimension
Dim. A B C D E F G H I J K L
mm Min. 6.48 5.0 7.42 2.184 0.762 1.016 Typ. 6.604 5.08 7.8 2.286 0.813 1.067 2.286 2.286 0.534 1.016 0.61 1.067 0.508 0.762 1.57 0.686 1.118 0.021 0.04 Max. 6.73 5.21 8.18 2.388 0.864 1.118 Min. 0.255 0.197 0.292 0.086 0.03 0.04
Inch Typ. 0.26 0.2 0.307 0.09 0.032 0.042 0.09 0.09 0.024 0.042 0.02 0.03 0.06 0.027 0.044 Max. 0.265 0.205 0.322 0.094 0.034 0.044
φ
A B
D E
φ
C I 2 1 G 3 H J
F
K
L
1. Cathode 2. Anode 3. Gate
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