ECLAMP2384P

ESD/EMI Protection for Color LCD Interfaces PROTECTION PROTECTION PRODUCTS - EMIClampTM Description The EClampTM2384P is a low pass filter array with integrated TVS diodes. It is designed to suppress unwanted EMI/RFI signals and provide electrostatic discharge (ESD) protection in portable electronic equipment. This state-of-the-art device utilizes solidstate silicon-avalanche technology for superior clamping performance and DC electrical characteristics. They have been optimized for protection of color LCD panels in cellular phones and other portable electronics. The device consists of four identical circuits comprised of TVS diodes for ESD protection, and a resistor capacitor network for EMI/RFI filtering. A series resistor value of 200Ω and a capacitance value of 12pF are used to achieve 30dB minimum attenuation from 800MHz to 2.7GHz. The TVS diodes provide effective suppression of ESD voltages in excess of ±15kV (air discharge) and ±8kV (contact discharge) per IEC 610004-2, level 4. The EClamp2384P is in a 8-pin, RoHS/WEEE compliant, SLP2116P8 package. It measures 2.1 x 1.6 x 0.58mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPd. The small package makes it ideal for use in portable electronics such as cell phones, digital still cameras, and PDAs. EClamp2384P PRELIMINARY Features Bidirectional EMI/RFI filter with integrated TVS for ESD protection ESD protection to IEC 61000-4-2 (ESD) Level 4, ±15kV (air), ±8kV (contact) Filter performance: 30dB minimum attenuation 800MHz to 2.7GHz T VS working voltage: 5V Resistor: 200Ω +/− 15% Typical Capacitance: 12pF (VR = 2.5V) Protection and filtering for four lines Solid-state technology Mechanical Characteristics SLP2116P8 8-pin package RoHS/WEEE Compliant Nominal Dimensions: 2.1 x 1.6 x 0.58 mm Lead Pitch: 0.5mm Lead finish: NiPd Marking: Marking Code Packaging: Tape and Reel per EIA 481 Applications Color LCD Protection Cell Phone CCD Camera Lines Clamshell Cell Phones Circuit Diagram (Each Line) Package Configuration 2.10 12 200 Ω IN 12pF 12pF OUT 1.60 0.50 BSC GND 0.58 Device Schematic (4X) Revision 1/25/2006 8 Pin SLP package (Bottom Side View) Nominal Dimensions in mm 1 www.semtech.com EClamp2384P PROTECTION PRODUCTS Maximum Ratings R ating ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) Junction Temp erature Op erating Temp erature Storage Temp erature Symbol VESD TJ Top TSTG Value +/- 17 +/- 12 125 -40 to +85 -55 to +150 PRELIMINARY Units kV o C C C o o Electrical Characteristics (T = 25oC) P a r a met er T VS Reverse Stand-Of f Voltage T VS Reverse Breakdown Voltage T VS Reverse Leakage Current Total Series Resistance Capacitance Total Capacitance Symb ol VRWM VBR IR R C 1, C 2 C in C on d i t i on s Mi n i mu m Ty p i c a l M a xi m u m 5 Un i ts V V µA Ohms pF pF It = 1mA VRWM = 3.0V Each Line Each Line VR = 2.5V, f = 1MHz Input to Gnd, Each Line VR = 2.5V, f = 1MHz 6 8 10 0.5 170 10 20 200 12 24 230 15 30  2006 Semtech Corp. 2 www.semtech.com EClamp2384P PROTECTION PRODUCTS Typical Characteristics Typical Insertion Loss S21 (Each Line) CH1 S21 LOG 6 dB / REF 0 dB 1: -12.305 dB 106.6 MHz 0 dB -6 dB 1 PRELIMINARY Analog Crosstalk (Each Line) CH1 S 21 LOG 20 dB /REF 0 dB 2: -35.996 dB 800 MHz 3: -38.349 dB 1.8 GHz 4: -36.250 dB 2.7 GHz -12 dB -18 dB -24 dB -30 dB -36 dB 2 4 3 -42 dB -48 dB 1 MHz START . 030 MHz 10 MHz 100 MHz 3 1 GHz GHz STOP 3000. 000000 MHz S TART. 030 M Hz . STOP 3000 000000 M Hz ESD Clamping (+8kV Contact) ESD Clamping (-8kV Contact) Capacitance vs. Reverse Voltage (Normalized to 2.5 volts) 2 1.5 CJ(VR) / CJ(VR=0) 1 0.5 f = 1 MHz 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Reverse Voltage - VR (V)  2006 Semtech Corp. 3 www.semtech.com EClamp2384P PROTECTION PRODUCTS Device Connection The EClamp2384P is comprised of four identical circuits each consisting of a low pass filter for EMI/RFI suppression and dual TVS diodes for ESD protection. The device is in a 8-pin SLP package. Electrical connection is made to the 8 pins located at the bottom of the device. A center tab serves as the ground connection. The device has a flow through design for easy layout. Pin connections are noted in Figure 1. All path lengths should be kept as short as possible to minimize the effects of parasitic inductance in the board traces. Recommendations for the ground connection are given below. Ground Connection Recommendation Parasitic inductance present in the board layout will affect the filtering performance of the device. As frequency increases, the effect of the inductance becomes more dominant. This effect is given by Equation 1. Equation 1: The Impedance of an Inductor at Frequency XLF PRELIMINARY Figure 1 - Pin Identification and Configuration (Top Side View) In 1 In 2 In 3 In 4 1 8 Gnd 4 5 Out 1 Out 2 Out 3 Out 4 Pin 1-4 5-8 Center Tab Identification Inp ut Lines Outp ut Lines Ground XLF(L, f ) = 2 * π * f * L Where: L= Inductance (H) f = Frequency (Hz) Via connections to the ground plane form rectangular wire loops or ground loop inductance as shown in Figure 2. Ground loop inductance can be reduced by using multiple vias to make the connection to the ground plane. Bringing the ground plane closer to the signal layer (preferably the next layer) also reduces ground loop inductance. Multiple vias in the device ground pad will result in a lower inductive ground loop over two exterior vias. Vias with a diameter d are separated by a distance y run between layers separated by a distance x. The inductance of the loop path is given by Equation 2. Thus, decreasing distance x and y will reduce the loop inductance and result in better high frequency filter characteristics. Figure 2 - Inductance of Rectangular Wire Loops Ground Via 1 x Ground Via 2 d Signal Layer y Ground Layer Layer Equation 2: Inductance of Rectangular Wire Loop LRECT(d, x , y) = 10.16 *10 −9 * x * ln Where: d = Diameter of the wire (in) x = Length of wire loop (in) y = Breath of wire loop (in) [ [ ] + y * ln[ ]] 2*y d 2*x d  2006 Semtech Corp. 4 www.semtech.com EClamp2384P PROTECTION PRODUCTS Applications Information Figure 3 shows the recommended device layout. The ground pad vias have a diameter of 0.008 inches (0.20 mm) while the two external vias have a diameter of 0.010 inches (0.250mm). The internal vias are spaced approximately evenly from the center of the pad. The designer may choose to use more vias with a smaller diameter (such as 0.005 inches or 0.125mm) since changing the diameter of the via will result in little change in inductance (i.e. the log function in Equation 2 in highly insensitive to parameter d) . Figure 4 shows a typical insertion loss (S21) plot for the device using Semtech’s filter evaluation board with 50 Ohm traces and the recommended via configuration. PRELIMINARY Figure 4 - Filter Characteristics Using Recommended Layout with Internal Vias CH1 S21 LOG 6 dB / REF 0 dB 1: -12.305 dB 106.6 MHz 0 dB -6 dB 1 2: -35.996 dB 800 MHz 3: -38.349 dB 1.8 GHz 4: -36.250 dB 2.7 GHz -12 dB -18 dB -24 dB -30 dB -36 dB 2 4 3 -42 dB Figure 3 - Recommended Layout Using Ground Vias -48 dB 1 MHz START . 030 MHz 10 MHz 100 MHz 3 1 GHz GHz STOP 3 000. 000000 MHz  2006 Semtech Corp. 5 www.semtech.com EClamp2384P PROTECTION PRODUCTS Applications Information - Spice Model PRELIMINARY Line In 0.5nH 200 0.5nH Line Out EClamp2384P Spice Model Table 1 - EClamp2384P Spice Parameters Parameter IS BV VJ RS IB V CJO TT M N EG Unit Amp Volt Volt Ohm Amp Farad sec --eV D1 (T VS) 5.15E-15 7.53 0.75 0.426 1E-3 23E-12 2.541E-9 0.256 1.1 1.11 D2 (T VS) 5.15E-15 7.53 0.75 0.426 1E-3 23E-12 2.541E-9 0.256 1.1 1.11  2006 Semtech Corp. 6 www.semtech.com EClamp2384P PROTECTION PRODUCTS Outline Drawing - SLP2116P8 PRELIMINARY A D B DIM PIN 1 INDICATOR (LASER MARK) E A aaa C A2 D1 12 LxN E1 N e D/2 E/2 A1 C SEATING PLANE A A1 A2 b D D1 E E1 e L N aaa bbb .020 .023 .026 - .001 .002 (.006) .007 .010 .012 .079 .083 .087 .061 .067 .071 .059 .063 .067 .010 .016 .020 .020 BSC .011 .013 .015 6 .003 .004 DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX 0.50 0.58 0.65 0.00 .003 0.05 (0.15) 0.20 0.25 0.30 2.00 2.10 2.20 1.55 1.70 1.80 1.50 1.60 1.70 0.25 0.40 0.50 0.50 BSC 0.28 0.33 0.38 6 0.08 0.10 bxN bbb CAB NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - SLP2116P8 P X DIMENSIONS DIM B C F G P X Y Z INCHES .071 .060 .018 .035 .020 .012 .025 .085 MILLIMETERS 1.80 1.52 0.45 0.89 0.50 0.30 0.63 2.15 Z G F (C) Y B NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET.  2006 Semtech Corp. 7 www.semtech.com EClamp2384P PROTECTION PRODUCTS Marking PRELIMINARY Ordering Information Part Number Qty per Reel 3000 R eel Size 7 Inch PIN 1 INDICATOR 2384P EClamp 2384P.TCT EMIClamp and EClamp are marks of Semtech Corporation Tape and Reel Specification Pin 1 Location User Direction of feed Device Orientation in Tape A0 1.96 +/-0.05 mm B0 2.31 +/-0.05 mm K0 0.74 +/-0.05 mm Tape Width B, (Max) D 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) D1 E 1.750±.10 mm (.069±.004) F K (MAX) P 4.0±0.1 mm (.157±.004) P0 4.0±0.1 mm (.157±.004) P2 T(MAX) W 8.0 mm + 0.3 mm - 0.1 mm (.312±.012) 8 mm 4.2 mm (.165) 0.8 mm ±0.05 (.031) 3.5±0.05 mm (.138±.002) 2.4 mm (.094) 2.0±0.05mm (.079±.002) 0.4 mm (.016) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804  2006 Semtech Corp. 8 www.semtech.com