ECLAMP2410P.TCT

PROTECTION PROTECTION PRODUCTS - EMIClampTM Description The EClampTM2410P is a combination EMI filter and line termination device with integrated TVS diodes for use on Multimedia Card interfaces. This state-of-the-art device utilizes solid-state silicon-avalanche technology for superior clamping performance and DC electrical characteristics. They have been optimized for protection of T-Flash/MicroSD interfaces in cellular phones and other portable electronics. The device consists of six circuits that include series impedance matching resistors and pull up resistors as required by the SD specification. TVS diodes are included on each line for ESD protection. An additional TVS diode connection is included for protection of the voltage (Vdd) bus. Termination resistor value of 45 Ohms is included on the DAT0, DAT1, DAT2, DAT3, CMD, and CLK lines. Pull up resistors of 15k Ohms are included on DAT0, DAT1, DAT2, and CMD lines while a 50k Ohm pull up is inlcuded on the DAT3 line. These may be configured for devices operating in SD or SPI mode . The TVS diodes provide effective suppression of ESD voltages in excess of ±15kV (air discharge) and ±8kV (contact discharge) per IEC 61000-4-2, level 4. The EClamp2410P is in a 16-pin, RoHS/WEEE compliant, SLP4016P16 package. It measures 4.0 x 1.6 x 0.58mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPd. ESD Protection Device for T-Flash/MicroSD Interfaces PRELIMINARY Features Bidirectional EMI/RFI filtering and line termination with integrated ESD protection ESD protection to IEC 61000-4-2 (ESD) Level 4, ±15kV (air), ±8kV (contact) T VS working voltage: 5V Termination Resistors: 45Ω Pull Up Resistors: 15kΩ (3 each) and 50kΩ Typical Capacitance per Line: 12pF (VR = 2.5V) Protection and termination for six lines + Vdd Solid-state technology EClamp2410P Mechanical Characteristics SLP4016P16 16-pin package RoHS/WEEE Compliant Nominal Dimensions: 4.0 x 1.6 x 0.58 mm Lead Pitch: 0.5mm Lead finish: NiPd Marking: Marking Code Packaging: Tape and Reel per EIA 481 Applications T-Flash / MicroSD Interfaces MMC Interfaces CDMA, GSM, 3G Cell Phones Pin Configuration Package Configuration 4.00 12 D AT1 In D AT0 In C L K In R up1 Vd d C MD In D AT3 In D AT2 In 1 16 D AT1 O u t D AT0 O u t C LK Out R up3 R up2 C MD O u t D AT3 O u t D AT2 O u t 1.60 0.50 BSC 0.58 16 Pin SLP package (Bottom Side View) Nominal Dimensions in mm 1 www.semtech.com Pin Designation (Top View) Revision 07/20/2006 EClamp2410P PROTECTION PRODUCTS Pin Identification and Configuration Pin 1, 16 2, 15 3, 14 4 5 6, 11 7, 10 8, 9 12 13 Center tab PRELIMINARY Symbol DAT1 DAT0 Clock Rup1 Vdd CMD DAT3 DAT2 Rup2 Rup3 GND Identification Data line #1 input/output with pull-up resistor Data line #0 input/output with pull-up resistor Clock line Input/Output 15k Pull-up resistor from DAT1 & DAT2 Power Supply ESD Protection Command Line Input/Output Data line #3 input/output with pull-up resistor Data line #2 input/output with pull-up resistor 50k Pull-Up Resistor from DAT3 15k Pull-up resistor from DAT0 & CMD Ground connection 16 15 14 13 12 11 10 9 1 2345678 Pin Configuration (Top View) Schematics & Component Values Pin 4 Pin 12 Rup 15K Pin 1, 8 45 Ohms Pin 9, 16 Rup 50K Pin 7 45 Ohms Pin 10 DAT1, DAT2 DAT0, CMD Line DAT3 Pin 13 Pin 3 45 Ohms Pin 14 Pin 5 Rup 15K Pin 2, 6 45 Ohms Pin 11, 15 CLK  2006 Semtech Corp. Vdd 2 DAT0, CMD www.semtech.com EClamp2410P PROTECTION PRODUCTS Maximum Ratings Rating ESD per IEC61000-4-2 (Air) ESD per IEC61000-4-2 (Contact) Operating Temperature Storage Temperature Symbol VESD TJ TSTG Value +/- 17 +/- 12kV -40 to +85 -55 to +150 PRELIMINARY Units kV o o C C Electrical Characteristics (T = 25oC) Parameter TVS Reverse Stand-Off Voltage TVS Reverse Breakdown Voltage TVS Reverse Leakage Current Series Resistors DAT Pull Up Resistor 1 DAT Pull Up Resistor 2 Total Capacitance S ymbol VRWM VBR IR R Rup1 Rup2 Cin Conditions Minimum Typical Maximum 5 Units V V µA Ohms k Ohms k Ohms pF It = 1mA VRWM = 3.0V Each Line 6 8 10 0.5 38 12 42 45 15 50 12 52 17 58 15 Input to Gnd, Each Line VR = 2.5V, f = 1MHz 10  2006 Semtech Corp. 3 www.semtech.com EClamp2410P PROTECTION PRODUCTS Typical Characteristics Typical Insertion Loss S21 (Each Line) CH1 21 LOG S 6 dB /REF 0 dB 1: -6.145 dB 300 MHz 0 dB -6 dB 1 PRELIMINARY ESD Clamping (+8kV Contact) 2: -14.437 dB 900 MHz 3: -23.847 dB 1.8 GHz 2 -12 dB -18 dB -24 dB 3 4: -32.024 dB 2.5 GHz 4 -30 dB -36 dB -42 dB -48 dB 1 MHz . START030MHz 10 MHz 100 MHz 3 1 GHz GHz .0 STOP3000000 00MHz Normalized Capacitance vs. Reverse Voltage 1.2 f = 1 MHz 50 49 Series Resistance (Ohm) Series Resistance vs. Temperature 1 CJ(VR) / CJ(VR=2.5) 48 47 46 45 44 43 42 41 0.8 0.6 0.4 0.2 0 0 1 2 3 Reverse Voltage - VR (V) 4 5 40 -40 -25 -10 5 20 35 0 Temperature ( C) 50 65 80 Pull Up Resistance (Rup1) vs. Temperature 16200 Pull Up Resistance (Rup2) vs. Temperature 58000 57000 Pull Up Resistance (Ohm) 16100 Pull Up Resistance (Ohm) 16000 15900 15800 15700 15600 15500 15400 15300 15200 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 56000 55000 54000 53000 52000 51000 50000 49000 48000 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature ( C) o Temperature ( C) o  2006 Semtech Corp. 4 www.semtech.com EClamp2410P PROTECTION PRODUCTS Applications Information Device Connection The EClamp2410P is a microSD/T-Flash interface device designed for use in cell phones and other portable electronic devices. The EClamp2410P is comprised of series and pull up resistors required on the microSD interface. Each line also includes TVS diodes for ESD protection. The device may be configured for SD or SPI mode operation. In SD mode for example, the 15k Ohm pull up resistors (Rup 1 and Rup 3) are connected to VDD. In SPI mode pin 4 is not connected (Rup 1) since these are reserved lines. The 50k Ohm pull up resistor is used for card detection or SPI mode selection during power up and is disconnected by the user during regular data transfer. The EClamp2410P is in a 16-pin SLP package. Electrical connection is made to the 16 pins located at the bottom of the device. The device has a flow through design for easy layout. Pin connections are noted in Figure 1. A center tab serves as the ground connection. Recommendations for the ground connection are given below. Ground Connection Recommendation Parasitic inductance present in the board layout will affect the filtering and ESD performance of the device. Ground loop inductance can be reduced by using multiple vias to make the connection to the ground plane. Figure 2 shows the recommended device layout. The ground pad vias have a diameter of 0.008 inches (0.20 mm) while the two external vias have a diameter of 0.010 inches (0.250mm). The internal vias are spaced approximately evenly from the center of the pad. The designer may choose to use more vias with a smaller diameter (such as 0.005 inches or 0.125mm) since changing the diameter of the via will result in little change in inductance. Layout Guidelines for Optimum ESD Protection Good circuit board layout is critical not only for signal integrity, but also for effective suppression of ESD induced transients. For optimum ESD protection, the following guidelines are recommended: Place the device as close to the connector as possible. This practice restricts ESD coupling into adjacent traces and reduces parasitic inductance. The ESD transient return path to ground should be kept as short as possible. Whenever possible, use multiple micro vias connected directly from the device ground pad to the ground plane. Avoid running critical signals near board edges.  2006 Semtech Corp. 5 www.semtech.com PRELIMINARY Figure 1 - Pin Identification and Configuration (Top Side View) D AT1 In D AT0 In C L K In R up1 Vd d C MD In D AT3 In D AT2 In 1 16 D AT1 O u t D AT0 O u t C LK Out R up3 R up2 C MD O u t D AT3 O u t D AT2 O u t Figure 2 - Recommended Layout using Ground Vias EClamp2410P PROTECTION PRODUCTS Applications Information PRELIMINARY DAT 1 IN DAT 1 OUT DAT 0 OUT CLK OUT Rup 15KΩ Rup 50KΩ CMD OUT DAT 3 OUT DAT 2 OUT MicroSD Connector DAT 0 IN CLK IN Rup 15KΩ VDD CMD IN DAT 3 IN DAT 2 IN Host IC EClamp2410P Figure 3 - MicroSD Protection  2006 Semtech Corp. 6 www.semtech.com EClamp2410P PROTECTION PRODUCTS Applications Information - Spice Model Pin 4, 13 Rup 15K Pin 1, 8, 2, 6 R1 45 Ohms Pin 9, 16, 11, 15 Pin 7 R1 45 Ohms Pin 12 PRELIMINARY Rup 50K Pin 10 DAT1, DAT2, DAT0, CMD Pin 3 R1 45 Ohms Pin 14 DAT3 Pin 5 CLK Spice Model EClamp2410P Spice Parameters Parameter IS BV VJ RS IBV CJO TT M N EG  2006 Semtech Corp. VDD Unit Amp Volt Volt Ohm Amp Farad sec --eV 7 D1 (TVS) 2E-15 7.46 0.777 1.00 1E-3 10E-12 2.541E-9 0.246 1.1 1.11 www.semtech.com EClamp2410P PROTECTION PRODUCTS Outline Drawing - SLP4016P16 PRELIMINARY A D B DIM PIN 1 INDICATOR (LASER MARK) E A aaa C A2 D1 12 LxN E1 N e D/2 E/2 A1 C SEATING PLANE A A1 A2 b D D1 E E1 e L N aaa bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .020 .023 .026 0.50 0.58 0.65 .000 .001 .002 0.00 .003 0.05 (0. 13) (. 005) .007 .010 .012 0.20 0.25 0.30 .153 .157 .161 3.90 4.00 4.10 .122 .126 .130 3.10 3.20 3.30 .059 .063 .067 1.50 1.60 1.70 .010 .016 .020 0.25 0.40 0.50 .020 BSC 0.50 BSC .011 .013 .015 0.28 0.33 0.38 16 16 .003 0.08 .004 0.10 bxN bbb CAB NOT ES: 1. CO NTRO LLING DI MENSIO NS ARE I N MILLI METERS (ANG LES IN DEG REES). 2. CO PLANARIT Y APPLIES T O T HE EXPO SED PAD AS W ELL AS T HE TERM INALS. Land Pattern - SLP4016P16 P X DIM B C F G P X Y Z DIMENSIONS INCHES MILLIMETERS .130 3.30 .060 1.52 .018 0.45 .035 0.89 .020 0.50 .012 0.30 .025 0.63 .085 2.15 Z G F (C) Y B NOTES: 1. T HI S LAND PAT TERN IS F O R REF ERENCE PURPO SES O NLY. CO NSULT YO UR M ANUFACTURING G RO UP T O ENSURE YO UR CO MPANY'S M ANUFACTURING G UIDELINES ARE MET.  2006 Semtech Corp. 8 www.semtech.com EClamp2410P PROTECTION PRODUCTS Marking PRELIMINARY Ordering Information Part Number Qty per Reel 3,000 Reel Size 7 inch EClamp2410P.TCT PIN 1 IND IC ATOR (LASER MAR K) 2410P YW EMIClamp and EClamp are marks of Semtech Corporation Tape and Reel Specification Pin 1 Location User Direction of feed Device Orientation in Tape A0 1.78 +/-0.10 mm B0 4.30 +/-0.10 mm K0 0.74 +/-0.10 mm Tape Width B, (Max) D 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) D1 E 1.750±.10 mm (.069±.004) F K (MAX) P 4.0±0.1 mm (.157±.004) P0 4.0±0.1 mm (.157±.004) P2 T(MAX) W 12.0 mm + 0.3 mm - 0.1 mm (.472±.012) 12 mm 8.2 mm (.476) 1.0 mm ±0.05 (.039) 5.5±0.05 mm (.217±.002) 4.5 mm (.177) 2.0±0.05mm (.079±.002) 0.4 mm (.016) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804  2006 Semtech Corp. 9 www.semtech.com