PROTECTION PROTECTION PRODUCTS - EMIClampTM Description
The EClamp 2422N is a (C-L-C) low pass filter array with integrated TVS diodes. It is designed to suppress unwanted EMI/RFI signals and provide electrostatic discharge (ESD) protection in portable electronic equipment. This state-of-the-art device utilizes solidstate silicon-avalanche technology for superior clamping performance and DC electrical characteristics. It has been optimized for protection of headset audio ports in cellular phones and other portable electronics.
TM
ESD/EMI Protection for Audio Interfaces
PRELIMINARY Features
Bidirectional EMI/RFI filter with integrated TVS for ESD protection
ESD protection to IEC 61000-4-2 (ESD) Level 4, ±15kV (air), ±8kV (contact) T VS working voltage: 5V Inductor: 2nH (Typical) Capacitors: 100pF (Typical at VR = 0V) Protection and filtering for two lines Solid-state technology
EClamp2422N
The device consists of two identical circuits comprised of TVS diodes for ESD protection, and a C-L-C pi-filter for EMI/RFI filtering. A typical inductor value of 2nH and a capacitor value of 100pF are used to achieve 20dB minimum attenuation from 800MHz to 2.7GHz. It has a very low series resistance of 2 Ohms, making it ideal for use on headset speaker interfaces. The TVS diodes provide effective suppression of ESD voltages in excess of ±15kV (air discharge) and ±8kV (contact discharge) per IEC 61000-4-2, level 4. The EClamp2422N is in a 6-pin, RoHS/WEEE compliant, SLP1510N6 package. It measures 1.45 x 1.0 x 0.58mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPdAu. The small package makes it ideal for use in portable electronics.
Mechanical Characteristics
SLP1510N6 6-pin package RoHS/WEEE Compliant Nominal Dimensions: 1.45 x 1.0 x 0.58 mm Lead Pitch: 0.5mm Lead finish: NiPdAu Marking: Marking Code Packaging: Tape and Reel per EIA 481
Applications
Cellular Handsets Speaker Ports in Portables Notebook Computers
Circuit Diagram (Each Line)
Package Configuration
L1
1
1.45
IN
C C
OUT
1.00
0.50
GND
0.58
Device Schematic (2X)
Revision 04/25/2007
SLP1510N6 package (Bottom Side View) Nominal Dimensions in mm
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EClamp2422N
PROTECTION PRODUCTS Maximum Ratings
R ating ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) Junction Temp erature Op erating Temp erature Storage Temp erature Symbol VESD TJ Top TSTG Value +/- 20 +/- 15 125 -40 to +85 -55 to +150
PRELIMINARY
Units kV
o
C C C
o
o
Electrical Characteristics (T=25oC)
P ar am et er T VS Reverse Stand-Off Voltage T VS Reverse Breakdown Voltage T VS Reverse Leakage Current Equivalent Series Resistance Inductance Cap acitance Total Cap acitance
S y m b ol VRWM V BR IR RDC L C1 , C2 C1 + C2
Con d i t i on s
Mi n i mu m
Ty p i c a l
M ax i m u m 5
Units V V μA Ohms nH pF pF
It = 1mA VRWM = 3.3V
6
8 0.001 1.4 2
10 0.1 2 3 115 230
VR = 0V, f = 1MHz Inp ut to Gnd, Each Line VR = 0V, f = 1MHz
85
100 210
© 2007 Semtech Corp.
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EClamp2422N
PROTECTION PRODUCTS Typical Characteristics
Typical Insertion Loss S21 (Each Line)
CH1 S21 LOG 6 dB / REF 0 dB 1: -21.107 dB 900 MHz 2: -14.439 dB 1.8 GHz 3: -13.193 dB 2.5 GHz
1 2
PRELIMINARY
Analog Crosstalk (Each Line)
CH1 S21 LOG 20 dB /REF 0 dB
0 dB -6 dB -12 dB -18 dB
3
-24 dB -30 dB -36 dB -42 dB -48 dB 1 MHz START . 030 MHz 10 MHz 100 MHz 3 1 GHz GHz STOP 3 000. 000000 MHz START . 030 MHz STOP 3 000. 000000 MHz
ESD Clamping (+8kV Contact)
ESD Clamping (-8kV Contact)
Note: Data is taken with a 10x attenuator
Note: Data is taken with a 10x attenuator
Normalized Capacitance vs. Reverse Voltage
1.05 1.04 1.03 CJ(VR) / CJ(VR=0)) 1.02 1.01 1 0.99 0.98 0.97 0.96 0.95 0 1 2 3 Reverse Voltage - VR (V) 4 5
Clamping Voltage - VC (V)
16
Clamping Voltage vs. Peak Pulse Current
f = 1 MHz
14 12 10 8 6 4 2 0 0 1 2 3 4 5 6 7
Waveform Parameters: tr = 8µs td = 20µs
Peak Pulse Current - IPP (A)
© 2007 Semtech Corp.
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EClamp2422N
PROTECTION PRODUCTS Applications Information
Device Connection The EClamp2422N provides EMI filtering and ESD protection in a small SLP1510N6 package for speaker port applications. The equivalent circuit diagram is shown in Figure 1. The layout of the device is designed such that the data lines can be routed through the device. The first line pair enters at pin 1 and exits at pin 6. The second line pair enters at pin 2 and exits at pin 5. The device is symmetrical so the above connections may be reversed. Ground connection is made at pins 3 and 4. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Figure 2 - Pin Identification and Configuration (Top Side View)
PRELIMINARY
Figure 1 -Circuit Diagram (Each Line)
L1
IN
C C
OUT
GND
Line In 1 Line In GND
6
Line Out Line Out GND
Pin 1, 2 5, 6 3, 4
Identification Input Lines from Speaker Output Lines to Audio Ckt Ground
© 2007 Semtech Corp.
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EClamp2422N
PROTECTION PRODUCTS Applications Information PRELIMINARY
Vin +
EClamp2422N
Vin -
Differential Mode Protection with Speaker Output
V2
EClamp2422N
V1
Protection of Two Single-Ended Mode Speakers
© 2007 Semtech Corp.
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EClamp2422N
PROTECTION PRODUCTS Applications Information PRELIMINARY
Vout +
EClamp2422N
Vout -
Differential Mode Protection with Microphone Input
V2
EClamp2422N
V1
Protection of Single-Ended Mode Microphone and Speaker Output
© 2007 Semtech Corp.
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EClamp2422N
PROTECTION PRODUCTS Applications Information - Spice Model PRELIMINARY
Line In
L1
2nH
Line Out
EClamp2422N Spice Model
Table 1 - EClamp2422N Spice Parameters Parameter IS BV VJ RS IB V CJO TT M N EG Unit Amp Volt Volt Ohm Amp Farad sec --eV D1 (T VS) 4.09-15 7.7 0.7 0.416 1E-3 210E-12 2.541E-9 0.01 1.1 1.11 D2 (T VS) 4.09E-15 7.7 0.7 0.416 1E-3 210E-12 2.541E-9 0.01 1.1 1.11
© 2007 Semtech Corp.
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EClamp2422N
PROTECTION PRODUCTS Outline Drawing - SLP1510N6 PRELIMINARY
A
D
B
PIN 1 INDICATOR (LASER MARK)
E
DIM
A A1 A2 b D E e L N aaa bbb
DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX
.020 .023 .026 0.00 .001 .002 (.005) .008 .010 .012 .053 .057 .061 .035 .039 .043 .020 BSC .012 .015 .017 6 .003 .004 0.50 0.58 0.65 0.00 0.03 0.05 (0.13) 0.20 0.25 0.30 1.35 1.45 1.55 0.90 1.00 1.10 0.50 BSC 0.30 0.38 0.425 6 0.08 0.10
A aaa C A2 D/2 1 E/2 2 LxN A1 C
SEATING PLANE
N e
bxN bbb CAB
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES)
Land Pattern - SLP1510N6
P
DIMENSIONS DIM C G P X Y Z INCHES (.034) .008 .020 .010 .027 .061 MILLIMETERS (0.875) 0.20 0.50 0.25 0.675 1.55
(C) G Y
Z
X
NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET.
© 2007 Semtech Corp.
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EClamp2422N
PROTECTION PRODUCTS Marking PRELIMINARY Ordering Information
Part Number EClamp2422N.TCT Qty per Reel 3000 Reel Size 7 Inch
2422N
EMIClamp and EClamp are marks of Semtech Corporation
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
A0 1.24±0.05mm B0 1.70±0.05mm K0 0.76±0.05mm
Tape Width
B, (Max)
D 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000)
D1
E 1.750±.10 mm (.069±.004)
F
K (MAX)
P 4.0±0.1 mm (.157±.004)
P0 4.0±0.1 mm (.157±.004)
P2
T(MAX)
W 8.0 mm + 0.3 mm - 0.1 mm (.312±.012)
8 mm
4.2 mm (.165)
0.8 mm ±0.05 (.031)
3.5±0.05 mm (.138±.002)
2.4 mm (.094)
2.0±0.05mm (.079±.002)
0.4 mm (.016)
Contact Information
Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804
© 2007 Semtech Corp. 9 www.semtech.com
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