EDGE118

Edge118 Low Skew Clock Spreader EDGE HIGH-PERFORMANCE PRODUCTS Description The Edge118 is a fully differential 1:18 clock spreader. Manufactured in a high performance bipolar process, the Edge118 is designed to accurately fan out a multitude of clock signals with low channel to channel skew. Features • Low Timing Error vs. Duty Cycle & Frequency • Low Channel to Channel Skew • Small Footprint (64 MQFP Package, 14 mm X 14 mm Body) Functional Block Diagram OUT / OUT* 0 OUT / OUT* 1 OUT / OUT* 2 OUT / OUT* 3 OUT / OUT* 4 OUT / OUT* 5 OUT / OUT* 6 OUT / OUT* 7 OUT / OUT* 8 IN / IN* OUT / OUT* 9 OUT / OUT* 10 OUT / OUT* 11 OUT / OUT* 12 OUT / OUT* 13 OUT / OUT* 14 OUT / OUT* 15 OUT / OUT* 16 OUT / OUT* 17 Applications • Test Equipment Revision 1/August 15, 2000 1 www.semtech.com Edge118 EDGE HIGH-PERFORMANCE PRODUCTS PIN Description Pin Name IN, IN* OUT0, OUT0* OUT1, OUT1* OUT2, OUT2* OUT3, OUT3* OUT4, OUT4* OUT5, OUT5* OUT6, OUT6* OUT7, OUT7* OUT8, OUT8* OUT9, OUT9* OUT10, OUT10* OUT11, OUT11* OUT12, OUT12* OUT13, OUT13* OUT14, OUT14* OUT15, OUT15* OUT16, OUT16* OUT17, OUT17* Power Supplies GND Pin # 6, 8 1, 3 63, 61 58, 60 57, 55 52, 54 51, 49 45, 47 44, 42 39, 41 38, 36 33, 35 31, 29 26, 28 25, 23 20, 22 19, 17 13, 15 12, 10 Description Differential input signal. Differential ECL output signals. 2, 7, 11, 14, 18, 21, 24, 27, 30, 34, 37, 40, 43, 46, 50, 53, 56, 59, 62 Positive Power Supply VEE 9, 16, 32, 48, 64 Negative Power Supply TDP TDN , 4, 5 Thermal Diode Connections  2000 Semtech Corp. 2 www.semtech.com Edge118 EDGE HIGH-PERFORMANCE PRODUCTS PIN Description (continued) OUT1* OUT2* GND OUT2 OUT3 GND OUT3* OUT4* GND OUT4 OUT5 64 OUT0 GND OUT0* TDP TDN IN GND IN* VEE OUT17* GND OUT17 OUT16 GND OUT16* VEE 17 1 GND OUT5* 49 VEE OUT6* GND OUT6 OUT7 GND OUT7* OUT8* GND OUT8 OUT9 GND OUT9* OUT10* 33 GND OUT10 OUT15* GND OUT15 VEE OUT1 GND OUT14 GND OUT14* OUT13* GND OUT13 OUT12 GND OUT12* OUT11* GND 3  2000 Semtech Corp. OUT11 VEE www.semtech.com Edge118 EDGE HIGH-PERFORMANCE PRODUCTS Circuit Description Chip Overview The Edge118 is a clock distribution chip designed to take one input signal (IN / IN*) and fan it out 18 times to identical outputs (OUT / OUT*). The chip is designed to minimize channel to channel skew and any timing jitter. The part’s wide fanout is extremely useful in applications where many distinct copies of a signal are required on one PC Board, and these signals must all be aligned. This signal can be distributed without creating a distribution tree using multiple devices. OUT 0 OUT 0* OUT 1 OUT 1* OUT 2 OUT 2* OUT 3 OUT 3* OUT 4 OUT 4* OUT 5 OUT 5* OUT 6 OUT 6* OUT 7 OUT 7* OUT 8 OUT 8* OUT 9 OUT 9* OUT 10 OUT 10* OUT 11 OUT 11* OUT 12 OUT 12* OUT 13 OUT 13* OUT 14 OUT 14* OUT 15 OUT 15* OUT 16 OUT 16* OUT 17 OUT 17* Inputs The input signal is differential, requiring 250 mV swings for full performance operation. The inputs are ECL compatible, but may also be operated over a common mode voltage range between VEE + 1.3V and VCC – .5V. Outputs The outputs are ECL compatible differential signals with 800 mV voltage swings centered around 1.3V below GND. IN IN* Operating Frequency The Edge118 is designed to maintain full performance up to at least 1000 MHz and pass 500 ps pulses.  2000 Semtech Corp. 4 www.semtech.com Edge118 EDGE HIGH-PERFORMANCE PRODUCTS Application Information Power Supplies Decoupling A .1 µF or .01 µF capacitor (with excellent high frequency characteristics, is recommended between GND and VEE. In addition, solid GND and VEE planes are recommended to provide a low inductance path for the power supply currents. Output Terminations For optimal results, all output pairs (used or unused) should be terminated, and terminated in the same manner. Thermal Information Parameter Thermal Resistance (300 LFM, par t soldered to a PC Board) Junction to Air Symbol Value Units θJA ~25 ˚C/W  2000 Semtech Corp. 5 www.semtech.com Edge118 EDGE HIGH-PERFORMANCE PRODUCTS Package Information Top View 4 4X 0.25 C A – B D PIN Descriptions D D2 3 –A– e SEE DETAIL "A" Bottom View 2 5 7 4X 5 7 D1 0.20 C A – B D COO ZD  2000 Semtech Corp. 6 www.semtech.com Edge118 EDGE HIGH-PERFORMANCE PRODUCTS Package Information (continued) 0.40 MIN. 0 MIN. ˚ e/2 A2 – 0.10 S 0.13 R. MIN. 0.13 / 0.30 R. –A, B, D– 3 C 0.25 GAGE PLANE DETAIL "A" A1 L 1.60 REF. C 0–7 ˚ DETAIL "B" 12 – 16 ˚ A SEE DETAIL "B" b 8 ccc M C A–B S D S WITH LEAD FINISH 1.41 REF. H 2 0.076 12 0.13 / 0.23 0.13 / 0.17 C 12 – 16 ˚ SECTION C-C b 1 BASE METAL Notes: 1. All dimensions and tolerances conform to ANSI Y14.5-1982. 2. Datum plane -H- located at mold parting line and coincident with lead, where lead exits plastic body at bottom of parting line. 3. Datums A-B and -D- to be determined at centerline between leads where leads exit plastic body at datum plane -H-. 4. To be determined at seating plane -C-. 5. Dimensions D1 and E1 do not include mold protrusion. Allowable mold protrusion is 0.254 mm per side. Dimensions D1 and E1 do include mold mismatch and are determined at datum plane -H.-. 6. N” is the total # of terminals. 7. Package top dimensions are smaller than bottom dimensions by 0.20 mm, and top of package will not overhang bottom of package. 8. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius or the foot. 9. All dimensions are in millimeters. 10. Maximum allowable die thickness to be assembled in this package family is 0.635 millimeters. 11. This drawing conforms to JEDEC registered outlines MO-108 and MS-022. 12. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip. JEDEC Variation All Dimensions in Millimeters AC Min. A A1 A2 D D1 D2 Z0 E E1 E2 ZE L N e b b1 ccc 0.30 0.30 0.35 0.16 0.73 0.10 2.55 Nom. 2.82 0.15 2.67 17.20 BSC. 14.00 BSC. 12.00 BSC. 1.00 REF. 17.20 BSC. 14.00 BSC. 12.00 BSC. 1.00 REF. .088 64 0.80 BSC. 0.45 0.40 1.03 6 4 5 Max. 3.00 0.25 2.75 4 5 Note  2000 Semtech Corp. 7 www.semtech.com Edge118 EDGE HIGH-PERFORMANCE PRODUCTS Recommended Operating Conditions Parameter Symbol Min Typ Max Units Positive Analog Power Supply GND 0 0 0 V Negative Analog Power Supply VEE – 5.5 – 4.2 V Junction Temperature TJ +125 ˚C Absolute Maximum Ratings Parameter Total Analog Power Supply Digital Inputs Ambient Operating Temperature Storage Temperature Junction Temperature Soldering Temperature TJ Symbol GND – VEE IN / IN* TA – 55 – 65 Min – 7.0 VEE – .5 Typ Max 0 GND + .5 +125 +150 +150 260 Units V V ˚C ˚C ˚C ˚C Stresses above listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.  2000 Semtech Corp. 8 www.semtech.com Edge118 EDGE HIGH-PERFORMANCE PRODUCTS DC Characteristics Parameter IN / IN* Input Input Input Input High Voltage Low Voltage Bias Current Common Mode Range Symbol Min Typ Max Units IN – IN* IN* – IN Iin IN, IN* 200 200 – 250 VEE + 1.3 250 GND – .5 mV mV µA V OUT / OUT* Output Output Output Output Current High Voltage Low Voltage Common Mode Range Iout DC OUT – OUT* OUT* – OUT OUT – OUT* 2 600 600 – 1.5 800 800 – 1.3 mV mV V – 1.1 Supply Current 225 275 325 mA  2000 Semtech Corp. 9 www.semtech.com Edge118 EDGE HIGH-PERFORMANCE PRODUCTS AC Characteristics Parameter Propagation Delay IN / IN* to OUT / OUT* (Notes 1, 5) Channel-to-Channel Skew (Note 6) Maximum Operating Frequency (Notes 1, 2, 3, 4) Minimum Pulse Width (Notes 1, 2, 3, 4) Output Rise and Fall Times (Notes 1, 4) 20% - 80%, 50Ω Load 10% - 90%, 50Ω Load Jitter (Notes 1, 4) Peak-to-Peak ∆Tpd vs. Duty Cycle, T = 100 ns (Notes 1, 4) 3.0%