EDGE819

Edge819 Octal, 18V Pin Electronics Driver TEST AND MEASUREMENT PRODUCTS Description The Edge819 is an octal pin electronics driver fabricated in a wide voltage CMOS process. It is designed specifically for Test During Burn In (TDBI) applications, where cost, functional density, and power are all at a premium. The Edge819 incorporates eight channels of programmable drivers into one 14 mm X 20 mm 100 pin MQFP package. Each channel has per pin driver levels, data, and high impedance control. The Edge819 uses "Flex In" digital inputs and, therefore, can mate directly with any digital technology. Features • • • • • 18V I/O Range 50 MHz Operation Per Pin Flexibility Flex In Digital Inputs Small footprint (100 pin MQFP) Applications The Edge819 is pin and functionally compatible with the Edge818, except the Edge819 does not have any comparators. The 18V driver output range allows the Edge819 to interface directly with TTL, ECL, CMOS (3.3V and 5V), LVCMOS, and custom level circuitry, as well as the high voltage (Super Voltage) level required for many special test modes for Flash Devices. • Burn In ATE • Low Cost ATE • Instrumentation Functional Block Diagram VH VL DATA EN* 8 8 8 DOUT Revision 2 / August 16, 2004 1 www .semtech.com Edge819 TEST AND MEASUREMENT PRODUCTS PIN Description Pin Name DATA ( 0:7) Pin # 100, 4, 8, 12, 19, 23, 27, 31 Description Dig it al input s w hic h det er mine t he hig h/ low st at e of t he driv er w hen it is enabled. Dig it al input s w hic h enable/ disable t he driv er. No c onnec t . EN* ( 0:7) N/ C 3, 7, 11, 15, 16, 20, 24, 28 1, 5, 9, 13, 18, 22, 26, 30, 2, 6, 10, 14, 17, 21, 25, 29 79, 75, 71, 67, 64, 60, 56, 52 DOUT ( 0:7) Driv er out put s. N/ C V H ( 0:7) 81, 77, 73, 69, 62, 58, 54, 50 80, 76, 72, 68, 63, 59, 55, 51 No c onnec t . Unbuffered analog input s t hat set t he driv er "hig h" v olt ag e lev el. Unbuffered analog input s t hat set t he driv er "low " v olt ag e lev el. No c onnec t . V L ( 0:7) 78, 74, 70, 66, 65, 61, 57, 53 N/ C 97, 95, 89, 87, 44, 42, 36, 34 N/ C VBB 96, 94, 88, 86, 45, 43, 37, 35 46, 85 No c onnec t . A nalog input v olt ag e t hat set s t he t hreshold for t he dig it al input s. No c onnec t . N/ C 33, 98 N/ C 32, 99 No c onnec t . VCC 40, 41, 47, 49, 82, 84, 90, 91 P osit iv e pow er supply. V EE 38, 39, 48, 83, 92, 93 Neg at iv e pow er supply.  2004 Semtech Corp. / Rev. 2, 8/16/04 2 www .semtech.com Edge819 TEST AND MEASUREMENT PRODUCTS PIN Description (continued) N/C N/C EN*0 DATA1 N/C N/C EN*1 DATA2 N/C N/C EN*2 DATA3 N/C N/C EN*3 EN*4 N/C N/C DATA4 EN*5 N/C N/C DATA5 EN*6 N/C N/C DATA6 EN*7 N/C N/C 1 DATA0 N/C N/C N/C N/C N/C N/C VEE VEE VCC VCC N/C N/C N/C N/C VBB VCC VEE VCC N/C 81 VH0 DOUT0 VL0 N/C VH1 DOUT1 VL1 N/C VH2 DOUT2 VL2 N/C VH3 DOUT3 VL3 VL4 DOUT4 VH4 N/C VL5 DOUT5 VH5 N/C VL6 DOUT6 VH6 N/C VL7 DOUT7 VH7 100 Lead – 14 X 20 MQFP 51 31  2004 Semtech Corp. / Rev. 2, 8/16/04 DATA7 N/C N/C N/C N/C N/C N/C VEE VEE VCC VCC N/C N/C N/C N/C VBB VCC VEE VCC N/C 3 www .semtech.com Edge819 TEST AND MEASUREMENT PRODUCTS Circuit Description Driver Description The Edge819 supports programmable high and low levels and tristate per channel. There are no shared lines between any drivers. The EN* and DATA signals are wide voltage high impedance analog inputs capable of receiving digital signals over a wide common mode range. VBB is the high impedance analog input which sets the threshold for EN* and DATA. EN*, DATA > VBB < VBB Status "1" "0" Driver High and Low VH and VL define the logical "1" and "0" levels of the driver, and can be adjusted anywhere over the range determined by VCC and VEE. There are no restrictions between VH and VL, other than they must remain within the power supply levels. VEE ≤ VEE ≤ VH ≤ VCC VL ≤ VCC Driver Output Protection In a functional testing environment, where a resistor is added in series with the driver output to create a 50Ω driver, the Edge819 can withstand a short to any legal voltage for an indefinite amount of time. In a low impedance application, with no additional output resistance, the system should be designed to check for a short circuit prior to connecting the driver, and tristate the driver if a short is detected. With EN* high, the driver goes into a high impedance state. With EN* low, DATA high forces the driver into a high state, and DATA low forces the driver into a low state. EN* 1 0 0 DATA X 1 0 DOUT HiZ VH VL  2004 Semtech Corp. / Rev. 2, 8/16/04 4 www .semtech.com Edge819 TEST AND MEASUREMENT PRODUCTS Application Information Power Supply Decoupling VCC and VEE should be decoupled to GND with a .1 µF chip capacitor in parallel with a .001 µF chip capacitor. A VCC and VEE plane, or at least a solid power bus, is recommended for optimal performance. VH and VL Decoupling As the VH and VL inputs are unbuffered and supply the driver output current, which can be quite large during edge transitions, decoupling capacitors for these inputs are recommended in proportion to the amount of output current requirements. For applications where VH and VL are shared over multiple channels, a solid power plane to distribute these levels is preferred. VBB The two VBB pins are connected together on-chip. Therefore, only one VBB needs to be connected to for proper 819 operation. The two pins may be used to daisy chain a VBB signal across a PC Board without having to route the actual signal underneath the 819. Power Supplies The Edge819 has several power supply requirements to protect the part in power supply fault situations, as well as during power up and power down sequences. The following power supply requirements must be satisifed at all times: VEE ≤ All I/O Pins ≤ VCC at all times The power sequence below can be used as a guideline when operating the Edge819: Power-On Sequencing 1. VCC (Substrate) 2. VEE 3. I/O Pins Power-Off Sequencing 1. I/O Pins 2. VEE 3. VCC External Logic Supply VDD 1N5820 or Equivalent The three diode configuration shown in Figure 1 should be used on a once-per-board basis. VCC External System Ground VEE Figure 1. Power Supply Protection Scheme Warning: It is extremely important that the voltage on any device pin does not exceed the range of VEE –0.5V to VCC +0.5V at any time, either during power up, normal operation, or during power down. Failure to adhere to this requirement could result in latchup of the device, which could be destructive if the system power supplies are capable of supplying large amounts of current. Even if the device is not immediately destroyed, the cumulative damage caused by the stress of repeated latchup may affect device reliability.  2004 Semtech Corp. / Rev. 2, 8/16/04 5 www .semtech.com Edge819 TEST AND MEASUREMENT PRODUCTS Package Information 100-Pin MQFP 14 mm x 20 mm PIN Descriptions 4 D D2 Z D –D– 3 4X 0.25 C A–B D 3 e –A– –B– 3 E2 –E– 4 Z E SEE DETAIL "A" TOP VIEW 2 4X 5 7 0.20 C A–B 5 D1 D 7 5 7 E1 O O BOTTOM VIEW  2004 Semtech Corp. / Rev. 2, 8/16/04 6 www .semtech.com C Edge819 TEST AND MEASUREMENT PRODUCTS Package Information (continued) 0.40 MIN. 0 MIN. ˚ e/2 A2 – 0.10 S 0.13 / 0.30 R. TYP. 0.13 R. MIN. GAGE PLANE –A, B, D– 3 C C A1 L 1.60 REF. 0.25 DETAIL "A" 0–7 BASE PLANE ˚ SEATING PLANE DETAIL "B" 12 – 16 1.28 REF. ˚ SEE DETAIL "B" A B –H– 2 0.076 –C– 12 0.13 / 0.23 8 ccc M C A–B S D S WITH LEAD FINISH 0.13 / 0.17 12 – 16 ˚ SECTION C–C B 1 BASE METAL Variations (all dimensions in millimeters) Notes: 1. All dimensions and tolerances conform to ANSI Y14.5-1982. 2. Datum plane -H- located at mold parting line and coincident with lead, where lead exits plastic body at bottom of parting line. 3. Datums A-B and -D- to be determined where centerline between leads exits plastic body at datum plane -H-. 4. To be determined at seating plane -C-. 5. Dimensions D1 and E1 do not include mold protrusion. Allowable mold protrusion is 0.254 mm per side. Dimensions D1 and E1 do include mold mismatch and are determined at datum plane -H-. 6. “N” is the total # of terminals. 7. Package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package. 8. Dimension B does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the dimension at maximum material condition. Dambar cannot be located on the lowerradius or the foot. 9. All dimensions are in millimeters. 10. Maximum allowable die thickness to be assembled in this package family is 0.635 millimeters. 11. This drawing conforms to JEDEC registered outlines MS-108 and MS-022. 12. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.  2004 Semtech Corp. / Rev. 2, 8/16/04 7 Symbol A A1 A2 D D1 D2 ZD E E1 E2 ZE L N e B B1 ccc ND NE 0.22 0.22 0.30 0.13 30 20 Side Pin Count Side Pin Count 0.73 0.25 2.57 Min Nom 3.04 0.33 2.71 23.20 BSC 20.00 BSC 18.85 REF 0.58 REF 17.20 14.00 BSC 12.35 REF 0.83 REF 0.88 100 0.65 BSC 0.38 0.33 8 1.03 6 Pin Count Lead Pitch Pad Dimension Pad Dimension 4 5 Body Dimension 2.87 4 5 Body Dimension Max 3.40 Note Comments Height above PCB Gap above PCB Body Thickness www .semtech.com Edge819 TEST AND MEASUREMENT PRODUCTS Recommended Operating Conditions Parameter Total Analog Supply Ambient Operating Temperature Junction Temperature Thermal Resistance of Package (Junction to Still Air) Thermal Resistance of Package (Junction to Case) Symbol VCC - VEE TA TJ θJ A θJ C 32.2 12.4 Min +10 Typ Max +18 70 +125 Units V oC oC o C/W o C/W Absolute Maximum Ratings Parameter Total Power Supply Digital Input Voltages Analog Input Voltages Analog Output Voltages Symbol VCC – VEE DATA, EN* VH, VL, VBB DOUT Min – 0.5 VEE – .5 VEE – .5 VEE – .5 Max 19.0 VCC + .5 VCC + .5 VCC + .5 Units V V V V Ambient Operating Temperature Storage Temperature Junction Temperature Soldering Temperature (5 seconds, .25" from the pin) TA TS TJ TSOL – 50 – 65 +125 +150 +150 +260 oC oC oC oC Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these, or any other conditions beyond those listed, is not implied. Exposure to absolute maximum conditions for extended periods may affect device reliability.  2004 Semtech Corp. / Rev. 2, 8/16/04 8 www .semtech.com Edge819 TEST AND MEASUREMENT PRODUCTS DC Characteristics Parameter Driver High Voltage Low Voltage Output Swing HiZ Leakage Current Output Impedance DC Output Current (Note 1) AC Output Current (Note 2) Digital Inputs Input High Voltage Input Low Voltage Input Current Common Mode Range Power Supplies Positive Supply Current (Note 3) Negative Supply Current (Note 3) ICC IEE 36 36 57 57 78 78 mA mA EN*, DATA - VBB VBB – EN*, DATA Iin DATA, EN* 1.0 1.0 – 100 VEE V V nA V VH VL VH – VL Ileak Rout Iout DC Iout AC VEE VEE VEE – 2.0 9.0 – 125 – 400 VCC VCC VCC +2.0 15 +125 +400 V V V nA Ω mA mA Symbol Min Typ Max Units 0 12 0 +100 VCC Test conditions (unless otherwise specified): "Recommended Operating Conditions". VCC = +15V, VEE = –3V. Note 1: Note 2: Note 3: DC output current is specified per individual driver. Surge current capability for durations of < 2 seconds. VCC = +15V, VEE = –3V.  2004 Semtech Corp. / Rev. 2, 8/16/04 9 www .semtech.com Edge819 TEST AND MEASUREMENT PRODUCTS AC Characteristics Parameter Driver DA T A t o DOUT ( Not es 2, 4) EN* t o DOUT ( A c t iv e t o HiZ ) ( Not e 1) EN* t o DOUT ( HiZ t o A c t iv e) R ise/ F all T imes ( Not e 2) 1V Sw ing ( 20% - 80%) 3V Sw ing ( 10% - 90%) 5V Sw ing ( 10% - 90%) 10V Sw ing ( 10% - 90%) 15V Sw ing ( 10% - 90%) M ax imum Operat ing F requenc y ( Not e 3) M inimum P ulse W idt h T pd T pd T pd T r/ T f T r/ T f T r/ T f T r/ T f T r/ T f F max 50 8 11 9.5 10 11 14.5 20 16 3.0 3.5 4.0 4.5 5.0 19.5 30 21 ns ns ns ns ns ns ns ns M Hz ns Symbol Min Typ Max Units Test conditions (unless otherwise specified): "Recommended Operating Conditions". VCC = +15V, VEE = –3V. Note 1: Note 2: Note 3: Note 4: Load = 10 mA and measured when a 1V change at the output is detected. (VH = 3V, VL = 0V, VFLOAT = 1.5V, tested at 1V and 2V.) Into 18 cm of 50 Ω transmission line terminate with 1 KΩ and 5 pF, with proper series termination resistor. Guaranteed by characterization. This parameter is not tested in production. This parameter is production tested at 40 MHz. From VBB threshold of DATA to 50% level of DOUT. Ordering Information Model Number Package 100 lead M QF P 14 mm x 20 mm B ody Size w / I nt er nal Heat Spreader Edg e819 Ev aluat ion B oard E819A HF EV M 819A HF Contact Information Semtech Corporation Test and Measurement Division 10021 Willow Creek Rd., San Diego, CA 92131 Phone: (858)695-1808 FAX (858)695-2633  2004 Semtech Corp. / Rev. 2, 8/16/04 10 www .semtech.com