SC1453ITSK3.1TR

150mA Ultra Low Dropout Regulator with Low Noise Bypass POWER MANAGEMENT Description The SC1453 is a low dropout linear regulator that operates from a +2.25V to +6.5V input range and delivers up to 150mA. A PMOS pass transistor allows the low 75µA supply current to remain independent of load, making these devices ideal for battery operated portable equipment such as cellular phones, cordless phones and personal digital assistants. The SC1453 has a bandgap reference bypass pin for very low noise operation - a 10nF (typ.) capacitor may be connected between this pin and ground. Other features include low powered shutdown, short circuit protection, thermal shutdown protection and reverse battery protection. The SC1453 comes in the tiny 5 lead SOT-23 package and the ultra-low profile 5 lead TSOT-23. SC1453 Features “2982/5205” compatible pinout Guaranteed 150 mA output current 2% output accuracy guaranteed over line, load and temperature Very small external components - designed to work with ceramic capacitors Low 26µVRMS output noise (1.5V option, CIN = COUT = 1µF, CBYP = 10nF) Very low supply current Thermal overload protection Reverse battery protection Low power shutdown Full industrial temperature range Very low profile packaging available (1mm max. height) Surface mount packaging (5 pin SOT-23 and TSOT-23) Available in Lead-free packages, fully WEEE and RoHS compliant Applications Battery Powered Systems Cellular Telephones Cordless Telephones Personal Digital Assistants Portable Instrumentation Modems PCMCIA cards Typical Application Circuit VIN C1 1uF 1 3 U1 IN EN SC1453 OUT GND BYP 2 5 4 VOUT C3 1uF C2 10nF Revision: April 21, 2008 1 www.semtech.com SC1453 POWER MANAGEMENT Absolute Maximum Ratings Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. Parameter Input Supply Voltage Thermal Resistance Junction to Ambient Thermal Resistance Junction to Case Operating Ambient Temperature Range Operating Junction Temperature Range Storage Temperature Range Lead Temperature (Soldering) 10 Sec. ESD Rating Symbol VIN θJ A θJ C TA TJ TSTG TLEAD ESD Maximum -0.6 to +7 256 81 -40 to +85 -40 to +125 -65 to 150 300 2 Units V °C/W °C/W °C °C °C °C kV Electrical Characteristics Unless specified: VIN = VOUT + 1V, VEN = VIN, IOUT = 100µA, CIN = COUT = 1µF, TA = 25°C. Values in bold apply over full operating ambient temperature range. Parameter IN Supply Voltage Range Supply Current Symbol Conditions Min Typ Max Units VIN IQ IOUT = 0mA to150mA 2.25 75 6.50 130 160 V µA VIN = 6.5V, VEN = 0V 0.1 1.0 1.5 µA OUT Output Voltage (1) VOUT IOUT = 1mA 0mA ≤ IOUT ≤ 150mA, VOUT +1V ≤ VIN ≤ 5.5V Line Regulation (1)(2) REG(LINE) (VOUT(NOM) + 0.1V) ≤ VIN ≤ 5.5V, IOUT = 1mA -1.5% -2.0% 2.5 VOUT +1.5% +2.0% 10 12 Load Regulation (1) REG(LOAD) IOUT = 0.1mA to 150mA -3 -10 -20 mV mV V  2008 Semtech Corp. 2 www.semtech.com SC1453 POWER MANAGEMENT Electrical Characteristics (Cont.) Unless specified: VIN = VOUT + 1V, VEN = VIN, IOUT = 100µA, CIN = COUT = 1µF, TA = 25°C. Values in bold apply over full operating ambient temperature range. Parameter OUT (Cont.) Current Limit Dropout Voltage(1)(3) Symbol Conditions Min Typ Max Units ILIM VD IOUT = 1mA IOUT = 50mA 400 1 50 65 75 IOUT = 100mA 100 125 155 IOUT = 150mA 150 190 230 mA mV mV mV mV Output Voltage Noise, COUT = 1µF en 10Hz to 100kHz, IOUT = 1mA CBYP = 10nF, VOUT = 1.5V 10Hz to 100kHz, IOUT = 1mA CBYP = 10nF, VOUT = 3.3V 26 54 13 29 61 µVRMS Output Voltage Noise, COUT = 100µF en 10Hz to 100kHz, IOUT = 1mA CBYP = 10nF, VOUT = 1.5V 10Hz to 100kHz, IOUT = 1mA CBYP = 10nF, VOUT = 3.3V µVRMS Power Supply Rejection Ratio BYP Start-up Rise Time EN Enable Input Threshold PSRR f = 120Hz, CBYP = 10nF dB tr CBYP = 10nF 1.3 ms VIH VIL 2.25V ≤ VIN ≤ 6.5V 2.25V ≤ VIN ≤ 6.5V 0V ≤ VEN ≤ VIN 1.6 0.4 -0.5 0 +0.5 V Enable Input Bias Current (4) Over Temperature Protection High Trip Level Hysteresis IEN µA THI THYST 150 20 °C °C Notes: (1) Low duty cycle pulse testing with Kelvin connections required. (2) VIN(MIN) = 2.25V. (3) Defined as the input to output differential at which the output voltage drops 100mV below the value measured at a differential of 1V. Not measurable on 1.5V and 1.8V parts due to minimum VIN constraints. (4) Guaranteed by design.  2008 Semtech Corp. 3 www.semtech.com SC1453 POWER MANAGEMENT Pin Configuration Top View (SOT-23-5 & TSOT-23-5) Pin Descriptions Pin # 1 2 3 4 5 Pin Name IN GND EN BYP OUT Pin Function Input pin. Ground pin. Can be used for heatsinking if needed. Active high enable pin. Connect to IN if not being used. Reference bypass. Connect a 10nF capacitor (typical) between this pin and GND to reduce output noise. Regulator output, sourcing up to 150mA.  2008 Semtech Corp. 4 www.semtech.com SC1453 POWER MANAGEMENT Ordering Information P ackag e SOT-23-5 (1) Voltage Option (V) 1.5 1.8 2.5 2.7 2.8 2.9 3.0 3.1 3.2 3.3 Part Number SC1453ISK-1.5TR SC1453ISK-1.8TR SC1453ISK-2.5TR SC1453ISK-2.7TR SC1453ISK-2.8TR SC1453ISK-2.9TR SC1453ISK-3.0TR SC1453ISK-3.1TR SC1453ISK-3.2TR SC1453ISK-3.3TR SC1453ISK1.5TRT SC1453ISK18TRT SC1453ISK2.5TRT SC1453ISK2.7TRT SC1453ISK2.8TRT SC1453ISK2.9TRT SC1453ISK3.0TRT SC1453ISK3.1TRT SC1453ISK3.2TRT SC1453ISK33TRT P ackag e TSOT-23-5 (1) Voltage Option (V) 1.5 1.8 2.5 2.7 2.8 2.85 2.9 3.0 3.1 3.2 3.3 Part Number SC1453ITSK1.5TR SC1453ITSK1.8TR SC1453ITSK2.5TR SC1453ITSK2.7TR SC1453ITSK2.8TR SC1453ITSK285TR SC1453ITSK2.9TR SC1453ITSK3.0TR SC1453ITSK3.1TR SC1453ITSK3.2TR SC1453ITSK3.3TR SC1453ITSK15TRT SC1453ITSK18TRT SC1453ITSK25TRT SC1453ITSK27TRT SC1453ITSK28TRT SC1453TSK285TRT SC1453ITSK29TRT SC1453ITSK30TRT SC1453ITSK31TRT SC1453ITSK32TRT SC1453ITSK33TRT S C 1453E V B Lead-free SOT-23-5 (1)(2) 1.5 1.8 2.5 2.7 2.8 2.9 3.0 3.1 3.2 3.3 Lead-free TSOT-23-5 (1)(2) 1.5 1.8 2.5 2.7 2.8 2.85 2.9 3.0 3.1 3.2 3.3 Notes: (1) Only available in tape and reel packaging. A reel contains 3000 devices. (2) Lead free packaging (ordered with suffix extension “TRT”) is optional. Consult factory for availability. This product is fully WEEE and RoHS compliant. (3) Evaluation board for SC1453. Specify output voltage option when ordering. Evaluation Board (3) Specify  2008 Semtech Corp. 5 www.semtech.com SC1453 POWER MANAGEMENT Marking Information Top Mark Bottom Mark x3XX x = package (5 for SOT-23-5, T for TSOT-23-5) 3 = SC1453 XX = voltage option (examples: 5331 for 3.1V option in SOT-23-5 yyww yyww = Date code (example: 0008 for week 8 of 2000) Top Mark Bottom Mark BX00 For SC1453, 2.85V option: X = L for SOT-23-5 and N for TSOT-23-5 yyww yyww = Date code (example: 0008 for week 8 of 2000) Block Diagram  2008 Semtech Corp. 6 www.semtech.com SC1453 POWER MANAGEMENT Applications Information Theory Of Operation The SC1453 is intended for applications where very low dropout voltage, low supply current and low output noise are critical. It provides a very simple, low cost solution that uses very little pcb real estate. Only three external capacitors are required for operation (two if a low noise output is not required). The SC1453 contains a bandgap reference trimmed for optimal temperature coefficient which is fed into the inverting input of an error amplifier. The output voltage of the regulator is divided down internally using a resistor divider and compared to the bandgap voltage. The error amplifier drives the gate of a low R DS(ON) P-channel MOSFET pass device. An active high enable pin (EN) allows the regulator to be shut down. Pulling this pin low causes the device to enter a very low power shutdown mode, where it will draw typically 0.1µA from the input supply. A bypass pin (BYP) is provided to decouple the bandgap reference to reduce output noise and also to improve power supply rejection. This pin can be left open if low noise operation is not required. The regulator has its own current limit circuitry to ensure that the output current will not damage the device during output short, overload or start-up. The current limit is guaranteed to be greater than 400mA to allow fast charging of the output capacitor and high initial currents for DSP initialization. The SC1453 has a fast start-up circuit to speed up the initial charging time of the bypass capacitor to enable the output voltage to come up quicker (typically 1.3ms with CBYP = 10nF). The SC1453 includes thermal shutdown circuitry to turn off the device if T J exceeds 150°C (typical), with the device remaining off until TJ drops by 20°C (typical). Reverse battery protection circuitry ensures that the device cannot be damaged if the input supply is accidentally reversed, limiting the reverse current to less than 1.5mA. Component Selection - General Output capacitor - Semtech recommends a minimum capacitance of 1µF at the output with an equivalent series resistance (ESR) of < 1Ω over temperature. While the SC1453 has been designed to be used with ceramic capacitors, it does not have to be used with ceramic capacitors, allowing the designer a choice. Increasing the bulk capacitance will further reduce output noise and improve the overall transient response. Input capacitor - Semtech recommends the use of a 1µF ceramic capacitor at the input. This allows for the device being some distance from any bulk capacitance on the rail. Additionally, input droop due to load transients is reduced, improving overall load transient response. Bypass capacitor - Semtech recommends the use of a 10nF ceramic capacitor to bypass the bandgap reference. Increasing this capacitor to 100nF will further improve power supply rejection and overall output noise. CBYP may be omitted if low noise operation is not required. Thermal Considerations The worst-case power dissipation for this part is given by: PD(MAX ) = (VIN(MAX) − VOUT(MIN) )• IOUT(MAX ) + VIN(MAX ) • IQ(MAX ) (1) For all practical purposes, equation (1) can be reduced to the following expression: PD(MAX) = (VIN(MAX ) − VOUT(MIN) )• IOUT(MAX) (2) Looking at a typical application, 3.3V to 2.8V at 150mA: VIN(MAX) = 3.3 + 5% = 3.465V VOUT(MIN) = 2.8V - 2% = 2.744V IOUT = 150mA TA = 85°C  2008 Semtech Corp. 7 www.semtech.com SC1453 POWER MANAGEMENT Applications Information (Cont.) Inserting these values into equation (2) gives us: PD(MAX ) = (3.465 − 2.744 ) • 0.150 = 108mW Layout Considerations While layout for linear devices is generally not as critical as for a switching application, careful attention to detail will ensure reliable operation. 1) Attaching the part to a larger copper footprint will enable better heat transfer from the device, especially on PCBs where there are internal ground and power planes. 2) Place the input, output and bypass capacitors close to the device for optimal transient response and device behaviour. 3) Connect all ground connections directly to the ground plane. If there is no ground plane, connect to a common local ground point before connecting to board ground. Using this figure, we can calculate the maximum thermal impedance allowable to maintain TJ ≤ 125°C: θ JA (MAX ) = (T J(MAX ) − TA (MAX ) ) PD(MAX ) = (125 − 85) = 370°C / W 0.108 With the standard SOT-23-5/TSOT-23-5 Land Pattern shown at the end of this datasheet, and minimum trace widths, the thermal impedance junction to ambient for SC1453ISK is 256°C/W. Thus no additional heatsinking is required for this example. The junction temperature can be reduced further (or higher power dissipation can be allowed) by the use of larger trace widths and connecting PCB copper to the GND pin (pin 2), which connects directly to the device substrate. Adding approximately one square inch of PCB copper to pin 2 will reduce θ JA t o approximately 130°C/W and T J(MAX) f or the example above to approximately 100°C for the SOT-23-5 package. The use of multi layer boards with internal ground/power planes will lower the junction temperature and improve overall output voltage accuracy.  2008 Semtech Corp. 8 www.semtech.com SC1453 POWER MANAGEMENT Typical Characteristics Quiescent Current vs. Junction Temperature vs. Input Voltage 120 IOUT = 150mA 100 80 IQ (µA) VIN = 3.8V 60 40 20 0 -50 -25 0 25 TJ (°C) 50 75 100 125 IQ(OFF) (nA) VIN = 6.5V 200 175 150 125 100 75 50 25 0 -50 -25 0 25 TJ (°C) 50 75 100 125 Off-State Quiescent Current vs. Junction Temperature VIN = 6.5V VEN = 0V Output Voltage vs. Junction Temperature vs. Output Current 0.00 IOUT = 1mA -0.05 VOUT Deviation (%) -0.10 -0.15 100mA ≤ IOUT ≤ 150mA -0.20 -0.25 VIN = VOUT + 1V -0.30 -50 -25 0 25 TJ (°C) 50 75 100 125 0 10 8 6 4 2 12 Line Regulation vs. Junction Temperature vs. Input Voltage Change IOUT = 1mA REGLINE (mV) IOUT = 50mA VIN = VOUT + 1V to 6.5V VIN = VOUT + 1V to 5.5V -50 -25 0 25 TJ (°C) 50 75 100 125 Load Regulation vs. Junction Temperature 10 9 8 7 REGLOAD (mV) ILIM (A) 6 5 4 3 2 1 0 -50 -25 0 25 TJ (°C) 50 75 100 125 VIN = VOUT + 1V IOUT = 0.1mA to 150mA 0.90 0.85 0.80 0.75 0.70 0.65 0.60 0.55 0.50 0.45 0.40 Current Limit vs. Junction Temperature vs. Input Voltage VIN = 6.5V VIN = 3.8V -50 -25 0 25 TJ (°C) 50 75 100 125  2008 Semtech Corp. 9 www.semtech.com SC1453 POWER MANAGEMENT Typical Characteristics (Cont.) Dropout Voltage vs. Junction Temperature vs. Output Current 200 175 150 125 VD (mV) 100 75 50 25 0 -50 -25 0 25 TJ (°C) 50 75 100 125 IOUT = 50mA VD (mV) IOUT = 150mA 200 175 150 125 100 75 50 25 0 0 25 50 75 IOUT (mA) 100 125 150 Top to bottom: TJ = 125°C TJ = 25°C TJ = -40°C Dropout Voltage vs. Output Current vs. Junction Temperature Bypass Start-up Rise Time vs. Junction Temperature vs. Input Voltage 1.8 1.7 1.6 1.5 tr (ms) 1.4 1.3 1.2 1.1 1.0 0.9 0.8 -50 -25 0 25 TJ (°C) 50 75 100 125 VIN = 6.5V VIN = 3.8V VEN (V) CBYP = 10nF Enable Input Threshold Voltage vs. Junction Temperature vs. Input Voltage 1.6 1.4 1.2 1.0 0.8 VIL @ VIN = 3.8V 0.6 0.4 -50 -25 0 25 TJ (°C) 50 75 100 125 VIH @ VIN = 6.5V VIH @ VIN = 3.8V VIL @ VIN = 6.5V Reverse Battery Protection vs. Junction Temperature 5.0 4.5 4.0 3.5 I(REV BAT) (mA) en (µV/√Hz) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -50 -25 0 25 TJ (°C) 50 75 100 125 VIN = VEN = -6.5V Output Spectral Noise Density vs. Frequency vs. Output Voltage, COUT = 1µF 10 VIN = VOUT + 1V IOUT = 1mA CIN = 1µF CBYP = 10nF TJ = 25°C 1 0.1 0.01 Top to bottom: VOUT = 3.3V VOUT = 3.0V VOUT = 2.8V VOUT = 2.5V VOUT = 1.8V VOUT = 1.5V 0.1 1 f (kHz) 10 100 1000 0.001 0.01  2008 Semtech Corp. 10 www.semtech.com SC1453 POWER MANAGEMENT Typical Characteristics (Cont.) Output Spectral Noise Density vs. Frequency vs. Output Voltage, COUT = 100µF 10 VIN = VOUT + 1V IOUT = 1mA CIN = 1µF CBYP = 10nF TJ = 25°C en (µV/√Hz) Top to bottom: VOUT = 3.3V VOUT = 3.0V VOUT = 2.8V VOUT = 2.5V VOUT = 1.8V VOUT = 1.5V 0.1 1 f (kHz) 10 100 1000 10 Left to right: COUT = 100µF COUT = 44µF COUT = 22µF COUT = 10µF COUT = 1µF Output Spectral Noise Density vs. Frequency vs. Output Capacitance 1 en (µV/√Hz) 1 0.1 0.1 VOUT = 1.5V VIN = 2.5V IOUT = 1mA CBYP = 10nF CIN = 1µF TJ = 25°C 0.1 1 f (kHz) 10 100 1000 0.01 0.01 0.001 0.01 0.001 0.01 Output Spectral Noise Density vs. Frequency vs. Bypass Capacitance 10 CBYP = 1nF CBYP = 10nF CBYP = 100nF CBYP = 1µF en (µV/√Hz) Output Spectral Noise Density vs. Frequency vs. Output Current 10 Top to bottom: IOUT = 150mA IOUT = 100mA IOUT = 50mA IOUT = 1mA 1 en (µV/√Hz) 1 0.1 VOUT = 1.5V VIN = 2.5V IOUT = 1mA CIN = 1µF COUT = 1µF TJ = 25°C 0.1 1 f (kHz) 10 100 1000 0.1 VOUT = 1.5V VIN = 2.5V CIN = 1µF CBYP = 10nF COUT = 1µF TJ = 25°C 0.1 1 f (kHz) 10 100 1000 0.01 0.01 0.001 0.01 0.001 0.01 Power Supply Rejection Ratio vs. Frequency vs. Output Voltage, CBYP = 10nF 80 70 60 PSRR (dB) Top to bottom: VOUT = 1.5V VOUT = 1.8V VOUT = 2.5V VOUT = 2.8V VOUT = 3.0V VOUT = 3.3V PSRR (dB) 50 40 30 20 10 VIN = VOUT + 1V CIN = COUT = 1µF CBYP = 10nF IOUT = 1mA TJ = 25°C 0.1 Power Supply Rejection Ratio vs. Frequency vs. Output Voltage, CBYP = 100nF 80 70 60 50 40 30 20 10 VIN = VOUT + 1V CIN = COUT = 1µF CBYP = 100nF IOUT = 1mA TJ = 25°C 0.1 Top to bottom: VOUT = 1.5V VOUT = 2.5V VOUT = 1.8V VOUT = 2.8V VOUT = 3.0V VOUT = 3.3V 0 0.01 1 f (kHz) 10 100 1000 0 0.01 1 f (kHz) 10 100 1000  2008 Semtech Corp. 11 www.semtech.com SC1453 POWER MANAGEMENT Evaluation Board Schematic J1 RIPPLE MON J2 IN MON J3 IN 1 C1 C2 R4 3 U1 IN EN GND 2 SC1453 OUT BYP 5 R1 4 C3 C4 R2 R3 J4 OUT MON J5 EN J8 1 2 3 EN J6 1 2 IQ MON C5 J7 FLG J10 GND J11 GND J12 GND J13 GND J14 GND J15 GND J9 LOAD DRV J16 1 2 3 LOAD DRV EN 1 2 3 4 Q1 S S S G Si4410 D D D D 8 7 6 5 Evaluation Board Bill of Materials Quantity 2 2 1 1 3 1 1 1 2 1 6 1 2 1 1 1  2008 Semtech Corp. Reference C 1, C 4 C 2, C 3 C5 J1 J2 - J4 J5 J6 J7 J8 , J1 6 J9 J1 0 - J1 5 Q1 R1, R2 R3 R4 U1 Part/Description Not placed 1µF ceramic 10nF ceramic BNC socket Test pin Test pin Header, 2 pin Not placed Header, 3 pin Test pin Test pin S i 4410 Not placed See next page 10kΩ, 1/10W SC1453ISK-X.X or SC1453ITSK-XX 12 Vendor Notes Murata Various Various Various Various Various GRM42-6X7R105K10 VOUT ripple monitor Red White Various Various Various Vishay Orange Black (J14 not placed) Various Various Semtech www.semtech.com SC1453 POWER MANAGEMENT Evaluation Board Gerber Plots Top Copper Bottom Copper Output Voltage Option (V) 1.5 1.8 2.5 2.6 2.7 2.8 2.85 2.9 R3 Value/Siz e 10Ω/0.5W 12Ω/0.5W 16Ω/0.5W 16Ω/0.5W 18Ω/0.5W 18Ω/0.5W 18Ω/0.5W 18Ω/0.5W 20Ω/0.5W 20Ω/0.5W 22Ω/0.5W 22Ω/0.5W Top Silk Screen 3.0 3.1 3.2 3.3  2008 Semtech Corp. 13 www.semtech.com SC1453 POWER MANAGEMENT Outline Drawing - SOT-23-5 A e1 N EI D DIMENSIONS MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX A A1 A2 b c D E1 E e e1 L L1 N 01 aaa bbb ccc A H .035 .000 .035 .010 .003 .110 .060 .045 .057 .006 .051 .020 .009 .118 .069 0.90 0.00 .90 0.25 0.08 2.80 1.50 1.15 1.45 0.15 1.30 0.50 0.22 3.00 1.75 2X E/2 E 1 ccc C 2X N/2 TIPS 2 e B D aaa C A2 SEATING PLANE .114 .063 .110 BSC .037 BSC .075 BSC .012 .018 .024 (.024) 5 0° 10° .004 .008 .008 2.90 1.60 2.80 BSC 0.95 BSC 1.90 BSC 0.30 0.45 0.60 (0.60) 5 0° 10° 0.10 0.20 0.20 C A1 bxN bbb C A-B D GAGE PLANE 0.25 L (L1) c 01 SEE DETAIL SIDE VIEW A DETAIL A NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. Land Pattern - SOT-23-5 X DIM (C) G Y P Z C G P X Y Z DIMENSIONS MILLIMETERS INCHES (.098) .055 .037 .024 .043 .141 (2.50) 1.40 0.95 0.60 1.10 3.60 NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET.  2008 Semtech Corp. 14 www.semtech.com SC1453 POWER MANAGEMENT Outline Drawing - TSOT-23-5 A e1 N E1 1 ccc C 2X N/2 TIPS B D aaa C A2 SEATING PLANE C A1 bxN bbb C A-B D GAGE PLANE 0.25 L (L1) DETAIL SEE DETAIL SIDE VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MO-193, VARIATION AB. DIM D A A1 A2 b c D E1 E e e1 L L1 N 01 aaa bbb ccc DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .000 .028 .012 .003 .110 .060 .039 .004 .035 .020 .008 .118 .067 0.00 0.70 0.30 0.08 2.80 1.50 1.00 0.10 0.90 0.50 0.20 3.00 1.70 2X E/2 E 2 e .114 .063 .110 BSC .037 BSC .075 BSC .012 .018 .024 (.024) 5 0° 8° .004 .008 .010 2.90 1.60 2.80 BSC 0.95 BSC 1.90 BSC 0.30 0.45 0.60 (0.60) 5 0° 8° 0.10 0.20 0.25 A H c 01 A A Land Pattern - TSOT-23-5 X DIM (C) G Y P Z C G P X Y Z DIMENSIONS INCHES MILLIMETERS (.087) .031 .037 .024 .055 .141 (2.20) 0.80 0.95 0.60 1.40 3.60 NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. Contact Information Semtech Corporation Power Management Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804  2008 Semtech Corp. 15 www.semtech.com