SC1565IS-X.XTR

Very Low Dropout 1.5 Amp Regulator With Enable POWER MANAGEMENT Description The SC1565 is a high performance positive voltage regulator designed for use in applications requiring very low dropout voltage at up to 1.5 Amps. Since it has superior dropout characteristics compared to regular LDOs, it can be used to supply 2.5V on motherboards or 2.8V on peripheral cards from the 3.3V supply thus allowing the elimination of costly heatsinks. Additionally, the 5-lead TO-220/TO-263 and SO-8 versions have an enable pin to further reduce power dissipation while shut down. The SC1565 provides excellent regulation over variations in line, load and temperature. The SC1565 is available in SO-8, 3-lead SOT-223, 3 and 5 lead TO-220 and 3 and 5 lead TO-263 packages. Three lead packages are available with 1.8V and 2.5V fixed output options only. The SO-8, TO-220-5 and TO-263-5 are available with 1.8V and 2.5V internally preset outputs that are also adjustable using external resistors. SC1565 Features 350mV dropout @ 1.5A Adjustable output from 1.2V to 4.8V(1) 2.5V and 1.8V options (adjustable externally using resistors)(1) Over current and over temperature protection Enable pin(1) 10µA quiescent current in shutdown(1) Low reverse leakage (output to input) Surface mount and through-hole packages Full industrial temperature range TO-220, TO-263, SOT-223 and SO-8 Packages Note: (1) SO-8, TO-220-5 and TO-263-5 packages only. Applications Battery powered systems Motherboards Peripheral cards Network cards Set Top Boxes Medical Equipment Notebook Computers Typical Application Circuits U1 ENABLE VIN VO 1 2 3 4 R1 EN VIN VO ADJ GND GND GND GND 8 7 6 5 ENABLE VIN VO U1 1 2 3 4 C1 C2 EN VIN VO ADJ GND GND GND GND 8 7 6 5 SC1565IS-X.X SC1565IS-X.X C1 C2 R2 VO = 1.200 (R1 + R2) R2 Volts U1 SC1565I5T-X.X VIN ENABLE 2 1 VIN EN VO GND ADJ 3 C1 C2 R2 4 5 VO = 1.200 (R1 + R2) R2 Volts VO U1 SC1565IT-X.X VIN 1 VIN GND C1 2 C2 VO 3 VO R1 Notes: (1) Maximum VO setpoint for 1.8V parts = 5.4V. (2) This device is designed to operate with ceramic input and output capacitors. Revision: November 25, 2009 1 www.semtech.com SC1565 POWER MANAGEMENT Absolute Maximum Ratings Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. Parameter Input Voltage Power Dissipation Thermal Resistance Junction to Ambient SO-8(1) SOT-223 TO-220-X TO-263-X Thermal Resistance Junction to Case SO-8 SOT-223 TO-220-X, TO-263-X Operating Ambient Temperature Range Operating Junction Temperature Range Storage Temperature Range Lead Temperature (Soldering) 10 Sec. ESD Rating (Human Body Model) Note: (1) 1 square inch of FR-4, double sided, 1 oz. minimum copper weight. Symbol VIN PD θJ A Max 7 Internally Limited 65 63 50 60 39 27 3 -40 to +85 -40 to +150 -65 to +150 300 4 Units V W °C/W θJ C °C/W TA TJ TSTG TLEAD V ESD °C °C °C °C kV Electrical Characteristics Unless specified: VEN = VIN. Adjustable Option (VADJ > VTH(ADJ)): VIN = 2.2V to 5.5V and IO = 10µA to 1.5A. Fixed Options (VADJ = GND): VIN = (VO + 0.7V) to 5.5V and IO = 0A to 1.5A. Values in bold apply over the full operating temperature range. Parameter VIN Supply Voltage Range Quiescent Current Symbol Test Conditions Min Typ Max Units VIN IQ VIN = 3.3V VIN = 5.5V, VEN = 0V 2.2 0.75 10 5.5 1.75 35 V mA µA VO Output Voltage(1) (Internal Fixed Voltage) Line Regulation(1) Load Regulation(1) Dropout Voltage(1)(2) REG(LINE) REG(LOAD) VD VIN = (VO + 0.25V) to 5.5V, IOUT = 10mA VIN = VO + 0.7V IO = 10mA VO VIN = VO + 0.7V, IO = 10mA -1% -2% 0.035 0.2 2.5 VO +1% +2% 0.3 0.4 10 20 IO = 500mA 90 300 400  2005 Semtech Corp. 2 www.semtech.com V % % mV mV SC1565 POWER MANAGEMENT Electrical Characteristics (Cont.) Unless specified: VEN = VIN. Adjustable Option (VADJ > VTH(ADJ)): VIN = 2.2V to 5.5V and IO = 10µA to 1.5A. Fixed Options (VADJ = GND): VIN = (VO + 0.7V) to 5.5V and IO = 0A to 1.5A. Values in bold apply over the full operating temperature range. Parameter VO (Cont.) Dropout Voltage(1)(2) Symbol Test Conditions Min Typ Max Units IO = 1A 180 400 500 mV IO = 1.5A 270 500 600 mV Minimum Load Current(3) Current Limit ADJ Reference Voltage(1) IO ICL VIN = VO + 0.7V 1.6 1 2.0 10 3.5 µA A VREF VIN = 2.2V, VADJ = VOUT, IO = 10mA 1.188 1.176 1.200 1.212 1.224 V Adjust Pin Current(4) Adjust Pin Threshold(5) EN Enable Pin Current Enable Pin Threshold IADJ VTH(ADJ) VADJ = VREF 0.05 30 0.20 200 0.40 nA V IEN VIH VIL VEN = 0V, VIN = 3.3V VIN = 3.3V VIN = 3.3V 1.6 1.5 10 µA V 0.4 Over Temperature Protection High Trip level Hysteresis THI THYST 170 20 °C °C Notes: (1) Low duty cycle pulse testing with Kelvin connections required. (2) Defined as the input to output differential at which the output voltage drops to 1% below the value measured at a differential of 0.7V. (3) Required to maintain regulation. Voltage set resistors R1 and R2 are usually utilized to meet this requirement. Adjustable versions only. (4) Guaranteed by design. (5) When VADJ exceeds this threshold, the “Sense Select” switch disconnects the internal feedback chain from the error amplifier and connects VADJ instead.  2005 Semtech Corp. 3 www.semtech.com SC1565 POWER MANAGEMENT Pin Configurations Ordering Information Device SC1565IS-X.XTR(1)(3) SC1565IS-X.XTRT(1)(3(6) SC1565IST-X.XTR(2)(3) SC1565IST-XXTRT(2)(3)(6) P ackag e SO-8 SOT-223 SO-8 SC1565IM-X.XTR(2)(4) SC1565IM-XXTRT(2)(4)(6) SC1565I5M-X.XTR(1)(4) SC1565I5MX.XTRT(1)(4)(6) SC1565IT-X.X(2)(5) SC1565IT-X.XT(2)(5)(6) SC1565I5T-X.X(1)(5) TO-263-3 TO-263-5 TO-220-3 SOT-223 SC1565I5T-X.XT(1)(5)(6) TO-220-5 TO-220-3 SOT-223, TO-220-3 and TO-263-3 PIN 1 2 3 FUNCTION VIN GND VO TAB is GND TO-220-5 TO-220-5 and TO-263-5 PIN 1 2 3 4 5 FUNCTION EN VIN GND VO AD J TAB is GND Notes: (1) Where -X.X denotes voltage options. Available voltages are: 2.5V and 1.8V. Output voltage can be adjusted using external resistors, see Pin Descriptions on page 5. (2) Where -X.X denotes voltage options. Available voltages are: 2.5V and 1.8V. Output not adjustable. (3) Only available in tape and reel packaging. A reel contains 2500 devices. (4) Only available in tape and reel packaging. A reel contains 800 devices. (5) Only available in tube packaging. A tube contains 50 devices. (6) Halogen Free, and RoHS/WEEE compliant Pin Configurations (Cont.) TO-263-3  2005 Semtech Corp. 4 TO-263-5 www.semtech.com SC1565 POWER MANAGEMENT Block Diagram * * * Not present on SOT-223, TO-220-3 or TO-263-3 Pin Descriptions Pin Name Pin Desciption AD J Thi s pi n, when grounded, sets the output voltage to that set by the i nternal feedback resi stors. If external feedback resistors are used, the output voltage will be (See Application Circuits on page 1): VO = 1.200 (R1 + R2) R2 Volts EN GND VIN VO Enable Input. Pulling this pin below 0.4V turns the regulator off, reducing the quiescent current to a fraction of its operating value. The device will be enabled if this pin is left open. Connect to VIN if not being used. Reference ground. Use all four pins on the SO-8 device for heatsinking. Use the tab on the SOT-223, TO-220 and TO-263 devices for heatsinking. Input voltage. For regulation at full load, the input to this pin must be between (VO + 0.7V) and 5.5V. Minimum VIN = 2.2V. The pin is the power output of the device.  2005 Semtech Corp. 5 www.semtech.com SC1565 POWER MANAGEMENT Typical Characteristics Dropout Voltage (IOUT = 1 .5A) vs. Output Voltage vs. Junction Temperature 600 550 500 450 400 VD (mV) 300 250 200 150 100 50 0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 VOUT (V) 3.6 3.8 4.0 4.2 4.4 4.6 TJ = -40°C TJ = 25°C VD (mV) 350 TJ = 150°C 500 450 400 350 300 250 200 150 100 50 0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 VOUT (V) 3.6 3.8 4.0 4.2 4.4 4.6 Dropout Voltage (IOUT = 1A) vs. Output Voltage vs. Junction Temperature Top to bottom: TJ = 150°C TJ = 25°C TJ = -40°C Dropout Voltage (IOUT = 0.5A) vs. Output Voltage vs. Junction Temperature 400 350 300 250 VD (mV) VO (V) 2.550 Output Voltage (2.5V) vs. Junction Temperature vs. Output Current 2.540 2.530 2.520 2.510 2.500 2.490 2.480 2.470 2.460 2.450 IO = 1.5A IO = 10mA VIN = 3.2V Top to bottom: TJ = 150°C TJ = 25°C TJ = -40°C 200 150 100 50 0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 VOUT (V) 3.6 3.8 4.0 4.2 4.4 4.6 -50 -25 0 25 50 TJ (°C) 75 100 125 150 Output Voltage (2.5V) vs. Junction Temperature vs. Output Current 2.550 2.540 2.530 2.520 2.510 VO (V) 2.500 2.490 2.480 2.470 2.460 2.450 -50 -25 0 25 50 TJ (°C) 75 100 125 150 IO = 1.5A IO = 10mA VREF (V) VIN = 5.5V 1.225 1.220 1.215 1.210 1.205 1.200 1.195 1.190 1.185 1.180 1.175 -50 Reference Voltage vs. Junction Temperature vs. Output Current VIN = 2.2V IO = 10mA IO = 1.5A -25 0 25 50 TJ (°C) 75 100 125 150  2005 Semtech Corp. 6 www.semtech.com SC1565 POWER MANAGEMENT Typical Characteristics (Cont.) Reference Voltage vs. Junction Temperature vs. Output Current 1.225 1.220 1.215 1.210 VREF (V) 1.205 1.200 1.195 1.190 1.185 1.180 1.175 -50 -25 0 25 50 TJ (°C) 75 100 125 150 IO = 1.5A IO = 10mA IQ (µA) VIN = 5.5V 600 590 580 570 560 550 540 530 520 510 500 -50 -25 0 25 50 TJ (°C) 75 100 125 150 VIN = 3.3V Quiescent Current vs. Junction Temperature Off-State Quiescent Current vs. Junction Temperature 10 9 8 7 IQ(OFF) (µA) 6 5 4 3 2 1 0 -50 -25 0 25 50 TJ (°C) 75 100 125 150 VIN = 5.5V  2005 Semtech Corp. 7 www.semtech.com SC1565 POWER MANAGEMENT Applications Information Introduction The SC1565 is intended for applications such as graphics cards where high current capability and very low dropout voltage are required. It provides a very simple, low cost solution that uses very little pcb real estate. Additional features include an enable pin to allow for a very low power consumption standby mode, and a fully adjustable output. Component Selection Input capacitor: a 4 .7µF ceramic capacitor is recommended. This allows for the device being some distance from any bulk capacitance on the rail. Additionally, input droop due to load transients is reduced, improving load transient response. Additional capacitance may be added if required by the application. Output capacitor: a minimum bulk capacitance of 2.2µF, along with a 0.1µF ceramic decoupling capacitor is recommended. Increasing the bulk capacitance will improve the overall transient response. The use of multiple lower value ceramic capacitors in parallel to achieve the desired bulk capacitance will not cause stability issues. Although designed for use with ceramic output capacitors, the SC1565 is extremely tolerant of output capacitor ESR values and thus will also work comfortably with tantalum output capacitors. For reference, the phase-margin contour of Figure 1 can be used to choose an appropriate output capacitor for a given stability requirement. Noise immunity: in very electrically noisy environments, it is recommended that 0.1µF ceramic capacitors be placed from IN to GND and OUT to GND as close to the device pins as possible. External voltage selection resistors: the use of 1% resistors, and designing for a current flow ≥ 10µA is recommended to ensure a well regulated output (thus R2 ≤ 120kΩ). Thermal Considerations The power dissipation in the SC1565 is approximately equal to the product of the output current and the input to output voltage differential: PD ≈ (VIN − VOUT ) • I O The absolute worst-case dissipation is given by: PD ( MAX ) = (VIN ( MAX ) − VOUT ( MIN ) )• I O ( MAX ) + VIN ( MAX ) • I Q ( MAX ) For a typical scenario, VIN = 3.3V ± 5%, VOUT = 2.8V and IO = 1.5A, therefore: VIN(MAX) = 3.465V, VOUT(MIN) = 2.744V and IQ(MAX) = 1.75mA, Thus PD(MAX) = 1.09W. Using this figure, and assuming TA(MAX) = 70°C, we can calculate the maximum thermal impedance allowable to maintain TJ ≤ 150°C: R TH( J − A )(MAX ) = (T J( MAX ) − TA (MAX ) PD ( MAX ) ) = (150 − 70 ) = 73.4° C / W . 109 This should be achievable for the SO-8 package using pcb copper area to aid in conducting the heat away, such as one square inch of copper connected to the ground pins of the device. The SOT-223, TO-220 and TO-263 packages would not require heatsinking. Internal ground/ power planes and air flow will also assist in removing heat. For higher ambient temperatures it may be necessary to use additional copper area.  2005 Semtech Corp. 8 www.semtech.com SC1565 POWER MANAGEMENT Applications Information (Cont.) Co=2.2uF, Stable Region: Unstable Region: Co=22uF, Stable Region: Unstable Region: 1.5mA 1.5mA 15mA 15mA Load 150mA 150mA Load 0.001 0.01 0.1 1 1.5A 10 1.5A 0.001 0.01 0.1 1 10 ESR(Ohms) ESR(Ohms) Co=220uF, Stable Region: Unstable Region: 1.5mA 15mA Load 150mA 0.001 0.01 0.1 1 1.5A 10 ESR(Ohms) Figure 1: Phase-margin Contour Plot  2005 Semtech Corp. 9 www.semtech.com SC1565 POWER MANAGEMENT Outline Drawing - SO-8 A N 2X E/2 E1 E 1 ccc C 2X N/2 TIPS 2 e/2 B D aaa C SEATING PLANE A2 A C bxN bbb A1 C A-B D GAGE PLANE 0.25 SEE DETAIL SIDE VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MS-012, VARIATION AA. e D DIM A A1 A2 b c D E1 E e h L L1 N 01 aaa bbb ccc DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .053 .069 .004 .010 .049 .065 .012 .020 .007 .010 .189 .193 .197 .150 .154 .157 .236 BSC .050 BSC .010 .020 .016 .028 .041 (.041) 8 0° 8° .004 .010 .008 1.35 1.75 0.10 0.25 1.25 1.65 0.31 0.51 0.17 0.25 4.80 4.90 5.00 3.80 3.90 4.00 6.00 BSC 1.27 BSC 0.25 0.50 0.40 0.72 1.04 (1.04) 8 0° 8° 0.10 0.25 0.20 h h H c A L (L1) DETAIL 01 A Land Pattern - SO-8 X DIM (C) G Z C G P X Y Z DIMENSIONS INCHES MILLIMETERS (.205) .118 .050 .024 .087 .291 (5.20) 3.00 1.27 0.60 2.20 7.40 Y P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2. REFERENCE IPC-SM-782A, RLP NO. 300A.  2005 Semtech Corp. 10 www.semtech.com SC1565 POWER MANAGEMENT Outline Drawing - SOT-223 bbb b1 CBA N A DIM A A1 A2 b b1 c D E E1 e e1 L N 01 aaa bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .070 .000 .004 .059 .063 .067 .025 .033 .114 .124 .009 .014 .248 .256 .264 .264 .276 .287 .130 .138 .146 .090 BSC .181 BSC .030 4 0° 10° .003 .004 1.80 0.02 0.10 1.50 1.60 1.70 0.65 0.85 2.90 3.15 0.23 0.35 6.30 6.50 6.70 6.70 7.00 7.30 3.30 3.50 3.70 2.30 BSC 4.60 BSC 0.75 4 0° 10° 0.08 0.10 E 1 e e1 B D E1 aaa C A2 A SEATING PLANE C 3X b bbb H A1 CBA GAGE PLANE 0.25 DETAIL L 01 c A SEE DETAIL SIDE VIEW NOTES: 1. 2. 3. 4. A CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -HDIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. REFERENCE JEDEC STD TO-261, VARIATION AA. Land Pattern - SOT-223 X2 Y DIM C G P1 P2 X1 X2 Y Z DIMENSIONS INCHES MILLIMETERS (.244) .157 .091 .181 .047 .138 .087 .331 (6.20) 4.00 2.30 4.60 1.20 3.50 2.20 8.40 G X1 C Z Y P1 P2 NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2. REFERENCE IPC-SM-782A.  2005 Semtech Corp. 11 www.semtech.com SC1565 POWER MANAGEMENT Outline Drawing - T0-263-3 A E E/2 0 L1 DIM A A1 b b1 c c1 D D1 E E1 H e L L1 N 0 01 aaa DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .160 .000 .020 .045 .015 .045 .326 .270 .380 .245 .575 .190 .010 .039 .070 .029 .065 .380 .420 .625 .100 BSC .110 .070 .066 3 15° 0° 8° .010 4.83 4.06 0.25 0.00 0.99 0.51 1.78 1.14 0.74 0.38 1.65 1.14 9.65 8.28 6.86 10.67 9.65 6.22 14.61 15.88 2.54 BSC 2.79 1.78 1.68 3 15° 0° 8° 0.25 D H 1 2 3 e 3x b1 bxN aaa BA A SEATING PLANE B A1 c1 PLATED COPPER HEAT SPREADER D1 (L1) E1 L NOTES: 1. 2. CONTROLLING DIMENSIONS ARE IN INCHES (ANGLES IN DEGREES). DIMENSIONS "D" AND "E" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. SIDE VIEW SEE DETAIL A c DETAIL A 01 Minimum Land Pattern - TO-263-3 H DIM G H K P X Y Z DIMENSIONS INCHES MILLIMETERS .125 .420 .360 .100 .070 .140 .625 3.18 10.67 9.14 2.54 1.78 3.56 15.88 K Z G Y X P NOTES: 1. CONTROLLING DIMENSIONS ARE IN INCHES (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET.  2005 Semtech Corp. 12 www.semtech.com SC1565 POWER MANAGEMENT Outline Drawing - TO-263-5 A E E/2 0 L1 DIM A A1 b c c1 D D1 E E1 H e L L1 N 0 01 aaa DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .160 .000 .020 .015 .045 .326 .270 .380 .245 .575 .190 4.06 4.83 .010 0.00 0.25 .039 0.51 0.99 .029 0.38 0.74 .065 1.14 1.65 .380 8.28 9.65 6.86 .420 9.65 10.67 6.22 .625 14.61 15.88 .067 BSC 1.70 BSC .070 .110 1.78 2.79 .066 1.68 5 5 15° 15° 0° 8° 0° 8° .010 0.25 D H 12345 e bXN aaa BA A SEATING PLANE B A1 c1 SIDE VIEW PLATED COPPER HEAT SPREADER D1 (L1) E1 L NOTES: 1. CONTROLLING DIMENSIONS ARE IN INCHES (ANGLES IN DEGREES). SEE DETAIL A c DETAIL A 01 2. DIMENSIONS "D" AND "E" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. Minimum Land Pattern - TO-263-5 H DIM DIMENSIONS INCHES MILLIMETERS .125 .420 .360 .067 .042 .140 .625 3.18 10.67 9.14 1.70 1.07 3.56 15.88 K Z G H K P X Y Z G Y P NOTES: X 1. CONTROLLING DIMENSIONS ARE IN INCHES (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET.  2005 Semtech Corp. 13 www.semtech.com SC1565 POWER MANAGEMENT Outline Drawing - TO-220-3 aaa ØP BA B A E2 E/2 Q H1 D2 D D1 L1 L E A A1 SEATING PLANE DIM A A1 A2 b b2 c D D1 D2 E E1 E2 e e1 H1 L L1 N ØP Q aaa bbb ccc DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .140 .020 .080 .015 .045 .014 .560 .330 .480 .380 .270 .190 .055 .115 .027 .040 .057 .070 .024 .650 .355 .507 .420 .350 .030 .100 BSC .200 BSC .230 .270 .500 .580 .250 3 .139 .156 .100 .120 .014 .015 .010 4.82 3.56 0.51 1.40 2.03 2.92 0.38 0.69 1.02 1.14 1.45 1.78 0.36 0.61 14.22 16.51 8.38 9.02 12.19 12.88 9.65 10.66 6.86 8.90 0.76 2.54 BSC 5.08 BSC 5.84 6.86 12.70 14.73 6.35 3 3.53 3.96 2.54 3.05 0.36 0.38 0.25 C c 3 x b2 3xb bbb 2x e e1 NOTES: 1. CONTROLLING DIMENSIONS ARE IN INCHES. 2. DIMENSIONS "D" AND "E" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. A2 BA E1 ccc BA Outline Drawing - TO-220-5 aaa ØP BA B A E2 E/2 Q H1 D2 D D1 E A A1 SEATING PLANE DIM A A1 A2 b c D D1 D2 E E1 E2 e H1 L N ØP Q aaa bbb ccc DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .190 3.56 4.82 .055 0.51 1.40 .115 2.03 2.92 .031 .041 0.63 0.80 1.04 .024 0.36 0.61 .650 14.22 16.51 9.02 .355 8.38 .507 12.19 12.88 .420 9.65 10.66 .350 6.86 8.90 .030 0.76 1.70 BSC .067 BSC .230 .270 5.84 6.86 .500 .580 12.70 14.73 5 5 .139 .156 3.53 3.96 .100 .120 2.54 3.05 .014 0.36 .015 0.38 .010 0.25 .140 .020 .080 .025 .014 .560 .330 .480 .380 .270 - C L c e bbb 5X b BA A2 E1 ccc BA NOTES: 1. CONTROLLING DIMENSIONS ARE IN INCHES. 2. DIMENSIONS "D" AND "E" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. Contact Information Semtech Corporation Power Management Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804  2005 Semtech Corp. 14 www.semtech.com