SC622EVB

SC622 LED Light Management Unit POWER MANAGEMENT Features Input supply voltage range — 3.0V to 5.5V Charge pump modes — 1x, 1.5x and 2x Flash LED — 400mA max in flash mode, 250mA max continuous for spotlight Two user-configurable 100mA low-noise LDO regulators Charge pump frequency — 250kHz SemWireTM single wire interface — up to 75kbit/s External flash control pin to sync with camera Optional 1s flash time out Automatic sleep mode (LEDs off ) — IQ = 100μA Low shutdown current — 0.1μA (typical) Ultra-thin package — 3mm x 3mm x 0.6mm Fully WEEE and RoHS compliant Charge Pump, 400mA Flash LED, Dual LDOs, and SemWireTM Interface Description The SC622 is a high efficiency charge pump LED driver using Semtech’s proprietary mAhXLifeTM technology. Performance is optimized for use in single-cell Li-ion battery applications. The charge pump provides continuous or bursted current to a flash LED using a dedicated flash driver current sink. The load and supply conditions determine whether the charge pump operates in 1x, 1.5x, or 2x mode. A flashtimeout feature disables the flash if active for longer than 1 second. The SC622 also provides two low-dropout, lownoise linear regulators for powering a camera module or other peripheral circuits. The SC622 uses the proprietary SemWireTM single wire interface. The interface controls all functions of the device, including flash current and two LDO voltage outputs. The single wire implementation minimizes microcontroller and interface pin counts. The flash/spotlight output is triggered via either the SemWire interface or a dedicated pin. In sleep mode, the device reduces quiescent current to 100μA while continuing to monitor the serial interface. The two LDOs can be enabled when the device is in sleep mode. Total current reduces to 0.1μA in shutdown. Applications Cellular phone flash PDA flash Camera I/O and core power Typical Application Circuit FLASH VBAT CIN 2.2μF VIN SemWire Interface Flash Control SWIF FLEN VOUT COUT 4.7μF SC622 BYP CBYP 22nF GREF AGND PGND C1+ C1C1 2.2μF FL LDO1 LDO2 C2+ C2C2 2.2μF CLDO1 1.0μF VLDO1 = 2.5V to 3.3V VLDO2 = 1.5V to 1.8V CLDO2 1.0μF US Patents: 6,504,422; 6,794,926 July 19, 2007 © 2007 Semtech Corporation 1 SC622 Pin Configuration Ordering Information Device C1+ C1C2+ VOUT Package MLPQ-UT-20 3×3 Evaluation Board SC622ULTRT(1)(2) SC622EVB VIN 20 19 18 17 16 C2PGND FL NC NC 1 TOP VIEW 2 3 4 5 T 15 14 13 12 11 LDO1 LDO2 BYP NC SWIF Notes: (1) Available in tape and reel only. A reel contains 3,000 devices. (2) Available in lead-free package only. Device is WEEE and RoHS compliant. 6 7 8 9 10 MLPQ-UT-20; 3x3, 20 LEAD θJA = 35°C/W Marking Information 622 yyww xxxx yyww = Date Code xxxx = Semtech Lot No. AGND GREF FLEN NC NC 2 SC622 Absolute Maximum Ratings VIN (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +6.0 VOUT (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +6.0 C1+, C2+ (V) . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (VOUT + 0.3) Pin Voltage — All Other Pins (V) . . . . . . . . . -0.3 to (VIN + 0.3) VOUT Short Circuit Duration . . . . . . . . . . . . . . . . Continuous VLDO1, VLDO2 Short Circuit Duration. . . . . . . Continuous ESD Protection Level(1) (kV) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal Resistance, Junction to Ambient(2) (°C/W) . . . . 35 Maximum Junction Temperature (°C) . . . . . . . . . . . . . . +150 Storage Temperature Range (°C) . . . . . . . . . . . . -65 to +150 Peak IR Reflow Temperature (10s to 30s) (°C) . . . . . . . +260 Exceeding the above specifications may result in permanent damage to the device or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not recommended. NOTES: (1) Tested according to JEDEC standard JESD22-A114-B. (2) Calculated from package in still air, mounted to 3” x 4.5”, 4 layer FR4 PCB with thermal vias under the exposed pad per JESD51 standards. Recommended Operating Conditions Ambient Temperature Range (°C) . . . . . . . . -40 < TA < +85 VIN (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.0 < VIN < 5.5 VOUT (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5 < VOUT < 5.25 Thermal Information Electrical Characteristics Unless otherwise noted, TA = +25°C for Typ, -40ºC to +85°C for Min and Max, TJ(MAX) = 125ºC, VIN = 3.0V to 4.2V, CIN= C1= C2= 2.2μF, COUT = 4.7μF (ESR = 0.03Ω) Parameter Supply Specifications Shutdown Current Symbol Conditions Min Typ Max Units IQ(OFF) Shutdown, VIN = 4.2V Sleep (LDOs off ), SWIF = VIN Sleep (LDOs on), SWIF = VIN, VIN > ( VLDO + 300mV), ILDO < 200mA 0.1 100 220 3.8 4.6 4.6 2 160 μA μA 340 4.65 5.85 5.85 mA Total Quiescent Current IQ Charge pump in 1x mode Charge pump in 1.5x mode Charge pump in 2x mode Fault Protection Output Short Circuit Current Limit Over-Temperature Flash Mode Safety Timer(1) IOUT(SC) TOTP tFL(MAX) Flash sink active 0.75 VOUT pin shorted to GND 300 160 1.00 1.25 mA °C s 3 SC622 Electrical Characteristics (continued) Parameter Fault Protection (continued) Charge Pump Over-Voltage Protection VOVP VUVLO Undervoltage Lockout VUVLO-HYS 300 mV VOUT pin open circuit, VOUT = VOVP rising threshold Decreasing VIN 5.3 5.7 2.4 6.0 V V Symbol Conditions Min Typ Max Units Charge Pump Electrical Specifications Maximum Total Output Current Flash Current Setting Flash Current Accuracy 1x Mode to 1.5x Mode Falling Transition Voltage 1.5x Mode to 2x Mode Falling Transition Voltage Current Sink Off-State Leakage Current Pump Frequency IOUT(MAX) IFL IFL_ACC V TRANS1x V TRANS1.5x IBLn fPUMP VIN > 3.4V, VOUT(MAX) = 4.0V Nominal setting for FL VIN = 3.7V, IFL = 400mA, TA = 25°C IOUT = 100mA, VOUT = 3.3V IOUT = 100mA, VOUT = 4.5V(2) VIN = VFL = 4.2V VIN = 3.2V 400 50 -15 3.37 400 +15 mA mA % V 3.3 V 0.1 250 1 μA kHz LDO Electrical Specifications LDO1 Voltage Setting VLDO1 VLDO2 VLDO1, VLDO2 Range of nominal settings in 100mV increments Range of nominal settings in 100mV increments VIN = 3.7V, ILDO = 1mA LDO1, ILDO1 = 1mA, VOUT = 2.8V Line Regulation ΔVLINE LDO2, ILDO2 = 1mA, VOUT = 1.8V 1.3 4.8 2.5 3.3 V LDO2 Voltage Setting LDO1, LDO2 Output Voltage Accuracy 1.5 1.8 V -3.5 ±3 +3.5 % 2.1 7.2 mV 4 SC622 Electrical Characteristics (continued) Parameter Symbol Conditions Min Typ Max Units LDO Electrical Specifications (continued) VLDO1 = 3.3V, VIN = 3.7V, ILDO1 = 1mA to 100 mA VLDO2 = 1.8V, VIN = 3.7V, ILDO2 = 1mA to 100 mA ILDO1 = 100mA 200 2.5V < VLDO1 < 3V, f < 1kHz, CBYP = 22nF, ILDO1 = 50mA, VIN = 3.7V with 0.5VP-P ripple f < 1kHz, CBYP = 22nF, ILDO2 = 50mA, VIN = 3.7V with 0.5VP-P ripple LDO1, 10Hz < f < 100kHz, CBYP = 22nF, CLDO = 1μF, ILDO1 = 50 mA, VIN = 3.7V, 2.5V < VLDO1 < 3V LDO2, 10Hz < f < 100kHz, CBYP = 22nF, CLDO = 1μF, ILDO2 = 50 mA, VIN = 3.7V 50 dB 60 100 25 mV 20 150 mV mA Load Regulation ΔVLOAD Dropout Voltage(3) Current Limit VD ILIM PSRRLDO1 PSRRLDO2 en-LDO1 Power Supply Rejection Ratio 100 μVRMS 50 1 μF Output Voltage Noise en-LDO2 Minimum Output Capacitor CLDO(MIN) Digital I/O Electrical Specifications (FLEN, SWIF) Input High Threshold Input Low Threshold Input High Current Input Low Current SemWire Bit Rate SemWire Start-up Time(4) SemWire Disable Time(5) SemWire Data Latch Delay(6) VIH VIL IIH IIL fSWIF tEN tDIS DDL VIN = 5.5V VIN = 3.0V VIN = 5.5V VIN = 5.5V -1 -1 10 1 10 5 1.6 0.4 +1 +1 75 V V μA μA kbit/s ms ms bit Notes: (1) Once tripped, flash output will remain disabled until FLEN pin is cycled or reset via serial interface. (2) Test voltage is VOUT = 4.5V — a relatively extreme LED voltage — to force a transition during test. Typically VOUT = 3.3V for the white LED at 100mA. (3) Dropout is defined as (VIN - VLDO1) when VLDO1 drops 100mV from nominal. Dropout does not apply to LDO2 since it has a maximum output voltage of 1.8V. (4) The SemWire start-up time is the minimum period that the SWIF pin must be held high to enable the part before commencing communication. (5) The SemWire disable time is the minimum period that the SWIF pin must be pulled low to shut the part down. (6) The SemWire data latch delay is the maximum duration after communication has ended before the register is updated. 5 SC622 Typical Characteristics Battery Current — 250mA Spotlight 450 VOUT=3.47V, IOUT=250mA, 25°C 100 Efficiency — 250mA Spotlight VOUT=3.47V, IOUT=250mA, 25°C 400 Battery Current (mA) 90 % Efficiency 350 80 300 70 250 60 200 4.2 4 3.8 3.6 VIN (V) 3.4 3.2 3 50 4.2 4.0 3.8 3.6 VIN (V) 3.4 3.2 3.0 Battery Current — 100mA Spotlight 180 VOUT=3.22V, IOUT=100mA, 25°C 100 Efficiency — 100mA Spotlight VOUT=3.22V, IOUT=100mA, 25°C 160 Battery Current (mA) 90 % Efficiency 140 80 120 70 100 60 80 4.2 4 3.8 3.6 VIN (V) 3.4 3.2 3 50 4.2 4 3.8 3.6 VIN (V) 3.4 3.2 3 Battery Current — 50mA Spotlight 65 VOUT=3.0V, IOUT=50mA, 25°C 100 Efficiency — 50mA Spotlight VOUT=3.0V, IOUT=50mA, 25°C 60 90 Battery Current (mA) 55 % Efficiency 4 3.8 3.6 VIN (V) 3.4 3.2 3 80 50 70 45 60 40 4.2 50 4.2 4 3.8 3.6 VIN (V) 3.4 3.2 3 6 SC622 Typical Characteristics (continued) Flash Current — 300mA 390 VOUT=3.58V at 25°C 490 Flash Current — 400mA VOUT=3.39V at 25°C 360 460 Flash Current (mA) Flash Current (mA) 330 430 300 400 270 370 240 340 310 4.2 210 4.2 4.0 3.8 3.6 VIN (V) 3.4 3.2 3.0 4.0 3.8 3.6 VIN (V) 3.4 3.2 3.0 Spotlight Current — 50mA 53 VOUT=3.02V at 25°C 340 Spotlight Current — 250mA VOUT=3.50V at 25°C 52 Spotlight Current (mA) Spotlight Current (mA) 310 51 280 50 250 49 220 48 47 4.2 190 160 4.2 4.0 3.8 3.6 VIN (V) 3.4 3.2 3.0 4.0 3.8 3.6 VIN (V) 3.4 3.2 3.0 PSRR vs. Frequency (LDO1) 0 -10 -20 PSRR (dB) PSRR vs. Frequency (LDO2) 0 -10 -20 PSRR (dB) VIN=3.7V at 25°C, ILDO1=50mA, VLDO1=2.8V VIN=3.7V at 25°C, ILDO2=50mA, VLDO2=1.8V -30 -40 -50 -60 -70 10 100 Frequency (Hz) 1000 10000 -30 -40 -50 -60 -70 10 100 Frequency (Hz) 1000 10000 7 SC622 Typical Characteristics (continued) Load Regulation (LDO1) 24 VLDO1=3.3V, VIN=3.7V, 25°C Load Regulation (LDO2) 24 VLDO2=1.8V, VIN=3.7V, 25°C 16 Output Voltage Variation (mV) 16 Output Voltage Variation (mV) 8 8 0 0 -8 -8 -16 -24 0 30 60 ILDO1(mA) 90 120 150 -16 -24 0 30 60 ILDO2(mA) 90 120 150 Noise vs Load Current (LDO1) 100 VLDO1=2.8V, VIN=3.7V, 25°C 100 Noise vs Load Current (LDO2) VLDO2=1.8V, VIN=3.7V, 25°C 90 80 Noise (μV) 70 Noise (μV) 80 60 40 60 20 50 0 20 40 ILDO1 (mA) 60 80 100 0 0 20 40 ILDO2 (mA) 60 80 100 Line Regulation (LDO1) 2 VLDO1=2.8V, ILDO1=1mA, 25°C 2 Line Regulation (LDO2) VLDO2=1.8V, ILDO2=1mA, 25°C Output Voltage Variation (mV) 0 Output Voltage Variation (mV) 1 1 0 -1 -1 -2 -2 -3 4.2 4.0 3.8 3.6 VIN (V) 3.4 3.2 3.0 -3 4.2 4.0 3.8 3.6 VIN (V) 3.4 3.2 3.0 8 SC622 Typical Characteristics (continued) Load Transient Response (LDO1) — Rising Edge VIN=3.7V, VLDO1=2.8V, ILDO1=1 to 100mA Load Transient Response (LDO2) — Rising Edge VIN=3.7V, VLDO2=1.8V, ILDO2=1 to 100mA VLDO1 (50mV/div) VLDO2 (50mV/div) ILDO1 (100mA/div) ILDO2 (100mA/div) Time (20μs/div) Time (20μs/div) Load Transient Response (LDO1) — Falling Edge VIN=3.7V, VLDO1=2.8V, ILDO1=100 to 1mA VLDO1 (50mV/div) Load Transient Response (LDO2) — Falling Edge VIN=3.7V, VLDO2=1.8V, ILDO2=100 to 1mA VLDO2 (50mV/div) ILDO1 (100mA/div) ILDO2 (100mA/div) Time (200μs/div) Time (200μs/div) 9 SC622 Typical Characteristics (continued) Output Short Circuit Current Limit VOUT=0V, VIN=4.2V, 25°C Flash Mode Safety Timer VIN=3.7V, 25°C VOUT (1V/div) VFLEN (5V/div) VOUT (2V/div) IOUT (100mA/div) IFL (200mA/div) Time (1ms/div) Time (200ms/div) Output Open Circuit Protection VIN=3.7V, 25°C VFL (500mV/div) VFLEN (5V/div) Flash Current Pulse IFL=400mA, VIN=3.7V, VOUT=3.7V, 25°C 6V VOUT (2V/div) VOUT (2V/div) 0V IFL (100mA/div) IFL (200mA/div) Time (4ms/div) Time (40ms/div) 10 SC622 Pin Descriptions Pin # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 T Pin Name C2PGND FL NC NC NC NC AGND GREF FLEN SWIF NC BYP LDO2 LDO1 VOUT C2+ C1+ VIN C1THERMAL PAD Pin Function Negative connection to bucket capacitor 2 — requires a 2.2μF capacitor connected to C2+ Ground pin for high current charge pump and Flash LED driver Current sink output for flash LED(s) Unused pin — do not terminate Unused pin — do not terminate Unused pin — do not terminate Unused pin — do not terminate Analog ground pin — connect to ground and separate from PGND current Ground reference — connect to ground Control pin for flash LED(s) — high = ON, low = OFF SemWire single wire interface pin — used to enable/disable the device and to set up all internal registers (refer to Register Map and SemWire Interface sections) Unused pin — do not terminate Bypass pin for voltage reference — connect with a 22nF capacitor to AGND Output of LDO2 — connect with a 1μF capacitor to AGND Output of LDO1 — connect with a 1μF capacitor to AGND Charge pump output — all LED anode pins should be connected to this pin — requires a 4.7μF capacitor to PGND Positive connection to bucket capacitor 2 — requires a 2.2μF capacitor connected to C2Positive connection to bucket capacitor 1 — requires a 2.2μF capacitor connected to C1Battery voltage input — connect with a 2.2μF capacitor to PGND Negative connection to bucket capacitor 1 — requires a 2.2μF capacitor connected to C1+ Thermal pad for heatsinking purposes — connect to ground plane using multiple vias — not connected internally 11 SC622 Block Diagram C1+ 18 C120 C2+ 17 C21 VOUT VIN 19 VIN mAhXLifeTM Fractional Charge Pump (1x, 1.5x, 2x) 16 2 VOUT PGND SWIF 11 SemWireTM Digital Interface and Logic Control Oscillator 4 5 6 Current Setting DAC 7 3 NC NC NC NC FL FLEN 10 9 GREF BYP 13 Bandgap Reference Voltage Setting DAC VIN LDO1 NC 12 VIN 15 LDO1 LDO2 AGND 8 14 LDO2 12 SC622 Applications Information General Description This design is optimized for handheld applications supplied from a single Li-Ion cell and includes the following key features: 2.2μF to support the charge pump current requirements. The device also requires a 2.2μF capacitor on the VIN pin and a 4.7μF capacitor on the VOUT pin to minimize noise and support the output drive requirements. Capacitors with X7R or X5R ceramic dielectric are strongly recommended for their low ESR and superior temperature and voltage characteristics. Y5V capacitors should not be used as their temperature coefficients make them unsuitable for this application. • • • • A high efficiency fractional charge pump that supplies power to the flash LED An LED flash output that provides up to 400mA of momentary current or up to 250mA of continuous spotlight current Two adjustable LDOs with outputs ranging from 2.5V to 3.3V for LDO1 and 1.5V to 1.8V for LDO2, adjustable in 100mV increments A SemWire single wire interface that provides control of all device functions LED Flash and Spotlight Current Sink A single output current sink is provided to drive both flash and spotlight functions. In flash mode, this current sink provides up to 400mA for a flash LED or array of parallel LEDs. Flash current settings are in 50mA increments from 50mA to 400mA. The FLEN pin directly triggers the FLASH function when pulled high, or it can be wired to VIN to enable software control via the serial interface. In spotlight mode, the output can be set for up to 250mA of continuous current. Settings are available in 50mA increments from 50mA to 250mA. Continuous operation above 250mA is not recommended due to high power dissipation. High Current Fractional Charge Pump The flash output is supported by a high efficiency, high current fractional charge pump output at the VOUT pin. The charge pump multiplies the input voltage by 1, 1.5, or 2 times. The charge pump switches at a fixed frequency of 250kHz in 1.5x and 2x modes and is disabled in 1x mode to save power and improve efficiency. The mode selection circuit automatically selects the 1x, 1.5x or 2x mode based on circuit conditions. Circuit conditions such as low input voltage, high output current, or high LED voltage place a higher demand on the charge pump output. A higher numerical mode may be needed momentarily to maintain regulation at the VOUT pin during intervals of high demand, such as the high current of an LED flash or the droop at the VIN pin during a supply voltage transient. The charge pump responds to these momentary high demands, setting the charge pump to the optimum mode (1x, 1.5x or 2x), as needed to deliver the output voltage and load current while optimizing efficiency. Hysteresis is provided to prevent mode toggling. The charge pump requires two bucket capacitors for low ripple operation. One capacitor must be connected between the C1+ and C1- pins and the other must be connected between the C2+ and C2- pins as shown in the typical application circuit diagram. These capacitors should be equal in value, with a minimum capacitance of Flash and Spotlight Safety Timer A safety timer disables the flash and spotlight output current sink if the sink remains active for an extended period. The timer protects the SC622 and the LED from high power dissipation that can cause overheating. The timer’s default state is on, but the timer may be disabled via the serial interface to allow continuous output current in spotlight mode. The safety timer affects only the FL pin and will turn off the sink after a period of 1 second. The timer may be reset by either forcing the FLEN pin low or by resetting the Flash/Spotlight control bits via the interface. Programmable LDO Outputs Two low dropout (LDO) regulators are provided for camera module I/O and core power. Each LDO has at least 100mA of available load current with ±3.5% accuracy. The minimum current limit is 200mA, so outputs greater than 100mA are possible at somewhat reduced accuracy. 13 SC622 Applications Information (continued) A 1μF, low ESR capacitor should be used as a bypass capacitor on each LDO output to reduce noise and ensure stability. In addition, it is recommended that a minimum 22nF capacitor be connected from the BYP pin to ground to minimize noise and achieve optimum power supply rejection. A larger capacitor can be used for this function, but at the expense of increasing turnon time. Capacitors with X7R or X5R ceramic dielectric are strongly recommended for their low ESR and superior temperature and voltage characteristics. Y5V capacitors should not be used as their temperature coefficients make them unsuitable for this application. excessively high output voltage. In the event of an open circuit at VOUT, the charge pump runs in open loop and the voltage rises up to the OVP limit. OVP operation is hysteretic, meaning the charge pump will momentarily turn off until VOUT is sufficiently reduced. The maximum OVP threshold is 6.0V, allowing the use of a ceramic output capacitor rated at 6.3V with no fear of over-voltage damage. Over-Temperature Protection The Over-Temperature (OT) protection circuit helps prevent the device from overheating and experiencing a catastrophic failure. When the junction temperature exceeds 160°C, the device goes into thermal shutdown with all outputs disabled until the junction temperature is reduced. All register information is retained during thermal shutdown. Charge Pump Output Current Limit The device also limits the charge pump current at the VOUT pin. When VOUT is shorted to ground, the typical output current limit is 300mA. The current limiting is triggered by an output under-voltage lockout below 2V. The output returns to normal when the short is removed and VOUT is above 2.5V. Above 2.5V, a typical current limit of 1A applies. LDO Current Limit The device limits the output currents of LDO1 and LDO2 to help prevent it from overheating and to protect the loads. The minimum limit is 200mA, so load current greater than the rated 100mA can be used with degraded accuracy and larger dropout without tripping the current limit. LED Float Detection Float detect is a fault detection feature of the LED current sink output. If the output is programmed to be enabled and an open circuit fault occurs at the current sink output, the output will be disabled to prevent a sustained output OVP condition from occurring due to the resulting open loop. Shutdown State The device is disabled when the SWIF pin is low. All registers are reset to default condition when SWIF is low. Sleep Mode When the LED is off, sleep mode is activated. This is a reduced current mode that helps minimize overall current consumption by turning off the clock and the charge pump while continuing to monitor the serial interface for commands. Both LDOs can be powered up while in sleep mode. SemWire Single Wire Interface Functions All device functions can be controlled via the SemWire single wire interface. The interface is described in detail in the SemWire Interface section of the datasheet. Protection Features The SC622 provides several protection features to safeguard the device from catastrophic failures. These features include: • • • • • Output Open Circuit Protection Over-Temperature Protection Charge Pump Output Current Limit LDO Current Limit LED Float Detection Output Open Circuit Protection Over-Voltage Protection (OVP) is provided at the VOUT pin to prevent the charge pump from producing an 14 SC622 Applications Information (continued) PCB Layout Considerations The layout diagram in Figure 1 illustrates a proper two-layer PCB layout for the SC622 and supporting components. Following fundamental layout rules is critical for achieving the performance specified in the Electrical Characteristics table. The following guidelines are recommended when developing a PCB layout: • • • • • Place all bypass and decoupling capacitors — C1, C2, CIN, COUT, CLDO1, CLDO2, and CBYP as close to the device as possible. All charge pump current passes through VIN, VOUT, and the bucket capacitor connection pins. Ensure that all connections to these pins make use of wide traces so that the resistive drop on each connection is minimized. The thermal pad should be connected to the ground plane using multiple vias to ensure proper thermal connection for optimal heat transfer. • • Make all ground connections to a solid ground plane as shown in the example layout (Figure 3). If a ground layer is not feasible, the following groupings should be connected: PGND — CIN, COUT AGND — Ground Pad, CLDO1, CLDO2, CBYP If no ground plane is available, PGND and AGND should be routed back to the negative battery terminal as separate signals using thick traces. Joining the two ground returns at the terminal prevents large pulsed return currents from mixing with the low-noise return currents of the LDOs. Both LDO output traces should be made as wide as possible to minimize resistive losses. GND CIN C1 C2 VOUT C1+ C2+ VOUT COUT CLDO1 LDO1 VIN C2- GND VIN C1- PGND LDO2 CLDO2 Figure 2 — Layer 1 FL SC622 BYP NC NC NC SWIF CBYP AGND GREF NC Figure 1 — Recommended PCB Layout NC FLEN Figure 3 — Layer 2 15 SC622 Register Map Address 0x02 0x03 D7 0(1) 0(1) D6 0(1) LDO2_2 D5 0(1) LDO2_1 D4 FLTO LDO2_0 D3 FL_2 LDO1_3 D2 FL_1 LDO1_2 D1 FL_0 LDO1_1 D0 FL/SPLB LDO1_0 Reset Value 0x10 0x00 Description Flash/Spotlight Control LDO Control Notes: (1) 0 = always write a 0 to these bits Register and Bit Definitions Flash/Spotlight Control Register (0x02) This register is used to configure the flash time-out feature, the flash or spotlight current, and select flash or spotlight current ranges. FLTO This bit is used to enable the flash safety time-out feature. The default state is enabled with FLTO = 1. If this bit is set, the device will turn off the flash after a nominal period of 1s. Two ways to re-enable the flash function after a safety time-out are: Pull the FLEN pin low to re-enable the flash function Clear and re-write FL[2:0] Table 1 — Flash/Spotlight Control Bits FL_2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 FL_1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 FL_0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 FL/ SPLB 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 Flash/Spotlight Current (mA) OFF 50 100 150 200 250 250 250 OFF 300(1) 350(1) 400(1) 400(1) 400(1) 400(1) 400(1) • • FL[2:0] These bits are used to set the current for the flash current sink when configured for flash or spotlight by the FL/ SPLB bit. Bits FL[2:0] set the flash or spotlight current, as shown in Table 1. Note: (1) When on continuously, the device may reach the temperature limit with 300mA and higher. 16 SC622 Register and Bit Definitions (continued) FL/SPLB This bit is used to select either the flash or spotlight current ranges. If this bit is set, the FL current sink can be used to drive a flash of maximum duration 500ms and the current range will be the high (flash) current range. If this bit is cleared, the FL current sink can be used to drive a continuous spotlight at a lower current and the current range will be the lower (spotlight) current range, as shown in Table 1. LDO Control Register (0x03) This register is used to enable the LDOs and to set their output voltages. LDO2[2:0] These bits are used to set the output voltage of LDO2, as shown in Table 2. Table 2 — LDO2 Control Bits LDO2_2 0 0 0 0 1 LDO1[3:0] These bits set the output voltage of LDO1, as shown in Table 3. Table 3 — LDO1 Control Bits LDO1_3 0 0 0 0 0 0 0 0 1 1 LDO1_2 0 0 0 0 1 1 1 1 0 0 LDO1_1 0 0 1 1 0 0 1 1 0 0 LDO1_0 0 1 0 1 0 1 0 1 0 1 LDO1 Output Voltage OFF 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V 2.5V OFF LDO2_1 0 0 1 1 0 LDO2_0 0 1 0 1 0 LDO2 Output Voltage OFF 1.8V 1.7V 1.6V 1.5V OFF 1010 through 1111 are not used 101 through 111 are not used 17 SC622 SemWire Interface Semwire Interface Functions The SWIF pin is a write-only single wire interface. It provides the capability to address up to 32 registers to control device functionality. The protocol for using this interface is described in the following subsections. Driving the SWIF Pin The SWIF pin should be driven by a GPIO from the system microcontroller. The output level can be configured as either a push-pull driver (TTL or CMOS levels) or as an open drain driver with an external pull-up resistor. Enabling the Device The SWIF pin must be pulled from low to high for a period of greater than 1ms (tEN) to enable the device into the sleep state. In the sleep state, the device bandgap is active, UVLO monitoring is active, and the serial interface is monitored for communication. Automatic Sleep State If the flash current sink is disabled, the device automatically enters the sleep state in order to minimize the current draw from the battery. When in sleep mode, the charge pump and oscillator are both disabled. The LDOs remain on if enabled. Disabling the Device The SWIF pin must be pulled from high to low for a period greater than 10ms (tDIS) in order to shut down the device. In this state the device remains disabled until the SWIF pin is pulled high for a period greater than 1ms. All registers return to the default state, resetting all bits to zero except for FLT0, which defaults to one. SemWire Communication Protocol and Timing The following six step communication sequence controls all device functions when the device is enabled. 1. OSC On — The SWIF pin is toggled low for one bit duration and high for one bit duration in order to enable the oscillator. The oscillator is turned off in the sleep state to minimize quiescent current. 2. Sample — The SWIF pin is toggled low for one bit duration and high for one bit duration. During this time, the device samples the bit rate and determines the bit rate at which the register address and data values that follow will arrive. The sample rate is at least 20 times the bit rate ensuring robust communication synchronization. 3. Start — The SWIF pin is pulled low for one bit duration, which starts communication with the target register. 4. Address — The next 5 bits are the address of the target register — MSB first, LSB last. 5. Data — The next 8 bits are the data written to the target register — MSB first, LSB last. 6. Standby — After the last data bit is sent, the SWIF pin is pulled high for 5 bit durations to return the device to standby before another data write can take place. If all LEDs are disabled, the device will go back to sleep mode. NOTE: The bit rate must be set by the host controller to a rate that is between the minimum and maximum frequencies listed in the Electrical Characteristics section. 18 SC622 SemWire Interface (continued) Single Write Operation Device Disabled Device Enabled Into Sleep OSC On Sample Register Address Data 5 Resume high Sleep if bits all LEDs Min. are off Device Disabled when low for tDIS Start A4 t > tEN A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 t > DDL t > tDIS Concatenated Write Operation OSC On Sample Register Address Data OSC On (Repeated) D2 D1 D0 t > DDL Sample Start A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 Start To concatenate write operations, repeat Osc On, Sample and Start after the DO bit of the previous sequence as shown. 19 SC622 Outline Drawing — MLPQ-UT-20 3x3 A D B DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MAX MIN NOM MAX A A1 A2 b D D1 E E1 e L N aaa bbb .020 .000 .024 .002 0.50 0.00 0.60 0.05 (.006) .006 .008 .010 .114 .118 .122 .061 .067 .071 .114 .118 .122 .061 .067 .071 .016 BSC .012 .016 .020 20 .003 .004 (0.1524) 0.15 0.20 0.25 2.90 3.00 3.10 1.55 1.70 1.80 2.90 3.00 3.10 1.55 1.70 1.80 0.40 BSC 0.30 0.40 0.50 20 0.08 0.10 PIN 1 INDICATOR (LASER MARK) E A2 A aaa C A1 e LxN E/2 E1 2 1 N SEATING PLANE C D1 D/2 bxN bbb NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). CAB 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS . 3. DAP is 1.90 x 190mm. 20 SC622 Land Pattern — MLPQ-UT-20 3x3 H R DIM C G H K P R X Y Z DIMENSIONS INCHES (.114) .083 .067 .067 .016 .004 .008 .031 .146 MILLIMETERS (2.90) 2.10 1.70 1.70 0.40 0.10 0.20 0.80 3.70 (C) K G Z Y X P NOTES: 1. 2. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD SHALL BE CONNECTED TO A SYSTEM GROUND PLANE. FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR FUNCTIONAL PERFORMANCE OF THE DEVICE. 3. Contact Information Semtech Corporation Power Management Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111 Fax: (805) 498-3804 www.semtech.com 21