SC653EVB

SC653 Light Management Unit with 2 LDOs and SemPulse® Interface POWER MANAGEMENT Features Input supply voltage range — 2.9V to 5.5V Four programmable current sinks with 29 steps from 0mA to 25mA Very high efficiency charge pump driver system with three modes — 1x, 1.5x and 2x Two programmable 200mA low-noise LDO regulators Charge pump frequency — 250kHz SemPulse single wire interface Backlight current accuracy — ±1.5% typical Backlight current matching — ±0.5% typical Fade-in/fade-out feature for main backlight Automatic sleep mode (LEDs off ) — IQ = 100μA Shutdown current — 0.1μA (typical) Ultra-thin package — 2.3 x 2.3 x 0.6 (mm) Lead-free and halogen-free WEEE and RoHS compliant Description The SC653 is a highly integrated light management unit that provides two low-noise LDOs, a multi-mode high efficiency charge pump, and four programmable LED drivers. Performance is optimized for use in single-cell Liion battery applications. The load and supply conditions determine whether the charge pump operates in 1x, 1.5x, or 2x mode. A programmable fading feature can be enabled to gradually adjust the backlight current, simplifying control software. The low-dropout, low-noise linear regulators can be used for powering a camera module or other peripheral circuits. The SC653 uses the proprietary SemPulse® single wire interface. This interface controls all functions of the device, including backlight currents and LDO voltage outputs. The single wire interface minimizes microcontroller and interface pin counts. The SC653 enters sleep mode when all the LED drivers are disabled. In this mode, the quiescent current is reduced while the device continues to monitor the SemPulse interface. The two LDOs can be enabled when the device is in sleep mode. Applications Cellular phones, smart phones, and PDAs LCD modules Portable media players Digital cameras and GPS units Display backlighting and LED indicators Typical Application Circuit VBAT = 2.9V to 5.5V CIN 2.2μF GND2 GND2 SC653 IN SPIF GND2 MAIN BACKLIGHT OUT COUT 2.2μF BL1 BL2 BL3 BL4 LDO1 LDO2 VLDO1 = 1.5V to 3.3V VLDO2 = 1.2V to 1.8V CLDO1 1μ F GND1 SemPulse Interface ENL1 ENL2 BYP CBYP 22nF GND1 GND2 C1+ C1- C2+ C2C2 GND1 2.2μF GND1 GND2 CLDO2 1μ F C1 2.2μF US Patents: 6,504,422; 6,794,926 1 October 21, 2009 © 2009 Semtech Corporation SC653 Pin Configuration LDO2 LDO1 GND2 Ordering Information Device OUT IN Package MLPQ-UT-18 2.3×2.3 Evaluation Board SC653ULTRT(1)(2) SC653EVB 13 18 17 16 15 14 BYP 1 TOP VIEW C2+ BL1 BL2 2 12 C1+ C1- Notes: (1) Available in tape and reel only. A reel contains 3,000 devices. (2) Lead-free packaging only. Device is WEEE and RoHS compliant, and halogen-free. 3 11 BL3 T 4 10 C2- 5 6 7 8 9 GND1 ENL1 BL4 MLPQ-UT-18; 2.3x2.3, 18 LEAD θJA = 45°C/W Marking Information 653 yyww xxxx yyww = date code xxxx = Semtech Lot Number ENL2 SPIF 2 SC653 Absolute Maximum Ratings IN, OUT (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +6.0 C1+, C2+ (V) . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (VOUT + 0.3) Pin Voltage — All Other Pins (V) . . . . . . . . . -0.3 to (VIN + 0.3) OUT — Short Circuit Duration . . . . . . . . . . . . . . Continuous LDO1, LDO2 — Short Circuit Duration . . . . . . Continuous ESD Protection Level(1) (kV) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended Operating Conditions Ambient Temperature Range (°C) . . . . . . . . -40 ≤ TA ≤ +85 Input Voltage (V) . . . . . . . . . . . . . . . . . . . . . . . 2.9 ≤ VIN ≤ 5.5 Output Voltage (V) . . . . . . . . . . . . . . . . . . . . . 2.5 ≤ VOUT ≤ 5.25 Voltage Difference between any two LEDs (V). . ΔVF < 1.0(2) Thermal Information Thermal Resistance, Junction to Ambient(3) (°C/W) . . . . . . . 45 Maximum Junction Temperature (°C) . . . . . . . . . . . . . . .+150 Storage Temperature Range (°C) . . . . . . . . . . . . -65 to +150 Peak IR Reflow Temperature (10s to 30s) (°C) . . . . . . . +260 Exceeding the above specifications may result in permanent damage to the device or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not recommended. NOTES: (1) Tested according to JEDEC standard JESD22-A114. (2) ΔVF(max) = 1.0V when VIN = 2.9V, higher VIN supports higher ΔVF(max) (3) Calculated from package in still air, mounted to 3” x 4.5”, 4 layer FR4 PCB with thermal vias under the exposed pad per JESD51 standards. Electrical Characteristics Unless otherwise noted, TA = +25°C for Typ, -40ºC to +85°C for Min and Max, TJ(MAX) = 125ºC, VIN = 3.7V, CIN= C1= C2= 2.2μF, COUT = 2.2μF (ESR = 0.03Ω), ΔVF ≤ 1.0V(1) Parameter Supply Specifications Shutdown Current Symbol Conditions Min Typ Max Units IQ(OFF) Shutdown Sleep (LDOs off ), SPIF = VIN(2) Sleep (LDOs on), SPIF = VIN(2), ILDOn = 0mA 0.1 100 2 μA μA 220 3.8 4.6 4.6 mA Total Quiescent Current IQ Charge pump in 1x mode, IOUT = 20mA, IBLn = 5mA Charge pump in 1.5x mode, IOUT = 20mA, IBLn = 5mA Charge pump in 2x mode, IOUT = 20mA, IBLn = 5mA Charge Pump Electrical Specifications Maximum Total Output Current Backlight Current Setting Backlight Current Accuracy Backlight Current Matching IOUT(MAX) IBL IBL_ACC IBL-BL VIN > 3.2V, sum of all active LED currents, VOUT(MAX) = 4.2V Nominal setting for BL1 thru BL4 IBLn = 12mA(3), TA = 25°C IBLn = 12mA(4) 100 0.5 -8 -3.5 ±1.5 ±0.5 25 +8 +3.5 mA mA % % 3 SC653 Electrical Characteristics (continued) Parameter Symbol Conditions Min Typ Max Units Charge Pump Electrical Specifications (continued) 1x Mode to 1.5x Mode Falling Transition Voltage 1.5x Mode to 1x Mode Hysteresis 1.5x Mode to 2x Mode Falling Transition Voltage 2x Mode to 1.5x Mode Hysteresis Current Sink Off-State Leakage Current Pump Frequency LDO Electrical Specifications LDO1 Voltage Setting LDO2 Voltage Setting LDO1, LDO2 Output Voltage Accuracy VLDO1 VLDO2 Range of nominal settings in 100mV increments Range of nominal settings in 100mV increments ILDOn = 1mA, TA = 25°C, 2.9V ≤ VIN ≤ 4.2V ΔVLDO ILDOn = 1mA to 100mA, 2.9V ≤ VIN ≤ 4.2V ILDO1 = 1mA, VOUT = 2.8V Line Regulation ΔVLINE ILDO2 = 1mA, VOUT = 1.8V VLDO1 = 3.3V, ILDO1 = 1mA to 100 mA Load Regulation ΔVLOAD VLDO2 = 1.8V, ILDO2 = 1mA to 100 mA Dropout Voltage(6) VD PSRRLDO1 Power Supply Rejection Ratio PSRRLDO2 en-LDO1 Output Voltage Noise en-LDO2 Minimum Output Capacitor CLDO(MIN) ILDO1 = 150mA 1.5V < VLDO1 < 3.0V, f < 1kHz, CBYP = 22nF, ILDO1 = 50mA with 0.5VP-P supply ripple 1.2V < VLDO2, f < 1kHz, CBYP = 22nF, ILDO2 = 50mA, with 0.5VP-P supply ripple LDO1, 10Hz < f < 100kHz, CBYP = 22nF, CLDOn = 1μF, ILDO1 = 50 mA, 1.5V < VLDO1 < 3.0V LDO2, 10Hz < f < 100kHz, CBYP = 22nF, CLDO = 1μF, ILDO2 = 50 mA 150 55 dB 60 20 200 mV 1.3 4.8 25 mV -3.5 ±3 2.1 +3.5 7.2 mV % 1.5 1.2 -3 3.3 1.8 +3 V V % V TRANS1x VHYST1x V TRANS1.5x VHYST1.5x IBLn fPUMP IOUT = 40mA, IBLn = 10mA, VOUT = 3.2V IOUT = 40mA, IBLn = 10mA, VOUT = 3.2V IOUT = 40mA, IBLn = 10mA, VOUT = 4.0V(5) IOUT = 40mA, IBLn = 10mA, VOUT = 4.0V(5) VIN = VBLn = 4.2V VIN = 3.2V 3.27 250 2.92 300 0.1 250 1 V mV V mV μA kHz 100 μVRMS 50 1 μF 4 SC653 Electrical Characteristics (continued) Parameter Symbol Conditions Min Typ Max Units Digital I/O Electrical Specifications (SPIF, ENL1, ENL2) Input High Threshold(7) Input Low Threshold(7) Input High Current Input Low Current VIH VIL IIH IIL VIN = 5.5V VIN = 3.0V VIN = 5.5V VIN = 5.5V -1 -1 1.6 0.4 +1 +1 V V μA μA SemPulse Electrical Specifications (SPIF) SemPulse Start-up Time(8) Bit Pulse Duration(7) Duration Between Bits(7) Hold Time - Address(7) Hold Time - Data(7) Bus Reset Time(7) Shutdown Time(9) Fault Protection Output Short Circuit Current Limit LDO Current Limit IOUT(SC) ILIM TOTP Over-Temperature THYS Charge Pump Over-Voltage Protection VOVP VUVLO-OFF Under Voltage Lockout VUVLO-HYS Hysteresis 800 mV Notes: (1) ΔVF is the voltage difference between any two LEDs. (2) SPIF is high for more than 10ms (3) Subscript n = 1 and 2 for the LDOs, and n = 1, 2, 3, and 4 for the backlights. (4) Current matching equals ± [IBL(MAX) - IBL(MIN] / [IBL(MAX) + IBL(MIN)]. (5) Test voltage is VOUT = 4.0V — a relatively extreme LED voltage — to force a transition during test. Typically VOUT = 3.2V for white LEDs. (6) Dropout is defined as (VIN - VLDO1) when VLDO1 drops 100mV from nominal. Dropout does not apply to LDO2 since it has a maximum output voltage of 1.8V. (7) The source driver used to provide the SemPulse output must meet these limits. (8) The SemPulse start-up time is the minimum time that the SPIF pin must be held high to enable the part before starting communication. (9) The SemPulse shutdown time is the minimum time that the SPIF pin must be pulled low to shut the part down. Hysteresis OUT pin open circuit, VOUT = VOVP rising threshold Increasing VIN 5.3 30 5.7 2.7 6.0 °C V V OUT pin shorted to GND VLDOn enabled Rising threshold 200 165 250 mA mA °C tSU tHI tLO tHOLDA tHOLDD tBR tSD SPIF is held high SPIF is held high SPIF is held high SPIF is pulled low 1 0.75 0.75 500 500 10 10 250 250 5000 ms μs μs μs μs ms ms 5 SC653 Typical Characteristics Battery Current (4 LEDs) — 25mA Each 180 VOUT = 3.56V, IOUT = 100mA, 25°C 100 Backlight Efficiency (4 LEDs) — 25mA Each VOUT = 3.56V, IOUT = 100mA, 25°C 160 Battery Current (mA) 90 140 Efficiency (%) 80 120 70 100 60 80 4.2 3.9 3.6 VIN(V) 3.3 3 2.7 50 4.2 3.9 3.6 VIN(V) 3.3 3 2.7 Battery Current (4 LEDs) — 12mA Each 90 VOUT = 3.41V, IOUT = 48mA, 25°C 100 Backlight Efficiency (4 LEDs) — 12mA Each VOUT = 3.41V, IOUT = 48mA, 25°C 80 Battery Current (mA) 90 70 Efficiency (%) 3.9 3.6 3.3 3 2.7 80 60 70 50 60 40 4.2 VIN(V) 50 4.2 3.9 3.6 VIN(V) 3.3 3 2.7 Battery Current ( 4 LEDs) — 5.0mA Each 50 VOUT = 3.27V, IOUT = 20mA, 25°C Backlight Efficiency ( 4 LEDs) — 5.0mA Each 100 VOUT = 3.27V, IOUT = 20mA, 25°C 40 90 Battery Current (mA) 30 Efficiency (%) 3 80 20 70 10 60 0 4.2 3.9 3.6 VIN(V) 3.3 2.7 50 4.2 3.9 3.6 VIN(V) 3.3 3 2.7 6 SC653 Typical Characteristics (continued) PSRR vs. Frequency — 1.8V 0 -10 -20 VIN = 3.7V, IOUT = 50mA, TA = 25°C 0 -10 -20 PSRR vs. Frequency — 2.8V VIN = 3.7V, IOUT = 50mA, TA = 25°C PSRR (dB) -30 -40 -50 -60 -70 PSRR (dB) 10 100 1000 10000 -30 -40 -50 -60 -70 Frequency (Hz) 10 100 Frequency (Hz) 1000 10000 Line Regulation (LDO2) 1.5 ILDO1 = 1mA, VLDO1 = 1.2V and 1.8V, 25°C 3 Line Regulation (LDO1) ILDO1 = 1mA, VLDO1 = 2.8V, 25°C 1 Output Voltage Variation (mV) 2 Output Voltage Variation (mV) 0.5 1.2V 0 1.8V -0.5 1 0 2.8V -1 -1 -2 -1.5 4.2 -3 3.9 3.6 VIN(V) 3.3 3 2.7 4.2 3.9 3.6 VIN(V) 3.3 3 2.7 LDO Noise vs. Load Current — 1.8V 100 VLDO=1.8V, VIN=3.7V, 25°C, 10Hz < f < 100kHz LDO Noise vs. Load Current — 2.8V 100 VLDO=2.8V, VIN=3.7V, 25°C, 10Hz < f < 100kHz 80 80 Noise (μVRMS) 60 Noise (μVRMS) 0 20 40 IOUT (mA) 60 80 100 60 40 40 20 20 0 0 0 30 60 IOUT (mA) 90 120 150 7 SC653 Typical Characteristics (continued) Load Regulation (LDO2) 0 VIN = 3.7V, 25°C 0 -5 VIN=3.7V, 25°C Load Regulation (LDO1) Output Voltage Variation (mV) -5 Output Voltage Variation (mV) 1.5V -10 -15 2.5V -20 2.8V -25 3.3V -30 -35 1.8V 1.2V -10 1.5V -15 1.8V -20 -25 -30 0 40 80 ILDO (mA) 120 160 200 0 40 80 ILDO (mA) 120 160 200 LDO Load Transient Response (1.2V) VIN=3.7V, VLDO=1.2V, ILDO=1 to 100mA, 25°C LDO Load Transient Response (3.3V) VIN=3.7V, VLDO=3.3V, ILDO=1 to 100mA, 25°C VLDO (50mV/div) VLDO (50mV/div) ILDO (100mA/div) ILDO (100mA/div) Time (20μs/div) Time (20μs/div) LDO Load Transient Response (1.8V) VIN=3.7V, VLDO=1.8V, ILDO=1 to 100mA, 25°C Output Short Circuit Current Limit VOUT=0V, VIN=4.2V, 25°C VOUT (1V/div) VLDO (50mV/div) ILDO (100mA/div) IOUT (200mA/div) Time (20μs/div) Time (1ms/div) 8 SC653 Typical Characteristics (continued) Ripple — 1X Mode VIN=3.7V, 4 Backlights — 25 mA each, 25°C VIN (100mV/div) Ripple — 1.5X Mode VIN=2.9V, 4 Backlights — 25 mA each, 25°C VIN (100mV/div) VOUT (100mV/div) VOUT (100mV/div) IBL (20mA/div) IBL (20mA/div) Time (20μs/div) Time (20μs/div) Ripple — 2X Mode VIN=2.9V, 4 Backlights — 25 mA each, 25°C VBL (500mV/div) VIN (100mV/div) Output Open Circuit Protection VIN=3.7V, 25°C 5.42V VOUT (1V/div) VOUT (100mV/div) IBL (20mA/div) IBL (20mA/div) Time (20μs/div) Time (200μs/div) 9 SC653 Pin Descriptions Pin # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 T Pin Name BYP BL1 BL2 BL3 BL4 SPIF GND1 ENL1 (1) ENL2 (2) C2C1C1+ C2+ OUT IN GND2 LDO1 LDO2 THERMAL PAD Pin Function Bypass pin for voltage reference — ground CBYP to GND1 on ground island. Current sink output for main backlight LED 1 — leave this pin open if unused Current sink output for main backlight LED 2 — leave this pin open if unused Current sink output for main backlight LED 3 — leave this pin open if unused Current sink output for main backlight LED 4 — leave this pin open if unused SemPulse single wire interface pin — used to enable/disable the device and to configure all registers (refer to Register Map and SemPulse Interface sections) Ground pin — Ground CBYP, CLDO1, CLDO2 to GND1 on ground island. LDO1 enable input — active high LDO2 enable input — active high Negative connection to bucket capacitor 2 Negative connection to bucket capacitor 1 Positive connection to bucket capacitor 1 Positive connection to bucket capacitor 2 Charge pump output — all LED anode pins should be connected to this pin Battery voltage input Ground Pin — connect to ground plane Output of LDO1 — ground CLDO1 to GND1 on ground island. Output of LDO2 — ground CLDO2 to GND1 on ground island. Thermal pad for heatsinking purposes — connect to ground plane using multiple vias. This pad is internally connected to ground and to pins 7 and 16. NOTES: (1) ENL1 must be high for the SPIF interface to control LDO1. When low, ENL1 disables LDO1. (2) ENL2 must be high for the SPIF interface to control LDO2. When low, ENL2 disables LDO2. 10 SC653 Block Diagram C1+ 12 VIN IN 15 C111 C2+ 13 C210 Fractional Charge Pump (1x, 1.5x, 2x) 14 OUT SPIF 6 SemPulseTM Digital Interface and Logic Control Oscillator 2 3 4 Current Setting DAC 5 BL1 BL2 BL3 BL4 BYP GND1 1 7 Bandgap Reference Voltage Setting DAC VIN LDO1 ENL1 8 VIN ENL2 9 LDO2 17 LDO1 18 LDO2 GND2 16 11 SC653 Applications Information General Description This design is optimized for handheld applications supplied from a single Li-Ion cell and includes the following key features: Note that small package capacitors can decrease in value by up to 50% under DC loading, so it is strongly recommended that 2.2uF capacitors be selected when using 0402 size ceramic capacitors. The device also requires a 2.2μF capacitor on the IN pin and a 2.2μF capacitor on the OUT pin to minimize noise and support the output drive requirements. Capacitors with X7R or X5R ceramic dielectric are strongly recommended for their low ESR and superior temperature and voltage characteristics. Y5V capacitors should not be used as their temperature coefficients make them unsuitable for this application. • • • A high efficiency fractional charge pump that supplies power to all LEDs Four matched current sinks that control LED backlighting current, with 0mA to 25mA per LED Two adjustable LDOs with outputs ranging from 1.5V to 3.3V for LDO1 and 1.2V to 1.8V for LDO2, adjustable in 100mV increments LED Backlight Current Sinks The backlight current is set via the SemPulse interface. The current is regulated to one of 29 values between 0mA and 25mA. The step size varies depending upon the current setting. The step sizes are 0.5mA for current settings between 0mA and 5mA. The step size increases to 1mA for settings between 5mA and 21mA. Steps are 2mA between 21mA and 25mA. The variation in step size allows finer adjustment for dimming functions in the low current setting range and coarse adjustment at higher current settings where small current changes are not visibly noticeable in LED brightness. A zero setting is also included to allow the current sink to be disabled by writing to either the enable bit or the current setting register for maximum flexibility. All backlight current sinks have matched currents, even when there is variation in the forward voltages (ΔVF ) of the LEDs. A ΔVF of 1.2V is supported when the input voltage is at 3.0V. Higher ΔVF LED mis-match is supported when VIN is higher than 3.0V. All current sink outputs are compared and the lowest output is used for setting the voltage regulation at the OUT pin. This is done to ensure that sufficient bias exists for all LEDs. The backlight LEDs default to the off state upon powerup. For backlight applications using less than four LEDs, any unused output must be left open and the unused LED driver must remain disabled. When writing to the Backlight Enable register, a zero (0) must be written to the corresponding bit of any unused output. High Current Fractional Charge Pump The backlight outputs are supported by a high efficiency, high current fractional charge pump output at the OUT pin. The charge pump multiplies the input voltage by 1, 1.5, or 2 times. The charge pump switches at a fixed frequency of 250kHz in 1.5x and 2x modes and is disabled in 1x mode to save power and improve efficiency. The mode selection circuit automatically selects the mode as 1x, 1.5x, or 2x based on circuit conditions such as LED voltage, input voltage, and load current. The 1x mode is the most efficient of the three modes, followed by 1.5x and 2x modes. Circuit conditions such as low input voltage, high output current, or high LED voltage place a higher demand on the charge pump output. A higher numerical mode (1.5x or 2x) may be needed momentarily to maintain regulation at the OUT pin during intervals of high demand. The charge pump responds to momentary high demands, setting the charge pump to the optimum mode to deliver the output voltage and load current while optimizing efficiency. Hysteresis is provided to prevent mode toggling. The charge pump requires two bucket capacitors for proper operation. One capacitor must be connected between the C1+ and C1- pins and the other must be connected between the C2+ and C2- pins as shown in the typical application circuit diagram. These capacitors should be equal in value, with a nominal capacitance of 1.0μF to support the charge pump current requirements. 12 SC653 Applications Information (continued) Backlight Quiescent Current The quiescent current required to operate all four backlights is reduced by 1.5mA when backlight current is set to 4.0mA or less. This feature results in higher efficiency under light-load conditions. Further reduction in quiescent current will result from using fewer than four LEDs. No change Immediate change to new bright level Write new bright level FADE=0 Write FADE=1 FADE=0 Write FADE=0 Fade-In and Fade-Out The SC653 contains bits that control the fade state of the main bank. When enabled, the fade function causes the backlight settings to step from their current state to the next programmed state as soon as the new state is stored in its register. For example, if the backlight is set at 25mA and the next setting is the off state, the backlight will step from 25mA down to 0mA using all 29 settings at the fade rate specified by the bits in register 04h. The same is true when turning on or increasing the backlight current — the backlight current will step from the present level to the new level at the step rate defined in register 04h. This process applies for both the main and the sub displays. The fade rate may be changed dynamically when a fade operation is active by writing new values to the fade register. When a new backlight level is written during an ongoing fade operation, the fade will be redirected to the new value from the present state. An ongoing fade operation may be cancelled by disabling fade which will result in the backlight current changing immediately to the final value. If fade is disabled, the current level will change immediately without the fade delay. The state diagram in Figure 1 describes all possible conditions for a fade operation. More details can be found in the Register Map Section. Immediate change to new bright level Write FADE=0 FADE=1 No change FADE=1 Write FADE=1 Write new bright level Fade ends Fade begins Fade is redirected toward the new value from current state Write new bright level Write new fade rate Note: (1) When the data in backlight enable register 01h is not 00h Fade=0 No change Write Fade=1 Fade processing(1) Continue fade using new rate Figure 1 — Fade State Diagram Programmable LDO Outputs Two low dropout (LDO) regulators are provided for camera module I/O and core power. Each LDO output voltage setting has ±3.5% accuracy over the operating temperature range. Output current greater than the specification is possible at somewhat reduced accuracy. Input pins ENL1 and ENL2 may be used to directly enable and disable the LDOs without communication via the SPIF interface. When power is first applied to the SC653, the register defaults reset the LDOs to the off state, so SPIF must be used one time to set the voltages before ENL1 and ENL2 can be used to enable the LDOs. 13 SC653 Applications Information (continued) To control LDOs exclusively by software, ENL1 and ENL2 may be permanently terminated to the battery voltage. ENL1 must be high for the SPIF interface to control LDO1. When low, ENL1 disables LDO1. ENL2 is used exactly the same way to enable and disable LDO2. A 1μF, low ESR capacitor should be used as a bypass capacitor on each LDO output to reduce noise and ensure stability. In addition, it is recommended that a nominal minimum 22nF capacitor be connected between the BYP pin and the GND1 pin to minimize noise and achieve optimum power supply rejection. A larger capacitor can be used for this function, but at the expense of increasing turn-on time. Capacitors with X7R or X5R ceramic dielectric are strongly recommended for their low ESR and superior temperature and voltage characteristics. Y5V capacitors should not be used as their temperature coefficients make them unsuitable for this application. Output Open Circuit Protection Over-Voltage Protection (OVP) is provided at the OUT pin to prevent the charge pump from producing an excessively high output voltage. In the event of an open circuit at OUT, the charge pump runs in open loop and the voltage rises up to the OVP limit. OVP operation is hysteretic, meaning the charge pump will momentarily turn off until VOUT is sufficiently reduced. The maximum OVP threshold is 6.0V, allowing the use of a ceramic output capacitor rated at 6.3V. Over-Temperature Protection The Over-Temperature (OT) protection circuit prevents the device from overheating and experiencing a catastrophic failure. When the junction temperature exceeds 165°C, the device goes into thermal shutdown with all outputs disabled until the junction temperature is reduced. All register information is retained during thermal shutdown. Hysteresis of 30°C is provided to ensure that the device cools sufficiently before re-enabling. Charge Pump Output Current Limit The device limits the charge pump current at the OUT pin. When OUT is shorted to ground, the output current will typically equal 250mA. The output current is also limited to 250mA when over-loaded resistively. LDO Current Limit The device limits the output currents of LDO1 and LDO2 to help prevent the device from overheating and to protect the loads. The minimum limit is 200mA, so load current greater than the rated current and up to 200mA can be used with degraded accuracy and larger dropout without tripping the current limit. LED Float Detection Float detect is a fault detection feature of the LED current sink outputs. If an output is programmed to be enabled and an open circuit fault occurs at any current sink output, that output will be disabled to prevent a sustained output OVP condition from occurring due to the resulting open loop. Float detect ensures device protection but does not ensure optimum performance. Unused LED outputs must be disabled to prevent an open circuit fault from occurring. Shutdown Mode The device is disabled when the SPIF pin is held low for the shutdown time specified in the electrical characteristics section. All registers are reset to default condition at shutdown. Typical current consumption in this mode is 0.1μA. Sleep Mode When all LEDs are disabled, sleep mode is activated. This is a reduced current mode that helps minimize overall current consumption by disabling the clock and the charge pump while continuing to monitor the serial interface for commands. The two LDOs can be enabled when the device is in sleep mode. Protection Features The SC653 provides several protection features to safeguard the device from catastrophic failures. These features include: • • • • • Output Open Circuit Protection Over-Temperature Protection Charge Pump Output Current Limit LDO Current Limit LED Float Detection 14 SC653 Applications Information (continued) PCB Layout Considerations The layout diagram in Figure 2 illustrates a proper two-layer PCB layout for the SC653 and supporting components. Following fundamental layout rules is critical for achieving the performance specified in the Electrical Characteristics table. The following guidelines are recommended when developing a PCB layout: • • • • • • • Place all bucket, bypass, and decoupling capacitors — C1, C2, CIN, COUT, CLDO1, CLDO2, and CBYP as close to the device as possible. All charge pump current passes through IN, OUT, and the bucket capacitor connection pins. Ensure that all connections to these pins make use of wide traces so that the resistive drop on each connection is minimized. The thermal pad should be connected to the ground plane using multiple vias to ensure proper thermal connection for optimal heat transfer. The following capacitors — CLDO1, CLDO2, and CBYP should be grounded together through an isolated copper island. Using no vias, connect the island only, to pin 7 as shown in Figure 2. Figure 3 shows only the vias that should be connected to the ground plane with multiple vias. Make all ground connections to a solid ground plane as shown in Figure 4. All LDO output traces should be made as wide as possible to minimize resistive losses. CLDO2 CLDO1 CIN COUT IN CBYP 1 2 3 4 5 6 7 8 18 17 16 15 OUT 14 13 12 11 10 9 Vias to ground plane Figure 3 — Layer 1 GND2 SC653 TBD Figure 3 — Layer 1 C1 C2 Keep gap open Ground Layer Island for pin 7 GND1 (no vias) Figure 4 — Layer 2 Figure 2 — Recommended PCB Layout TBD Figure 2 — Recommended PCB Layout TBD Figure 4 — Layer 2 15 SC653 SemPulse® Interface Introduction SemPulse is a write-only single wire interface. It provides access to up to 32 registers that control device functionality. Two sets of pulse trains are transmitted via the SPIF pin. The first pulse set is used to set the desired address. After the bus is held high for the address hold period, the next pulse set is used to write the data value. After the data pulses are transmitted, the bus is held high again for the data hold period to signify the data write is complete. At this point the device latches the data into the address that was selected by the first set of pulses. See the SemPulse Timing Diagrams for descriptions of all timing parameters. held high for tHOLDD when the pulse train is completed. If the proper hold time is not received, the interface will keep counting pulses until the hold time is detected. If the total exceeds 63 pulses, the write will be ignored and the bus will reset after the next valid hold time is detected. After the bus has been held high for tHOLDD, the bus will expect the next pulse set to be an address write. Note that this is the same effect as the bus reset that occurs when tHOLDA exceeds its maximum specification. For this reason, there is no maximum limit on tHOLDD — the bus simply waits for the next valid address to be transmitted. Multiple Writes It is important to note that this single-wire interface requires the address to be paired with its corresponding data. If it is desired to write multiple times to the same address, the address must always be re-transmitted prior to the corresponding data. If it is only transmitted one time and followed by multiple data transmissions, every other block of data will be treated like a new address. The result will be invalid data writes to incorrect addresses. Note that multiple writes only need to be separated by the minimum tHOLDD for the slave to interpret them correctly. As long as tHOLDA between the address pulse set and the data pulse set is less than its maximum specification but greater than its minimum, multiple pairs of address and data pulse counts can be made with no detrimental effects. Chip Enable/Disable The device is enabled when the SemPulse interface pin (SPIF) is pulled high for greater than tSU. If the SPIF pin is pulled low again for more than tSD, the device will be disabled. Address Writes The first set of pulses can range between 0 and 31 (or 1 to 32 rising edges) to set the desired address. After the pulses are transmitted, the SPIF pin must be held high for tHOLDA to notify the slave device that the address write is finished. If the pulse count is between 0 and 31 and the line is held high for tHOLDA, the address is latched as the destination for the data word. If the SPIF pin is not held high for tHOLDA, the slave device will continue to count pulses. If the total exceeds 31 pulses, the write will be ignored and the bus will reset after the next valid hold time is detected. Note that if tHOLDA exceeds its maximum specification, the bus will reset. This means that the communication is ignored and the bus resumes monitoring the pin, expecting the next pulse set to be an address. Standby Mode Once data transfer is completed, the SPIF line must be returned to the high state for at least 10ms to return to the standby mode. In this mode, the SPIF line remains idle while monitoring for the next command. This mode allows the device to minimize current consumption between commands. Once the device has returned to standby mode, the bus is automatically reset to expect the address pulses as the next data block. This safeguard is intended to reset the bus to a known state (waiting for the beginning of a write sequence) if the delay exceeds the reset threshold. Data Writes After the bus has been held high for the minimum address hold period, the next set of pulses are used to write the data value. The total number of pulses can range from 0 to 63 (or 1 to 64 rising edges) since there are a total of 6 register bits per register. Just like with the address write, the data write is only accepted if the bus is 16 SC653 SemPulse® Interface (continued) The SemPulse single wire interface is used to enable or disable the device and configure all registers (see Figure 2). The timing parameters refer to the digital I/O electrical specifications. Address is set Up to 32 rising edges (0 to 31 pulses) Up to 64 rising edges (0 to 63 pulses) Data is written SPIF t = tSU t = tHOLDA tHI tLO t = tHOLDD Figure 2 — Uniform Timing Diagram for SemPulse Communication Timing Example 1 In this example (see Figure 3), the slave chip receives a sequence of pulses to set the address and data, and the pulses experience interrupts that cause the pulse width to be non-uniform. Note that as long as the maximum high and low times are satisfied and the hold times are within specification, the data transfer is completed regardless of the number of interrupts that delay the transmission. Address is set to register 02h SPIF Data written is 000011 t = tSU tHI t < tHImax t = tHOLDA t < tLOmax tLO t = tHOLDD Figure 3 — SemPulse Data Write with Non-Uniform Pulse Widths Timing Example 2 In this example (see Figure 4), the slave chip receives two sets of pulses to set the address and data, but an interrupt occurs during a pulse that causes it to exceed the minimum address hold time. The write is meant to be the value 03h in register 05h, but instead it is interpreted as the value 02h written to register 02h. The extended pulse that is delayed by the interrupt triggers a false address detection, causing the next pulse set to be interpreted as the data set. To avoid any problems with timing, make sure that all pulse widths comply with their timing requirements as outlined in this datasheet. Address is set to register 02h Data written is 000010 Address is set to register 03h (address and data are now out of order) SPIF Interrupt duration t > tHImax t = tHOLDA t = tHOLDD Figure 4 — Faulty SemPulse Data Write Due to Extended Interrupt Duration 17 SC653 Register Map(1) Address 00h D5 0(2) D4 BL_4 D3 BL_3 D2 BL_2 D1 BL_1 D0 BL_0 Reset Value 00h Description Backlight Current Backlight Enable LDO1 LDO2 Fade 01h 02h 03h 04h 0(2) 0(2) 0(2) 0(2) 0(2) 0(2) 0(2) 0(2) BLEN_4 LDO1_3 0(2) 0(2) BLEN_3 LDO1_2 LDO2_2 FADE_1 BLEN_2 LDO1_1 LDO2_1 FADE_0 BLEN_1 LDO1_0 LDO2_0 FADE_EN 00h 00h 00h 00h Notes: (1) All registers are write-only. (2) 0 = always write a 0 to these bits Definition of Registers and Bits BL Current Control Register (00h) This register is used to set the currents for the backlight current sinks. These current sinks need to be enabled in the Backlight Enable Control register to be active. BL[D4:D0] These bits are used to set the current for the backlight current sinks. All enabled backlight current sinks will sink the same current, as shown in Table 1. Table 1 — Backlight Current Settings BL_4 0 0 0 0 0 0 0 0 0 0 0 BL_4 0 0 0 0 0 1 1 1 1 1 1 BL_3 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 BL_2 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 BL_1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 BL_0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Backlight Current (mA) 4 4.5 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 23 25 BL_3 0 0 0 0 0 0 0 0 1 1 1 BL_2 0 0 0 0 1 1 1 1 0 0 0 BL_1 0 0 1 1 0 0 1 1 0 0 1 BL_0 0 1 0 1 0 1 0 1 0 1 0 Backlight Current (mA) 0 See note 1 See note 1 See note 1 0.5 1 1.5 2 2.5 3 3.5 1 1 1 1 1 1 1 1 1 1 (1) Reserved for future use 18 SC653 Register and Bit Definitions (continued) Backlight Enable Control Register (01h) This register is used to enable the backlight current sinks. BLEN[D4:D1] These bits are used to enable current sinks (active high, default low). BLEN_4 — Enable bit for backlight BL4 BLEN_3 — Enable bit for backlight BL3 BLEN_2 — Enable bit for backlight BL2 BLEN_1 — Enable bit for backlight BL1 When enabled, the current sinks will carry the current set by the backlight current control bits BL[4:0], as shown in Table 1. LDO2 Control Register (03h) This register is used to enable the LDO2 and to set the output voltage VLDO2. LDO2[D2:D0] These bits are used to set the output voltage, VLDO2, as shown in Table 3. Table 3 — LDO2 Control Bits LDO2_2 0 0 0 0 1 1 1 1 LDO2_1 0 0 1 1 0 0 1 1 LDO2_0 0 1 0 1 0 1 0 1 VLDO2 OFF 1.8V 1.7V 1.6V 1.5V 1.4V 1.3V 1.2V LDO1 Control Register (02h) This register is used to enable LDO1 and set the output voltage VLDO1. LDO1[D3:D0] These bits set the output voltage, V LDO1, as shown in Table 2. Table 2 — LDO1 Control Bits LDO1_3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 Fade Control Register (04h) This register is used to enable the backlight fade and to set the rise and fall rate at which fading proceeds. FADE[D2:D1] These bits are used to set the rise/fall rate between two backlight currents as shown in Table 4. Table 4 — Fade Control Bits FADE_1 0 0 1 1 LDO1_2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 LDO1_1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 LDO1_0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 VLDO1 OFF 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V 2.5V 2.4V 2.2V 1.8V 1.7V 1.6V 1.5V FADE_0 0 1 0 1 Fade Feature Rise/Fall Rate (ms/step) 32 24 16 8 The number of steps in changing the backlight current will be equal to the change in binary count of bits BL[4:0]. 19 SC653 Register and Bit Definitions (continued) FADE_EN [D0] This bit is used to enable or disable the fade feature. When the fade function is enabled and a new backlight current is set, the backlight current will change from its current value to a new value set by bits BL[4:0] at a rate of 8ms to 32ms per step. A new backlight level cannot be written during an ongoing fade operation, but an ongoing fade operation may be cancelled by resetting the fade bit. Clearing the fade bit during an ongoing fade operation changes the backlight current immediately to the value of BL[4:0]. The number of counts to complete a fade operation equals the difference between the old and new backlight values to increment or decrement the BL[4:0] bits. If the fade bit is cleared, the current level will change immediately without the fade delay. The rate of fade may be changed dynamically, even while a fade operation is active, by writing new values to the FADE_1 and FADE_0 bits. The total fade time is determined by the number of steps between old and new backlight values, multiplied by the rate of fade in ms/step. The longest elapsed time for a full scale fade-out of the backlight is nominally 938ms when the default interval of 32ms is used. 20 SC653 Outline Drawing — MLPQ-UT-18 2.3x2.3 A D B DIM E PIN 1 INDICATOR (LASER MARK) A A1 A2 b D D1 E E1 e SEATING PLANE A1 D1 C L N aaa bbb DIMENSIONS MILLIMETERS MIN 0.50 0.00 0.15 2.20 1.15 2.20 1.15 NOM (0.152) MAX 0.60 0.05 0.25 2.40 1.25 2.40 1.25 0.35 A2 A aaa C 0.20 2.30 1.20 2.30 1.20 0.40 BSC 0.25 0.30 18 0.08 0.10 LxN E/2 E1 2 1 e/2 e D/2 NOTES: 1. 2. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. N bxN bbb CAB 21 SC653 Land Pattern — MLPQ-UT-18 2.3x2.3 K R DIM C G (C) H G Z H K Y X P P R X Y Z DIMENSIONS MILLIMETERS (2.33) 1.76 1.20 1.20 0.40 0.10 0.20 0.57 2.90 NOTES: 1. 2. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD SHALL BE CONNECTED TO A SYSTEM GROUND PLANE. FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR FUNCTIONAL PERFORMANCE OF THE DEVICE. 4. SQUARE PACKAGE-DIMENSIONS APPLY IN BOTH X AND Y DIRECTIONS. Contact Information Semtech Corporation Power Management Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111 Fax: (805) 498-3804 www.semtech.com 22