SDC15.TCT

TVS Diode Array for ESD Protection of 12V Data and Power Lines PROTECTION PROTECTION PRODUCTS Description The SDC15 transient voltage suppressor (TVS) is designed to protect components which are connected to data and transmission lines from voltage surges caused by electrostatic discharge (ESD) electrical fast (ESD), (EFT) , and lightning transients lightning. TVS diodes are characterized by their high surge capability, low operating and clamping voltages, and fast response time. This makes them ideal for use as board level protection of sensitive semiconductor components. The dual-junction common-cathode design allows the user to protect one data or power line operating at ±12 volts. The low profile SOT23 package allows flexibility in the design of “crowded” circuit boards. The SDC15 TVS will meet the surge requirements of IEC 61000-4-2 (Formerly IEC 801-2), Level 4, “Human Body Model” for air and contact discharge. SDC15 Features 300 watts peak pulse power (tp = 8/20µs) 40 watts peak pulse power (tp = 10/1000µs) Transient protection for data and power lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 12A (1.2/50µs) Protects one bidirectional line Low clamping voltage Low leakage current High surge capability Solid-state silicon avalanche technology Mechanical Characteristics JEDEC SOT23 package Molding compound flammability rating: UL 94V-0 Marking : DC15 Packaging : Tape and Reel per EIA 481 Applications RS-232 Data Lines Portable Electronics Industrial Controls Set-Top Box Servers, Notebook, and Desktop PC 12V DC Supply Protection Circuit Diagram Schematic & PIN Configuration SOT23 (Top View) Revision 12/15/04 1 www.semtech.com SDC15 PROTECTION PRODUCTS Absolute Maximum Rating Rating Peak Pulse Power (tp = 8/20µs) Peak Pulse Current (tp = 8/20µs) Non-Repetitive Peak Forward Current (tp=100µs) Thermal Resistance, Junction to Ambient Lead Soldering Temperature Operating Temperature Storage Temperature Symbol Ppk IPP IFSMAX θJA TL TJ TSTG Value 300 10 4 556 260 (10 sec.) -55 to +125 -55 to +150 Units Watts A A °C/W °C °C °C Electrical Characteristics S DC 1 5 Parameter Reverse Stand-Of f Voltage Reverse Breakdown Voltage Symbol VRWM VBR It= 1mA, Between Pin 1 and 2 (each direction) VRWM = 12.8V, T=25°C Between Pin 1 and 2 (each direction) IF= 100mA, Pin 1 to 3 and Pin 2 to 3 14.3 Conditions Minimum Typical Maximum 12.8 16.4 Units V V Reverse Leakage Current IR 100 nA Forward Voltage VF 1.3 V Temperature Coef ficient of VBR Clamping Voltage αVBR VC IPP = 1.9A, tp = 10/10000µs Between Pin 1 and 2 (each direction) VR = 0V, f = 1MHz Pin 1 to 2 12 21.2 mV/°C V Junction Capacitance Cj 120 pF  2004 Semtech Corp. 2 www.semtech.com SDC15 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time 10 Peak Pulse Power - Ppk (kW) 110 100 90 % of Rated Power or IPP 80 70 60 50 40 30 20 10 0 Power Derating Curve 1 0.1 0.01 0.1 1 10 Pulse Duration - tp (µs) 100 1000 0 25 50 75 100 o 125 150 Ambient Temperature - TA ( C) Pulse Waveform 110 100 90 80 Percent of IPP 70 60 50 40 30 20 10 0 0 5 10 15 T im e (µs) 20 25 30 td = I PP /2 e -t W aveform Parameters: tr = 8µs td = 20µs Clamping Voltage vs. Peak Pulse Current 25 Clamping Voltage - VC (V) 20 15 Waveform Parameters: tr = 8µs td = 20µs 10 1 2 3 4 5 6 7 8 9 10 11 12 Peak Pulse Current - IPP (A) Forward Voltage vs. Forward Current 3 2.5 Forward Voltage - VF (V) 2 1.5 1 0.5 0 0 1 2 3 4 5 6 7 8 9 10 11 12 Forward Current - IF (A) Waveform Parameters: tr = 8µs td = 20µs  2004 Semtech Corp. 3 www.semtech.com SDC15 PROTECTION PRODUCTS Applications Information Device Connection for Protection of One Data Line The SDC15 is designed to protect one data or I/O line operating at ±12 volts. Connection options are as follows: Common mode protection: Pin 1 is connected to the data line and pin 2 is connected to ground. For best results, this pin should be connected directly to a ground plane on the board. The path length should be kept as short as possible to minimize parasitic inductance. Pin 3 is not connected. Differential protection: Pin 1 is connected to one line and pin 2 is connected to the second line. Pin 3 is not connected. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD. The following guidelines are recommended: Place the SDC15 near the input terminals or connectors to restrict transient coupling. Minimize the path length between the SDC15 and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. RS-232 Transceiver Protection Example Device Schematic and Pin Configuration  2004 Semtech Corp. 4 www.semtech.com SDC15 PROTECTION PRODUCTS Outline Drawing - SOT23 D e1 3 A DIM H B A A1 A2 b c D E E1 e e1 L L1 N 0 aaa bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .035 .000 .035 .012 .003 .110 .082 .047 .015 0° .037 .114 .093 .051 .075 .037 .020 .022 3 .004 .008 .044 .004 .040 .020 .007 .120 .104 .055 .024 8° 0.89 1.12 0.01 0.10 0.88 0.95 1.02 0.30 0.51 0.08 0.18 2.80 2.90 3.04 2.10 2.37 2.64 1.20 1.30 1.40 1.90 BSC 0.95 BSC 0.40 0.50 0.60 (0.55) 3 0° 8° 0.10 0.20 E1 E SEATING PLANE C GAUGE PLANE 0.25 L L1 DETAIL A 0 c 1 2 bxN e bbb CAB A A2 3X aaa C SEATING PLANE SIDE VIEW SEE DETAIL A A1 C NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -BTO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. Land Pattern - SOT23 X Y DIM Z G C C E E1 G X Y Z DIMENSIONS INCHES MILLIMETERS (.087) .037 .075 .031 .039 .055 .141 (2.20) 0.95 1.90 0.80 1.00 1.40 3.60 Y E E1 NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2. REFERENCE IPC-SM-782A. Note 1 : Grid placement courtyard is 8 x 8 elements (4mm x 4mm) in accordance with the international grid detailed in IEC Publication 97.  2004 Semtech Corp. 5 www.semtech.com SDC15 PROTECTION PRODUCTS Ordering Information Part Number SDC15.TC SDC15.TCT Lead Finish SnPb Pb Free Qty per Reel 3,000 3,000 R eel Size 7 Inch 7 Inch Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 www.semtech.com  2004 Semtech Corp. 6