SK1929

1:9 Signal Distribution HIGH-PER.ORMANCE PRODUCTS PRELIMINARY SK19XX .amily SK19XX .amily .unctional Block Diagram OUT0 OUT0* OUT1 OUT1* OUT2 OUT2* OUT3 OUT3* IN IN* DQ D* Q* 0 1 OUT4 OUT4* OUT5 OUT5* OUT6 OUT6* OUT7 OUT7* OUT8 OUT8* CLK CLK* SEL* SEL Revision 1/January 23, 2001 1 www.semtech.com 1:9 Signal Distribution HIGH-PER.ORMANCE PRODUCTS SK19XX .amily Product Selection Guide 1:9 Signal Distribution 3 GHz Logic .amily Power Supply Open Emitter l l l l l Output Configuration 50Ω Double Termination Internal Current Sink (Double Termination) ECL / PECL Double Swing / TTL ECL / PECL ECL / PECL ECL / PECL Now Now Now Now Now Output Availability SK19XX .amily PRELIMINARY Synch / Asynch Operation Product 3.3V 5.2V 50Ω Source Termination SK1900 SK1901 SK1902 SK1903 SK1904 l l l l l l l l l Logic / Translation .amily Translation Product SK1925 SK1926 SK1927 SK1928 SK1929 SK1930 Anything to PECL Anything to ECL Anything to PECL Anything to ECL Anything to PECL Anything to ECL Open Emitter l l l l l l Output Configuration 50Ω Double Termination 50Ω Source Termination Now Now Now Now Now Now Availability Open Collector Logic .amily Output Configuration Product SK1999 Open Collector l 12mA Q2 2001 Output Current Availability Revision 1/January 3, 2001 2 www.semtech.com 1:9 Signal Distribution HIGH-PER.ORMANCE PRODUCTS SK19XX .amily Package Information 5mm x 5mm TQ.P D, E SK19XX .amily PRELIMINARY 3 D1, E1 2 4 See Figure 3. b 8 Top View e A A2 SEATING PLANE A1 10 b Side View Revision 1/January 3, 2001 3 www.semtech.com 1:9 Signal Distribution HIGH-PER.ORMANCE PRODUCTS HIGH-PER.ORMANCE PRODUCTS SK19XX .amily Package Information (continued) 5mm x 5mm TQ.P 9 7 SK19XX .amily PRELIMINARY b WITH PLATING 02 R1 01 9 R2 S GAGE PLANE 03 11 L 00 25 c c1 9 2 e/2 b (L1) 9 b1 Figure 1. Figure 2. Figure 3. JEDEC Variation All Dimensions in Millimeters 1. All dimensions and tolerancing conforms to ANSI Y14.5M-1982. 2. The top package body size may be smaller than the bottom package body size by as much as 0.15 mm. 3. To be determined at seating plane. 4. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side. D1 and E1 are maximum plastic body size dimensions including mold mismatch. 5. Details of Pin 1 identifier optional, but must be located within the zone indicated. 6. All dimensions are in millimeters. 7. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall not cause the lead width to exceed the maximum b dimension by more than 0.08 mm. Dambar cannot be located on the lower radius or the foot. Minimum space between protrusion and an adjacent lead is 0.07 mm for 0.4 mm and 0.5 mm pitch packages. 8. Exact shape of each corner is optional. 9. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip. 10. A1 is defined as the distance from the seating plane to the lowest point of the package body. Revision 1/January 23, 2001 Symbol A A1 A2 D D1 E E1 N e b b1 R1 R2 00 01 02 03 S c c1 L L1 aaa bbb ccc ddd MIN 1.00 0.05 0.95 NOM 1.10 0.10 1.00 7.00 BSC 5.00 BSC 7.00 BSC 5.00 BSC 32 0.50 BSC MAX 1.20 0.15 1.05 Note Comments Package Stand Off Height Air Gap Package Body Thickness 3 4, 2 3 4, 2 Package Body Width Lead Count Lead Pitch 0.27 0.23 – 0.20 7 Lead Thickness Package Body Length 0.17 0.17 0.08 0.08 0 o o o o 0.22 0.20 – – 3.5 – 12 12 – – – 0.60 1.00 RE. 0.20 0.20 0.08 0.08 o o o 7 o 0 – 13 13 – 0.20 0.16 0.75 o o 11 11 0.20 0.09 0.09 0.45 4 www.semtech.com 1:9 Signal Distribution HIGH-PER.ORMANCE PRODUCTS Absolute Maximum Ratings* SK19XX .amily PRELIMINARY Absolute Maximum Ratings* Parameter Power Supply (VCC = 0V) Power Supply (VEE = 0V) Input Voltage (VCC = 0V, VI not more negative than VEE) Input Voltage (VE = 0V, VI not more positive than VCC) Output Current Continuous Surge Operating Temperature Range Storage Temperature Solder Temperature (