SMDA05-6.TBT

Unidirectional TVS Array for Protection of Six Lines PROTECTION PROTECTION PRODUCTS Description The SMDA series of transient voltage suppressors are designed to protect components which are connected to data and transmission lines from voltage surges caused by electrostatic discharge (ESD), electrical fast transients (EFT), and lightning. TVS diodes are characterized by their high surge capability, low operating and clamping voltages, and fast response time. This makes them ideal for use as board level protection of sensitive semiconductor components. The SMDA05-6 is designed to provide transient suppression on multiple data lines and I/O ports. It is designed to operate on 5V digital lines. The low profile SO-8 design allows the user to protect up to six data and I/O lines with one package. The SMDA05-6 TVS diode array will meet the surge requirements of IEC 61000-4-2 (Formerly IEC 801-2), Level 4, “Human Body Model” for air and contact discharge. SMDA05-6 Features 300 watts peak pulse power (tp = 8/20µs) Transient protection for data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 12A (8/20µs) Protects up to 6 unidirectional lines Low operating voltage Low clamping voltage Solid-state silicon avalanche technology Mechanical Characteristics JEDEC SO-8 package UL 497B listed Molding compound flammability rating: UL 94V-0 Marking : Part number, date code, logo Packaging : Tube or Tape and Reel per EIA 481 RoHS/WEEE Compliant Applications 5V data and I/O lines Communication lines Microprocessor based equipment LAN/WAN equipment Servers Notebook and Desktop PC Instrumentation Peripherals Circuit Diagram Schematic & PIN Configuration SO-8 (Top View) Revision 08/15/06 1 www.semtech.com SMDA05-6 PROTECTION PRODUCTS Absolute Maximum Rating R ating Peak Pulse Power (tp = 8/20µs) Peak Pulse Current (tp = 8/20µs) Lead Soldering Temperature Operating Temperature Storage Temperature Symbol Pp k IP P TL TJ TSTG Value 300 17 260 (10 sec.) -55 to +125 -55 to +150 Units Watts A °C °C °C Electrical Characteristics SMDA05-6 Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamping Voltage Clamping Voltage Junction Capacitance Symbol VRWM V BR IR VC VC Cj It = 1mA VRWM = 5V, T=25°C IPP = 1A, tp = 8/20µs IPP = 5A, tp = 8/20µs Between I/O pins and Ground VR = 0V, f = 1MHz 6 20 9.8 11 400 Conditions Minimum Typical Maximum 5 Units V V µA V V pF  2006 Semtech Corp. 2 www.semtech.com SMDA05-6 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time 10 Peak Pulse Power - Ppk (kW) Power Derating Curve 110 100 90 % of Rated Power or I PP 80 70 60 50 40 30 20 10 1 0.1 0.01 0.1 1 10 Pulse Duration - tp (µs) 100 1000 0 0 25 50 75 100 125 150 Ambient Temperature - TA (oC) Pulse Waveform 110 100 90 80 Percent of IPP 70 60 50 40 30 20 10 0 0 5 10 15 T im e (µs) 20 25 30 td = I PP /2 e -t W aveform Parameters: tr = 8µs td = 20µs Clamping Voltage vs. Peak Pulse Current 11 10 Clamping Voltage - VC (V) 9 8 7 6 5 4 3 2 1 0 0 2 4 6 8 10 12 14 16 18 Peak Pulse Current - IPP (A) Waveform Parameters: tr = 8µs td = 20µs ESD Pulse Waveform (IEC 61000-4-2) Level IEC 61000-4-2 Discharge Parameters First Peak Current (A ) 1 2 3 4 7.5 15 22.5 30 Peak Current at 30 ns (A ) 4 8 12 16 Peak Current at 60 ns (A ) 8 4 6 8 Test Test Voltage Voltage (Contact (A ir Discharge) Discharge) (kV) ( kV ) 2 4 6 8 2 4 8 15  2006 Semtech Corp. 3 www.semtech.com SMDA05-6 PROTECTION PRODUCTS Applications Information Device Connection for Protection of Six Data Lines The SMDA05-6 is designed to protect up to 6 data or I/O lines operating at 5 volts. They are unidirectional devices and may be used on lines where the signal polarities are above ground (i.e. 0 to 5V). The device is connected as follows: Pins 1, 2, 3, 4, 5 and 8 are connected to the lines that are to be protected. Pins 6 and 7 are connected to ground. The ground connections should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Connection Diagram Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. DATA IN DATA OUT 8 7 6 5 DATA IN DATA OUT Circuit Diagram 1 2 3 4  2006 Semtech Corp. 4 www.semtech.com SMDA05-6 PROTECTION PRODUCTS Outline Drawing - SO-8 A N 2X E/2 E1 E 1 ccc C 2X N/2 TIPS 2 e/2 B D aaa C SEATING PLANE A2 A C bxN bbb A1 C A-B D SIDE VIEW GAGE PLANE 0.25 e D h h H DIM c A A1 A2 b c D E1 E e h L L1 N 01 aaa bbb ccc DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .053 .069 .004 .010 .049 .065 .012 .020 .010 .007 .189 .193 .197 .150 .154 .157 .236 BSC .050 BSC .010 .020 .016 .028 .041 (.041) 8 8° 0° .004 .010 .008 1.75 1.35 0.10 0.25 1.25 1.65 0.31 0.51 0.17 0.25 4.80 4.90 5.00 3.80 3.90 4.00 6.00 BSC 1.27 BSC 0.25 0.50 0.40 0.72 1.04 (1.04) 8 0° 8° 0.10 0.25 0.20 L (L1) DETAIL 01 A SEE DETAIL A NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MS-012, VARIATION AA. Land Pattern - SO-8 X DIM (C) G Z C G P X Y Z DIMENSIONS INCHES MILLIMETERS (.205) .118 .050 .024 .087 .291 (5.20) 3.00 1.27 0.60 2.20 7.40 Y P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2. REFERENCE IPC-SM-782A, RLP NO. 300A.  2006 Semtech Corp. 5 www.semtech.com SMDA05-6 PROTECTION PRODUCTS Ordering Information Part Number SMDA05-6.TB SMDA05-6.TBT SMDA05-6 SMDA05-6.T Lead Finish SnPb Pb Free SnPb Pb Free Qty per Reel 500 500 95/Tube 95/Tube Reel Size 7 inch 7 inch N/A N/A Note: Lead-free devices are RoHS/WEEE Compliant Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804  2006 Semtech Corp. 6 www.semtech.com