SMDA05CN-5.TBT

SMDA05CN-5 THRU SMDA15CN-5 PROTECTION PROTECTION PRODUCTS Description The SMDAxxCN-5 series of transient voltage suppressors are designed to protect components which are connected to data and transmission lines from voltage surges caused by electrostatic discharge (ESD), electrical fast transients (EFT), and lightning. TVS diodes are characterized by their high surge capability, low operating and clamping voltages, and fast response time. This makes them ideal for use as board level protection of sensitive semiconductor components. The SMDAxxCN-5 is designed to provide transient suppression on multiple data lines and I/O ports. The low profile SO-8 design allows the user to protect up to five data and I/O lines with one package. The SMDAxxCN-5 TVS diode array will meet the surge requirements of IEC 61000-4-2 (Formerly IEC 801-2), Level 4, “Human Body Model” for air and contact discharge. Bidirectional TVS Array for Protection of Five Lines Features 300 watts peak pulse power (tp = 8/20µs) Transient protection for data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 12A (8/20µs) Protects up to 5 bidirectional lines Low operating voltage Low clamping voltage Solid-state silicon avalanche technology Mechanical Characteristics JEDEC SO-8 package Molding compound flammability rating: UL 94V-0 Marking : Part number, date code, logo Packaging : Tube or Tape and Reel per EIA 481 Applications RS-232 Data Lines RS-423 Data Lines LAN/WAN Equipment Servers Notebook and Desktop PC Set Top Box Peripherals Circuit Diagram Schematic and PIN Configuration SO-8 (Top View) Revision 08/15/06 1 www.semtech.com SMDA05CN-5 THRU SMDA15CN-5 PROTECTION PRODUCTS Absolute Maximum Rating R ating Peak Pulse Power (tp = 8/20µs) Peak Pulse Current (tp = 8/20µs) Lead Soldering Temperature Operating Temperature Storage Temperature Symbol Pp k IP P TL TJ TSTG Value 300 20 260 (10 sec.) -55 to +125 -55 to +150 Units Watts A °C °C °C Electrical Characteristics (T=25oC) SMDA05CN-5 Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Maximum Peak Pulse Current Junction Cap acitance Symbol VRWM V BR IR VC VC IP P Cj It = 1mA VRWM = 5V, T=25°C IPP = 1A, tp = 8/20µs IPP = 10A, tp = 8/20µs tp = 8/20µs Between I/O Pins and Ground VR = 0V, f = 1MHz 6 10 9.8 11 20 350 Conditions Minimum Typical Maximum 5 Units V V µA V V A pF SMDA15CN-5 Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Maximum Peak Pulse Current Junction Cap acitance Symbol VRWM V BR IR VC VC IP P Cj It = 1mA VRWM = 15V, T=25°C IPP = 1A, tp = 8/20µs IPP = 10A, tp = 8/20µs tp = 8/20µs Between I/O Pins and Ground VR = 0V, f = 1MHz 16.7 1 24 30 10 75 Conditions Minimum Typical Maximum 15 Units V V µA V V A pF  2005 Semtech Corp. 2 www.semtech.com SMDA05CN-5 THRU SMDA15CN-5 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time 10 Peak Pulse Power - PPk (kW) Power Derating Curve 110 100 90 % of Rated Power or I PP 80 70 60 50 40 30 20 10 1 0.1 0.01 0.1 1 10 Pulse Duration - tp (µs) 100 1000 0 0 25 50 75 100 125 150 175 Ambient Temperature - TA (oC) Pulse Waveform 110 100 90 80 Percent of IPP 70 60 50 40 30 20 10 0 0 5 10 15 Time (µs) 20 25 30 0 35 Clamping Voltage vs. Peak Pulse Current Waveform Parameters: tr = 8µs td = 20µs 30 Clamping Voltage - VC (V) 25 20 15 10 5 SMDA05CN-5 SMDA15CN-5 Waveform Parameters: tr = 8µs td = 20µs e -t td = IPP/2 0 2 4 6 8 10 12 14 16 18 20 22 24 Peak Pulse Current - IPP (A)  2005 Semtech Corp. 3 www.semtech.com SMDA05CN-5 THRU SMDA15CN-5 PROTECTION PRODUCTS Applications Information Device Connection Options for Protection of Four or Five Data Lines The SMDAxxCN-5 can be configured to protect either four or five bidirectional data lines. The options for connecting the devices are as follows: 1. Bidirectional protection of four I/O lines is achieved by connecting pins 1, 2, 3, and 4 to the data lines. Pins 5, 6, 7, and 8 are connected to ground. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. In this configuration, the device can withstand the maximum specified transient impulse on four lines simultaneously. 2. Bidirectional protection of five I/O lines is achieved by connecting pins 1, 2, 3, 4, and 5 to the data lines. Pins 6, 7, and 8 are connected to ground. The ground connection should be made directly to the circuit board ground plane for best results. In this configuration, the device can withstand the maximum rated transient impulse on any two lines simultaneously. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. To Protected IC Protection for Four Bidirectional Lines From Connector To Protected IC Protection for Five Bidirectional Lines From Connector Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 4 www.semtech.com  2005 Semtech Corp. SMDA05CN-5 THRU SMDA15CN-5 PROTECTION PRODUCTS Outline Drawing - SO-8 A N 2X E/2 E1 E 1 ccc C 2X N/2 TIPS 2 e/2 B D aaa C SEATING PLANE A2 A C bxN bbb A1 C A-B D SIDE VIEW GAGE PLANE 0.25 e D h h H DIM c A A1 A2 b c D E1 E e h L L1 N 01 aaa bbb ccc DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .053 .069 .010 .004 .065 .049 .012 .020 .010 .007 .189 .193 .197 .150 .154 .157 .236 BSC .050 BSC .010 .020 .016 .028 .041 (.041) 8 8° 0° .004 .010 .008 1.35 1.75 0.10 0.25 1.25 1.65 0.31 0.51 0.17 0.25 4.80 4.90 5.00 3.80 3.90 4.00 6.00 BSC 1.27 BSC 0.25 0.50 0.40 0.72 1.04 (1.04) 8 0° 8° 0.10 0.25 0.20 L (L1) DETAIL 01 A SEE DETAIL A NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MS-012, VARIATION AA. Land Pattern - SO-8 X DIM (C) G Z C G P X Y Z DIMENSIONS INCHES MILLIMETERS (.205) .118 .050 .024 .087 .291 (5.20) 3.00 1.27 0.60 2.20 7.40 Y P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2. REFERENCE IPC-SM-782A, RLP NO. 300A.  2005 Semtech Corp. 5 www.semtech.com SMDA05CN-5 THRU SMDA15CN-5 PROTECTION PRODUCTS Ordering Information Part Number SMDA05CN-5.TB SMDA15CN-5.TB SMDA05CN-5.TBT SMDA15CN-5.TBT SMDA05CN-5 SMDA15CN-5 SMDA05CN-5.T SMDA15CN-5.T Lead Finish SnPb SnPb Pb Free Pb Free SnPb SnPb Pb Free Pb Free Qty per Reel 500 500 500 500 95/Tube 95/Tube 95/Tube 95/Tube Reel Size 7 Inch 7 Inch 7 Inch 7 Inch N/A N/A N/A N/A Note: Lead-free devices are RoHS/WEEE Compliant Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804  2005 Semtech Corp. 6 www.semtech.com