SMDA24.TBT

SMDA05 through SMDA24 PROTECTION PROTECTION PRODUCTS Description The SMDAxx series of TVS arrays are designed to provide undirectional protection for sensitive electronics from damage or latch-up due to ESD, lightning, and other voltage-induced transient events. Each device will protect four data or I/O lines. They are available with operating voltages of 5V, 12V, 15V and 24V. TVS diodes are solid-state devices designed specifically for transient suppression. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage and no device degradation. The low profile SO-8 package allows the user to protect up to four independent lines with one package. The SMDAxx series is suitable protection for sensitive semiconductors components such as microprocessors, ASICs, transceivers, transducers, and CMOS memory. The SMDAxx series devices may be used to meet the ESD immunity requirements of IEC 61000-4-2, level 4 for air and contact discharge. Unidirectional TVS Array for Protection of Four Lines Features Transient protection for data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 12A (8/20µs) Undirectional protection Small SO-8 package Protects four I/O lines Working voltages: 5V, 12V, 15V and 24V Low leakage current Low operating and clamping voltages Solid-state silicon avalanche technology Mechanical Characteristics JEDEC SO-8 package Molding compound flammability rating: UL 94V-0 Marking : Part number, date code, logo Packaging : Tube or Tape and Reel per EIA 481 Applications RS-232 data lines Microprocessor based equipment Notebooks, Desktops, and Servers Instrumentation LAN/WAN equipment Peripherals Serial and Parallel Ports Schematic & PIN Configuration 1 8 2 7 3 6 4 5 SO-8 (Top View) Revision 08/15/06 1 www.semtech.com SMDA05 through SMDA24 PROTECTION PRODUCTS Absolute Maximum Rating R ating Peak Pulse Power (tp = 8/20µs) ESD Voltage (HBM per IEC 61000-4-2) Lead Soldering Temperature Operating Temperature Storage Temperature Symbol Pp k VESD TL TJ TSTG Value 300 >25 260 (10 sec.) -55 to +125 -55 to +150 Units Watts kV °C °C °C Electrical Characteristics (T=25oC) SMDA05 Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Peak Pulse Current Junction Cap acitance Symbol VRWM V BR IR VC VC IP P Cj It = 1mA VRWM = 5V, T=25°C IPP = 1A, tp = 8/20µs IPP = 5A, tp = 8/20µs tp = 8/20µs VR = 0V, f = 1MHz 6 20 9.8 11 17 400 Conditions Minimum Typical Maximum 5 Units V V µA V V A pF SMDA12 Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Peak Pulse Current Junction Cap acitance Symbol VRWM V BR IR VC VC IP P Cj It = 1mA VRWM = 12V, T=25°C IPP = 1A, tp = 8/20µs IPP = 5A, tp = 8/20µs tp = 8/20µs VR = 0V, f = 1MHz 13.3 1 19 24 12 150 Conditions Minimum Typical Maximum 12 Units V V µA V V A pF  2005 Semtech Corp. 2 www.semtech.com SMDA05 through SMDA24 PROTECTION PRODUCTS Electrical Characteristics (Continued) SMDA15 Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Peak Pulse Current Junction Cap acitance Symbol VRWM V BR IR VC VC IP P Cj It = 1mA VRWM = 15V, T=25°C IPP = 1A, tp = 8/20µs IPP = 5A, tp = 8/20µs tp = 8/20µs VR = 0V, f = 1MHz 16.7 1 24 30 10 100 Conditions Minimum Typical Maximum 15 Units V V µA V V A pF SMDA24 Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Peak Pulse Current Junction Cap acitance Symbol VRWM V BR IR VC VC IP P Cj It = 1mA VRWM = 24V, T=25°C IPP = 1A, tp = 8/20µs IPP = 5A, tp = 8/20µs tp = 8/20µs VR = 0V, f = 1MHz 26.7 1 43 55 5 60 Conditions Minimum Typical Maximum 24 Units V V µA V V A pF  2005 Semtech Corp. 3 www.semtech.com SMDA05 through SMDA24 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time 10 Peak Pulse Power - Ppk (kW) Power Derating Curve 110 100 90 % of Rated Power or I PP 80 70 60 50 40 30 20 10 1 0.1 0.01 0.1 1 10 Pulse Duration - tp (µs) 100 1000 0 0 25 50 75 100 125 150 Ambient Temperature - TA (oC) Pulse Waveform 110 100 90 80 Percent of IPP 70 60 50 40 30 20 10 0 0 5 10 15 T im e (µs) 20 25 30 td = I PP /2 e -t W ave form Parameters: tr = 8µs td = 20µs ESD Pulse Waveform (IEC 61000-4-2) Level IEC 61000-4-2 Discharge Parameters First Peak Current (A ) 1 2 3 4 7.5 15 22.5 30 Peak Current at 30 ns (A ) 4 8 12 16 Peak Current at 60 ns (A ) 8 4 6 8 Test Test Voltage Voltage (Contact (A ir Discharge) Discharge) (kV) ( kV ) 2 4 6 8 2 4 8 15  2005 Semtech Corp. 4 www.semtech.com SMDA05 through SMDA24 PROTECTION PRODUCTS Applications Information Device Connection for Protection of Four Data Lines The SMDAxx series of devices are designed to protect up to four data lines. The devices are connected as follows: The SMDAxx are unidirectional devices and are designed for use on lines where the normal operating voltage is above ground. Pins 1, 2, 3, and 4 are connected to the protected lines. Pins 5, 6, 7, and 8 are connected to ground. The ground connections should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. Typical Connection To Protected Device 1 8 Circuit Diagram 1 8 2 7 3 6 4 5 I/O Line Protection 2 7 Ground 3 6 4 5 From Connector  2005 Semtech Corp. 5 www.semtech.com SMDA05 through SMDA24 PROTECTION PRODUCTS Outline Drawing - SO-8 A N 2X E/2 E1 E 1 ccc C 2X N/2 TIPS 2 e/2 B D aaa C SEATING PLANE A2 A C bxN bbb A1 C A-B D SIDE VIEW SEE DETAIL DETAIL GAGE PLANE 0.25 L (L1) e D h h H DIM c A A1 A2 b c D E1 E e h L L1 N 01 aaa bbb ccc DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .053 .069 .010 .004 .065 .049 .012 .020 .010 .007 .189 .193 .197 .150 .154 .157 .236 BSC .050 BSC .010 .020 .016 .028 .041 (.041) 8 8° 0° .004 .010 .008 1.35 1.75 0.10 0.25 1.25 1.65 0.31 0.51 0.17 0.25 4.80 4.90 5.00 3.80 3.90 4.00 6.00 BSC 1.27 BSC 0.25 0.50 0.40 0.72 1.04 (1.04) 8 0° 8° 0.10 0.25 0.20 01 A A NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MS-012, VARIATION AA. Land Pattern - SO-8 X DIM (C) G Z C G P X Y Z DIMENSIONS INCHES MILLIMETERS (.205) .118 .050 .024 .087 .291 (5.20) 3.00 1.27 0.60 2.20 7.40 Y P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2. REFERENCE IPC-SM-782A, RLP NO. 300A.  2005 Semtech Corp. 6 www.semtech.com SMDA05 through SMDA24 PROTECTION PRODUCTS Ordering Information Part Number SMDA05.TB SMDA12.TB SMDA15.TB SMDA24.TB SMDA05.TBT SMDA12.TBT SMDA15.TBT SMDA24.TBT SMDA05 SMDA12 SMDA15 SMDA24 SMDA05.T SMDA12.T SMDA15.T SMDA24.T Working Voltage 5 12 15 24 5 12 15 24 5 12 15 24 5 12 15 24 Lead Finish SnPb SnPb SnPb SnPb Pb Free Pb Free Pb Free Pb Free SnPb SnPb SnPb SnPb Pb Free Pb Free Pb Free Pb Free Qty per Reel 500 500 500 500 500 500 500 500 95/Tube 95/Tube 95/Tube 95/Tube 95/Tube 95/Tube 95/Tube 95/Tube Reel Size 7 Inch 7 Inch 7 Inch 7 Inch 7 Inch 7 Inch 7 Inch 7 Inch N/A N/A N/A N/A N/A N/A N/A N/A Note: Lead-free devices are RoHS/WEEE Compliant Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804  2005 Semtech Corp. 7 www.semtech.com