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SMDA24C

SMDA24C

  • 厂商:

    SEMTECH

  • 封装:

  • 描述:

    SMDA24C - Bidirectional TVS Array for Protection of Four Lines - Semtech Corporation

  • 详情介绍
  • 数据手册
  • 价格&库存
SMDA24C 数据手册
SMDA05C THRU SMDA24C PROTECTION PRODUCTS Description The SMDAxxC series of TVS arrays are designed to provide bidirectional protection for sensitive electronics from damage or latch-up due to ESD, lightning and other voltage-induced transient events. Each device will protect four data or I/O lines. They are available with operating voltages of 5V, 12V, 15V and 24V. TVS diodes are solid-state devices designed specifically for transient suppression. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage and no device degradation. The low profile SO-8 package allows the user to protect up to four independent lines with one package. The SMDAxxC series is suitable protection for sensitive semiconductors components such as microprocessors, ASICs, transceivers, transducers, and CMOS memory. The SMDAxxC series devices may be used to meet the ESD immunity requirements of IEC 61000-4-2, level 4 for air and contact discharge. Bidirectional TVS Array for Protection of Four Lines Features Transient protection for data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 12A (8/20µs) Bidirectional protection Small SO-8 package Protects four I/O lines Working voltages: 5V, 12V, 15V and 24V Low leakage current Low operating and clamping voltages Solid-state silicon avalanche technology Mechanical Characteristics JEDEC SO-8 package Molding compound flammability rating: UL 94V-0 Marking : Part number, date code, logo Packaging : Tube or Tape and Reel per EIA 481 Applications Data and I/O Lines Microprocessor based equipment Notebooks, Desktops, and Servers Instrumentation LAN/WAN equipment Peripherals Serial and Parallel Ports Schematic & PIN Configuration 1 8 2 7 3 6 4 5 SO-8 (Top View) Revision 08/15/06 1 www.semtech.com SMDA05C THRU SMDA24C PROTECTION PRODUCTS Absolute Maximum Rating Rating Peak Pulse Power (tp = 8/20µs) ESD Voltage (HBM per IEC 61000-4-2) Lead Soldering Temperature Operating Temperature Storage Temperature Symbol Ppk VESD TL TJ TSTG Value 300 >25 260 (10 sec.) -55 to +125 -55 to +150 Units Watts kV °C °C °C Electrical Characteristics (T=25oC) SMDA05C Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Maximum Peak Pulse Current Junction Cap acitance Symbol VRWM V BR IR VC VC IP P Cj It = 1mA VRWM = 5V, T=25°C IPP = 1A, tp = 8/20µs IPP = 5A, tp = 8/20µs tp = 8/20µs VR = 0V, f = 1MHz 6 20 9.8 11 17 350 Conditions Minimum Typical Maximum 5 Units V V µA V V A pF SMDA12C Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Maximum Peak Pulse Current Junction Cap acitance Symbol VRWM V BR IR VC VC IP P Cj It = 1mA VRWM = 12V, T=25°C IPP = 1A, tp = 8/20µs IPP = 5A, tp = 8/20µs tp = 8/20µs VR = 0V, f = 1MHz 13.3 1 19 24 12 120 Conditions Minimum Typical Maximum 12 Units V V µA V V A pF  2005 Semtech Corp. 2 www.semtech.com SMDA05C THRU SMDA24C PROTECTION PRODUCTS Electrical Characteristics (Continued) SMDA15C Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Maximum Peak Pulse Current Junction Cap acitance Symbol VRWM V BR IR VC VC IP P Cj It = 1mA VRWM = 15V, T=25°C IPP = 1A, tp = 8/20µs IPP = 5A, tp = 8/20µs tp = 8/20µs VR = 0V, f = 1MHz 16.7 1 24 30 10 75 Conditions Minimum Typical Maximum 15 Units V V µA V V A pF SMDA24C Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Maximum Peak Pulse Current Junction Cap acitance Symbol VRWM V BR IR VC VC IP P Cj It = 1mA VRWM = 24V, T=25°C IPP = 1A, tp = 8/20µs IPP = 5A, tp = 8/20µs tp = 8/20µs VR = 0V, f = 1MHz 26.7 1 43 55 5 50 Conditions Minimum Typical Maximum 24 Units V V µA V V A pF  2005 Semtech Corp. 3 www.semtech.com SMDA05C THRU SMDA24C PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time 10 Peak Pulse Power - PPP (kW) 110 100 90 % of Rated Power or I PP 1 80 70 60 50 40 30 20 10 0.01 0.1 1 10 Pulse Duration - tp (µs) 100 1000 0 0 25 50 75 100 125 150 Ambient Temperature - TA (oC) Power Derating Curve 0.1 Pulse Waveform 110 100 90 80 70 60 50 40 30 20 10 0 0 5 10 15 Time (µs) 20 25 30 td = IPP/2 PP Waveform Parameters: tr = 8µs td = 20µs e-t Percent of I ESD Pulse Waveform (IEC 61000-4-2) Level IEC 61000-4-2 Discharge Parameters First Peak Current (A ) 1 2 3 4 7.5 15 22.5 30 Peak Current at 30 ns (A ) 4 8 12 16 Peak Current at 60 ns (A ) 8 4 6 8 Test Test Voltage Voltage (Contact (A ir Discharge) Discharge) (kV) ( kV ) 2 4 6 8 2 4 8 15  2005 Semtech Corp. 4 www.semtech.com SMDA05C THRU SMDA24C PROTECTION PRODUCTS Applications Information Device Connection for Protection of Four Data Lines The SMDAxxC series of devices are designed to protect up to four data lines. The devices are connected as follows: The SMDAxxC are bidirectional devices and are designed for use on lines where the normal operating voltage is above and below ground. Pins 1, 2, 3, and 4 are connected to the protected lines. Pins 5, 6, 7, and 8 are connected to ground. Since the device is electrically symmetrical, these connections may be reversed. The ground connections should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint.  2005 Semtech Corp. 5 Circuit Diagram 1 8 2 7 3 6 4 5 I/O Line Protection Typical Connection To Protected Device 1 8 2 7 Ground 3 6 4 5 From Connector www.semtech.com SMDA05C THRU SMDA24C PROTECTION PRODUCTS Outline Drawing - SO-8 A N 2X E/2 E1 E 1 ccc C 2X N/2 TIPS 2 e/2 B D aaa C SEATING PLANE A2 A C bxN bbb A1 C A-B D SIDE VIEW SEE DETAIL DETAIL GAGE PLANE 0.25 L (L1) e D h h H DIM c A A1 A2 b c D E1 E e h L L1 N 01 aaa bbb ccc DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .053 .069 .010 .004 .065 .049 .012 .020 .010 .007 .189 .193 .197 .150 .154 .157 .236 BSC .050 BSC .010 .020 .016 .028 .041 (.041) 8 8° 0° .004 .010 .008 1.35 1.75 0.10 0.25 1.25 1.65 0.31 0.51 0.17 0.25 4.80 4.90 5.00 3.80 3.90 4.00 6.00 BSC 1.27 BSC 0.25 0.50 0.40 0.72 1.04 (1.04) 8 0° 8° 0.10 0.25 0.20 01 A A NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MS-012, VARIATION AA. Land Pattern - SO-8 X DIM (C) G Z C G P X Y Z DIMENSIONS INCHES MILLIMETERS (.205) .118 .050 .024 .087 .291 (5.20) 3.00 1.27 0.60 2.20 7.40 Y P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2. REFERENCE IPC-SM-782A, RLP NO. 300A.  2005 Semtech Corp. 6 www.semtech.com SMDA05C THRU SMDA24C PROTECTION PRODUCTS Ordering Information Part Number SMDA05C.TB SMDA12C.TB SMDA15C.TB SMDA24C.TB SMDA05C.TBT SMDA12C.TBT SMDA15C.TBT SMDA24C.TBT SMDA05C SMDA12C SMDA15C SMDA24C SMDA05C.T SMDA12C.T SMDA15C.T SMDA24C.T Working Voltage 5 12 15 24 5 12 15 24 5 12 15 24 5 12 15 24 Lead Finish SnPb SnPb SnPb SnPb Pb Free Pb Free Pb Free Pb Free SnPb SnPb SnPb SnPb Pb Free Pb Free Pb Free Pb Free Qty per Reel 500 500 500 500 500 500 500 500 95/Tube 95/Tube 95/Tube 95/Tube 95/Tube 95/Tube 95/Tube 95/Tube Reel Size 7 Inch 7 Inch 7 Inch 7 Inch 7 Inch 7 Inch 7 Inch 7 Inch N/A N/A N/A N/A N/A N/A N/A N/A Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804  2005 Semtech Corp. 7 www.semtech.com
SMDA24C
物料型号: - SMDA05C - SMDA12C - SMDA15C - SMDA24C

器件简介: SMDAxxC系列TVS阵列专为提供双向保护而设计,保护敏感电子设备免受ESD、雷击和其他电压引起的瞬态事件的损害。每个设备可保护四条数据线或I/O线,提供5V、12V、15V和24V的工作电压。

引脚分配: - 引脚1、2、3、4连接到被保护的线路。 - 引脚5、6、7、8连接到地线。 由于设备是电气对称的,这些连接可以反转。地线连接应尽可能直接连接到接地层以获得最佳效果。

参数特性: - 反向工作电压:5V、12V、15V、24V - 低漏电流 - 低操作和钳位电压 - 固态硅雪崩技术

功能详解: TVS二极管是专门设计用于瞬态抑制的固态器件,具有快速响应时间、低操作和钳位电压以及无器件退化等理想特性。SMDAxxC系列适合保护敏感半导体组件,如微处理器、ASIC、收发器、传感器和CMOS存储器。

应用信息: - 数据和I/O线 - 基于微处理器的设备 - 笔记本电脑、台式机和服务器 - 仪器仪表 - 局域网/广域网设备 - 外围设备 - 串行和并行端口

封装信息: - JEDEC SO-8封装 - 封装材料阻燃等级:UL 94V-0 - 标记:零件号、日期代码、标志 - 包装:按EIA 481标准的管装或卷带
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