SMF05C_04

TVS Diode Array For ESD and Latch-Up Protection PROTECTION PRODUCTS Description The SMF series TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD and other voltage-induced transient events. They are designed for use in applications where board space is at a premium. Each device will protect up to five lines. They are unidirectional devices and may be used on lines where the signal polarities are above ground. TVS diodes are solid-state devices designed specifically for transient suppression. They feature large cross-sectional area junctions for conducting high transient currents. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The SMF series devices may be used to meet the immunity requirements of IEC 61000-4-2, level 4. The small SC70 package makes them ideal for use in portable electronics such as cell phones, PDA’s, notebook computers, and digital cameras. SMF05C PRELIMINARY Features ESD protection for data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) Small package for use in portable electronics Protects five I/O lines Working voltage: 5V Low leakage current Low operating and clamping voltages Solid-state silicon-avalanche technology Mechanical Characteristics EIAJ SC70-6L package Molding compound flammability rating: UL 94V-0 Marking : Marking Code Packaging : Tape and Reel per EIA 481 Applications Cellular Handsets and Accessories Cordless Phones Personal Digital Assistants (PDA’s) Notebooks and Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players Circuit Diagram Schematic & PIN Configuration 1 3 4 5 6 1 2 3 6 5 4 2 Revision 08/04/04 1 SC70-6L (Top View) www.semtech.com SMF05C PROTECTION PRODUCTS Absolute Maximum Rating R ating Peak Pulse Power (tp = 8/20µs) Peak Pulse Current (tp = 8/20µs) ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) Lead Soldering Temperature Operating Temperature Storage Temperature Symbol Pp k IP P VESD TL TJ TSTG Value 100 8 20 15 260 (10 seconds) -55 to +125 -55 to +150 PRELIMINARY Units Watts A kV o C C C o o Electrical Characteristics SMF05C Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamping Voltage Clamping Voltage Junction Capacitance Symbol VRWM V BR IR VC VC Cj It = 1mA VRWM = 5V, T=25°C IPP = 5A, tp = 8/20µs IPP = 8A, tp = 8/20µs VR = 0V, f = 1MHz 6 5 9.8 12.5 130 Conditions Minimum Typical Maximum 5 Units V V µA V V pF  2004 Semtech Corp. 2 www.semtech.com SMF05C PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time 10 Peak Pulse Power - Ppk (kW) PRELIMINARY Power Derating Curve 110 100 90 % of Rated Power or IPP 80 70 60 50 40 30 20 10 1 0.1 0.01 0.1 1 10 Pulse Duration - tp (µs) 100 1000 0 0 25 50 75 100 o 125 150 Ambient Temperature - TA ( C) Pulse Waveform 110 100 90 80 Percent of IPP 70 60 50 40 30 20 10 0 0 5 10 15 Time (µs) 20 25 30 td = IPP/2 e -t Clamping Voltage vs. Peak Pulse Current Waveform Parameters: tr = 8µs td = 20µs 9 8 Clamping Voltage - VC (V) 7 6 5 4 3 2 1 0 0 2 4 6 8 10 Peak Pulse Current - IPP (A) Waveform Parameters: tr = 8µs td = 20µs Capacitance vs. Reverse Voltage 140 120 Capacitance - Cj (pF) 100 80 60 40 20 f = 1MHz ESD Clamping Characteristics (8kV Contact Discharge per IEC 61000-4-2) 0 0 1 2 3 4 5 6 Reverse Voltage - VR (V)  2004 Semtech Corp. 3 www.semtech.com SMF05C PROTECTION PRODUCTS Applications Information Device Connection for Protection of Five Data Lines The SMF05C is designed to protect up to five unidirectional data lines. The device is connected as follows: 1. Unidirectional protection of five I/O lines is achieved by connecting pins 1, 3, 4, 5 and 6 to the data lines. Pin 2 is connected to ground. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the SMF05C near the input terminals or connectors to restrict transient coupling. Minimize the path length between the SMF05C and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 2 1 PRELIMINARY SMF05C Circuit Diagram 3 4 5 6 Protection of Five Unidirectional Lines  2004 Semtech Corp. 4 www.semtech.com SMF05C PROTECTION PRODUCTS Typical Applications PRELIMINARY  2004 Semtech Corp. 5 www.semtech.com SMF05C PROTECTION PRODUCTS Outline Drawing - SC70 6L A e1 N 2X E/2 EI E SIDE VIEW SEE DETAIL D PRELIMINARY DIM DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .043 .000 .004 .028 .035 .039 .012 .006 .003 .009 .075 .079 .083 .045 .049 .053 .083 BSC .026 BSC .051 .010 .014 .018 (.017) 6 0° 8° .004 .004 .012 1.10 0.00 0.10 0.70 0.90 1.00 0.15 0.30 0.08 0.22 1.90 2.00 2.10 1.15 1.25 1.35 2.10 BSC 0.65 BSC 1.30 BSC 0.26 0.36 0.46 (0.42) 6 0° 8° 0.10 0.10 0.30 A ccc C 2X N/2 TIPS 1 B 2 e GAGE PLANE D 0.15 A2 A A1 bxN bbb C A-B D L (L1) DETAIL H c aaa C SEATING PLANE 01 A A1 A2 b c D E1 E e e1 L L1 N 01 aaa bbb ccc A C NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. REFERENCE JEDEC STD MO-203, VARIATION AB. Land Pattern - SC70 6L X DIM C Y G Z C G P X Y Z DIMENSIONS INCHES MILLIMETERS (.073) .039 .026 .016 .033 .106 (1.85) 1.00 0.65 0.40 0.85 2.70 P NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET.  2004 Semtech Corp. 6 www.semtech.com SMF05C PROTECTION PRODUCTS Marking Codes Part Number SMF05C Marking Code 5C PRELIMINARY Note: (1) Pin 1 Identified with a dot Ordering Information Part Number SMF05C.TC SMF05C.TCT Lead Finish SnPb Matte Sn Qty per Reel 3,000 3,000 R eel Size 7 Inch 7 Inch Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 www.semtech.com  2004 Semtech Corp. 7