UCLAMP0501H.TCT

µClampTM 1-Line ESD protection PROTECTION PROTECTION PRODUCTS - MicroClamp Description The µClamp series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. It is designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and PDA’s. It features large cross-sectional area junctions for conducting high transient currents. It offers superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The µclampTM0501H is in a ultra-small SOD-523 package ideal for use in portable electronics such as cell phones, PDA’s, notebook computers, and digital cameras. It will protect one unidirectional line operating at 5 volts. It gives the designer the flexibility to protect one line in applications where arrays are not practical. Additionally, it may be “sprinkled” around the board in applications where board space is at a premium. This device may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (15kV air, 8kV contact discharge). TM uClamp0501H Features ! Transient protection for data lines to IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) Ultra-small SOD-523 package (1.7 x 0.9 x 0.7mm) Protects one I/O or power line Low clamping voltage Working voltage: 5V Low leakage current Solid-state silicon-avalanche technology ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! ! Mechanical Characteristics EIAJ SOD-523 package Molding compound flammability rating: UL 94V-0 Marking : Marking code, cathode band Packaging : Tape and Reel per EIA 481 Lead Finish: Matte tin Cellular Handsets & Accessories Cordless Phones Personal Digital Assistants (PDA’s) Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players Applications Dimensions 1.70 1.30 0.9 Schematic & PIN Configuration 0.35 0.70 Maximum Dimensions (mm) Revision 10/08/2003 1 SOD-523 (Top View) www.semtech.com uClamp0501H PROTECTION PRODUCTS Absolute Maximum Rating R ating Peak Pulse Power (tp = 8/20µs) Maximum Peak Pulse Current (tp = 8/20µs) ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) Lead Soldering Temperature Operating Temperature Storage Temperature Symbol Pp k Ip p V PP TL TJ TSTG Value 240 16 +/- 20 +/- 15 260 (10 sec.) -55 to +125 -55 to +150 Units Watts Amps kV °C °C °C Electrical Characteristics (T=25oC) Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Forward Voltage Clamp ing Voltage Clamp ing Voltage Junction Cap acitance Symbol VRWM V BR IR VF VC VC Cj It = 1mA VRWM = 5V, T=25°C IF = 10mA IPP = 5A, tp = 8/20µs IPP = 16A, tp = 8/20µs VR = 0V, f = 1MHz 0.80 9.8 12.5 160 6 5 Conditions Minimum Typical Maximum 5 Units V V µA V V V pF  2003 Semtech Corp. 2 www.semtech.com uClamp0501H PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time 10 Peak Pulse Power - Ppk (kW) 110 100 90 % of Rated Power or I PP 80 70 60 50 40 30 20 10 Power Derating Curve 1 0.1 0.01 0.1 1 10 Pulse Duration - tp (µs) 100 1000 0 0 25 50 75 100 125 150 Ambient Temperature - TA (oC) Clamping Voltage vs. Peak Pulse Current 12 10 Clamping Voltage - VC (V) 8 6 4 2 0 0 2 4 6 8 10 12 14 16 Waveform Parameters: tr = 8µs td = 20µs Forward Voltage - VF (V) 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 0 Forward Voltage vs. Forward Current Waveform Parameters: tr = 8µs td = 20µs 4 8 Forward Current - IF (A) 12 16 Peak Pulse Current - IPP (A) Junction Capacitance vs. Reverse Voltage 160 f = 1 MHz ESD Clamping (8kV Contact per IEC 61000-4-2) 140 Capacitance - Cj (pF) 120 100 80 60 0 1 2 3 Reverse Voltage - VR (V) 4 5  2003 Semtech Corp. 3 www.semtech.com uClamp0501H PROTECTION PRODUCTS Applications Information Device Connection Options These TVS diodes are designed to protect one data, I/ O, or power supply line. The device is unidirectional and may be used on lines where the signal polarity is above ground. The cathode band should be placed towards the line that is to be protected. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: " Place the TVS near the input terminals or connectors to restrict transient coupling. " Minimize the path length between the TVS and the protected line. " Minimize all conductive loops including power and ground loops. " The ESD transient return path to ground should be kept as short as possible. " Never run critical signals near board edges. " Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. Circuit Diagram  2003 Semtech Corp. 4 www.semtech.com uClamp0501H PROTECTION PRODUCTS Outline Drawing Land Pattern  2003 Semtech Corp. 5 www.semtech.com uClamp0501H PROTECTION PRODUCTS Marking Code Ordering Information Part Number uClamp 0501H.TCT Working Voltage 5V Device Qty per Marking Reel 5H 3,000 Reel Size 7 Inch 5H Tape and Reel Specification MicroClamp, uClamp and µClamp are trademarks of Semtech Corporation Tape Specifications Device Orientation in Tape Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 www.semtech.com  2003 Semtech Corp. 6