UCLAMP0501P.TCT

厂商：
SEMTECH
封装：
描述：
UCLAMP0501P.TCT - μClampTM 1-Line ESD protection - Semtech Corporation

数据手册：

下载UCLAMP0501P.TCT.pdf

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数据手册
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UCLAMP0501P.TCT 数据手册

µClampTM 1-Line ESD protection PROTECTION PROTECTION PRODUCTS - MicroClampTM Description The µClamp series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. It is designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and PDAs. It features large cross-sectional area junctions for conducting high transient currents. It offers superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The µClampTM0501P is in a 2-pin, RoHS/WEEE compliant, SLP1006P2 package. It measures 1.0 x 0.6 x 0.5mm. The leads are spaced at a pitch of 0.65mm and are finished with lead-free NiPdAu. Each device will protect one line operating at 5 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. They may be used to meet the ESD immunity requirements of IEC 610004-2, Level 4 (±15kV air, ±8kV contact discharge). The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. TM uClamp0501P Features Transient protection for data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) Ultra-small package (1.0 x 0.6 x 0.5mm) Protects one I/O or power line Low clamping voltage Working voltage: 5V Low leakage current Solid-state silicon-avalanche technology Mechanical Characteristics SLP1006P2 package RoHS/WEEE Compliant Nominal Dimensions: 1.0 x 0.6 x 0.5 mm Lead Finish: NiPdAu Molding compound flammability rating: UL 94V-0 Marking : Marking code, cathode band Packaging : Tape and Reel Applications Cellular Handsets & Accessories Personal Digital Assistants (PDAs) Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players Dimensions 1.0 0.60 0.65 Schematic & PIN Configuration 2 0.50 1 SLP1006P2 (Bottom View) 1 www.semtech.com Nominal Dimensions (mm) Revision 10/11/2007 uClamp0501P PROTECTION PRODUCTS Absolute Maximum Rating R ating Peak Pulse Power (tp = 8/20µs) Maximum Peak Pulse Current (tp = 8/20µs) ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) Op erating Temp erature Storage Temp erature Symbol Pp k Ip p VESD TJ TSTG Value 200 16 +/- 20 +/- 15 -55 to +125 -55 to +150 Units Watts Amps kV °C °C Electrical Characteristics (T=25oC) Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Forward Voltage Clamp ing Voltage Clamp ing Voltage Junction Cap acitance Symbol VRWM V BR IR VF VC VC Cj It = 1mA VRWM = 5V, T=25°C IF = 10mA IPP = 5A, tp = 8/20µs IPP = 16A, tp = 8/20µs VR = 0V, f = 1MHz 0.80 9.8 12.5 160 6 5 Conditions Minimum Typical Maximum 5 Units V V µA V V V pF  2007 Semtech Corp. 2 www.semtech.com uClamp0501P PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time 10 Power Derating Curve 110 100 90 % of Rated Power or IPP 80 70 60 50 40 30 20 10 0 Peak Pulse Power - P PP (kW) 1 0.1 0.01 0.1 1 10 Pulse Duration - tp (us) 100 1000 0 25 50 75 100 o 125 150 Ambient Temperature - TA ( C) Clamping Voltage vs. Peak Pulse Current 11 10 9 Clamping Voltage - VC (V) Forward Voltage vs. Forward Current 3.5 3 Forward Voltage - VF (V) 2.5 2 1.5 1 0.5 0 Waveform Parameters: tr = 8µs td = 20µs 8 7 6 5 4 3 2 1 0 0 5 10 Peak Pulse Current - IPP (A) 15 20 Waveform Parameters: tr = 8µs td = 20µs 0 5 10 Forward Current - IF (A) 15 20 Normalized Junction Capacitance vs. Reverse Voltage 1.1 1 0.9 0.8 CJ(VR) / CJ(VR=0) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 1 2 3 Reverse Voltage - VR (V) 4 5 f = 1 MHz ESD Clamping (8kV Contact per IEC 61000-4-2) Note: Data is taken with a 10x attenuator  2007 Semtech Corp. 3 www.semtech.com uClamp0501P PROTECTION PRODUCTS Applications Information Device Connection Options These TVS diodes are designed to protect one data, I/O, or power supply line. The device is unidirectional and may be used on lines where the signal polarity is above ground. The cathode band should be placed towards the line that is to be protected. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Circuit Diagram Pin 2 Pin 1  2007 Semtech Corp. 4 www.semtech.com uClamp0501P PROTECTION PRODUCTS Applications Information - Spice Model Figure 1 - uClamp0501P Spice Model Table 1 - uClamp0501P Spice Parameters Parameter IS BV VJ RS IB V CJO TT M N EG Unit Amp Volt Volt Ohm Amp Farad sec --eV D1 (T VS) 2.53e-12 7.08 0.71 0.129 1.0E-3 143.5e-12 2.541E-9 0.385 1.1 1.11  2007 Semtech Corp. 5 www.semtech.com uClamp0501P PROTECTION PRODUCTS Outline Drawing - SLP1006P2 A D B E DIM A A1 b D E e L R N aaa bbb TOP VIEW A aaa C A1 PIN 1 ID R bxN bbb CAB 2x L e C SEATING PLANE .016 .020 .022 .000 .001 .002 .018 .020 .022 .035 .039 .043 .020 .024 .028 .026 BSC .008 .010 .012 .002 .004 .006 2 .003 .004 DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX 0.40 0.50 0.55 0.00 0.03 0.05 0.45 0.50 0.55 0.90 1.00 1.10 0.50 0.60 0.70 0.65 BSC 0.20 0.25 0.30 0.05 0.10 0.15 2 0.08 0.10 BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP1006P2 Y (C) G Z DIMENSIONS DIM C G X Y Z INCHES (.033) .012 .024 .022 .055 MILLIMETERS (0.85) 0.30 0.60 0.55 1.40 X NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET.  2007 Semtech Corp. 6 www.semtech.com uClamp0501P PROTECTION PRODUCTS Marking Code Ordering Information Part Number Working Voltage 5V Qty per Reel 3,000 Reel Size 7 Inch 5P Note: Cathode bar at Pin 2 uClamp 0501P.TCT PIN 1 ID Notes: 1) This is a lead-free, RoHS/WEEE compliant product MicroClamp, uClamp and µClamp are marks of Semtech Corporation Tape and Reel Specification Cathode Bar User Direction of feed Device Orientation in Tape A0 0.69 +/-0.10 mm B0 1.19 +/-0.10 mm K0 0.66 +/-0.10 mm Tape Width B, (Max) D 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) D1 E 1.750±.10 mm (.069±.004) F P 4.0±0.10 mm (.157±.004) P0 4.0±0.1 mm (.157±.004) P2 T W 8.0 mm + 0.3 mm - 0.1 mm (.312±.012) 8 mm 4.2 mm (.165) 0.4 mm ±0.25 (.031) 3.5±0.05 mm (.138±.002) 2.0±0.05 mm (.079±.002) 0.254±0.02 mm (.016) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 www.semtech.com  2007 Semtech Corp. 7

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UCLAMP0501P.TCT

1. 物料型号： - 型号为：uClamp0501P。

2. 器件简介： - uClamp0501P属于µClampTM系列TVS（瞬态电压抑制）阵列，旨在保护敏感电子设备免受静电放电（ESD）造成的损坏或锁定。它设计用于替代手机、笔记本电脑和PDA等便携应用中的多层压敏电阻（MLV）。具有大的横截面积结，能够传导高瞬态电流，相比MLV具有更低的钳位电压和无器件退化的优越电气特性。

3. 引脚分配： - 该器件为2引脚封装，引脚间距为0.65mm，采用无铅NiPdAu电镀完成。

4. 参数特性： - 按照IEC 61000-4-2（ESD）标准，能够承受±15kV（空气放电）和±8kV（接触放电）的ESD冲击。 - 工作电压：5V，低漏电流。 - 采用固态硅雪崩技术。

5. 功能详解： - uClamp0501P提供数据线的瞬态保护，符合IEC 61000-4-2（ESD）、IEC 61000-4-4（EFT）和电缆放电事件（CDE）标准。 - 具有超小封装尺寸（1.0 x 0.6 x 0.5mm），适用于保护一个I/O或电源线路，钳位电压低。

6. 应用信息： - 适用于手机、配件、个人数字助理（PDA）、笔记本电脑和手持设备。 - 设计用于保护单个数据线、I/O或电源线路。

7. 封装信息： - 封装类型为SLP1006P2，符合RoHS/WEEE标准，尺寸为1.0 x 0.6 x 0.5mm。

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