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UCLAMP3301H

UCLAMP3301H

  • 厂商:

    SEMTECH

  • 封装:

  • 描述:

    UCLAMP3301H - Low Voltage UClampTM for ESD and CDE Protection - Semtech Corporation

  • 数据手册
  • 价格&库存
UCLAMP3301H 数据手册
Low Voltage µClampTM for ESD and CDE Protection PROTECTION PROTECTION PRODUCTS - MicroClampTM Description The µClamp series of Transient Voltage Suppressors (TVS) are designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and PDAs. They offer superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs. They are designed to protect sensitive semiconductor components from damage or upset due to electrostatic discharge (ESD), lightning, electrical fast transients (EFT), and cable discharge events (CDE). The µclampTM3301H is constructed using Semtech’s proprietary EPD process technology. The EPD process provides low standoff voltages with significant reductions in leakage currents and capacitance over siliconavalanche diode processes. They feature a true operating voltage of 3.3 volts for superior protection when compared to traditional pn junction devices. The µclamp3301H is in a SOD-523 package and will protect one unidirectional line. They give the designer the flexibility to protect one line in applications where arrays are not practical. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (15kV air, 8kV contact discharge). TM uClamp3301H Features Transient protection for data lines to IEC 61000-4-2 (ESD) 20kV (air), 10kV (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) Ultra-small SOD-523 package (1.7 x 0.9 x 0.7mm) Protects one I/O or power line Low clamping voltage Working voltage: 3.3V Low leakage current Solid-state silicon-avalanche technology Mechanical Characteristics EIAJ SOD-523 package Molding compound flammability rating: UL 94V-0 Marking : Marking code, cathode band Packaging : Tape and Reel per EIA 481 Lead Finish: Matte tin Applications Cellular Handsets & Accessories Cordless Phones Personal Digital Assistants (PDAs) Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players Dimensions 1.70 1.30 0.9 Schematic & PIN Configuration 0.35 0.70 Maximum Dimensions (mm) Revision 06/18/2004 1 SOD-523 (Top View) www.semtech.com uClamp3301H PROTECTION PRODUCTS Absolute Maximum Rating R ating Peak Pulse Power (tp = 8/20µs) Maximum Peak Pulse Current (tp = 8/20µs) ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) Lead Soldering Temperature Operating Temperature Storage Temperature Symbol Pp k Ip p V PP TL TJ TSTG Value 40 5 +/- 20 +/- 15 260 (10 sec.) -55 to +125 -55 to +150 Units Watts Amps kV °C °C °C Electrical Characteristics (T=25oC) Parameter Reverse Stand-Off Voltage Punch-Through Voltage Snap -Back Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Reverse Clamp ing Voltage Junction Cap acitance Symbol VRWM V PT VSB IR VC VC VCR Cj IPT = 2µA ISB = 50mA VRWM = 3.3V IPP = 1A, tp = 8/20µs IPP = 5A, tp = 8/20µs IPP = 1A, tp = 8/20µs I/O p in to Gnd VR = 0V, f = 1MHz I/O p in to Gnd VR = 3.3V, f = 1MHz 25 3.5 2.8 0.05 0.5 5.5 8.0 2.4 30 Conditions Minimum Typical Maximum 3.3 Units V V V µA V V V pF 14 pF  2004 Semtech Corp. 2 www.semtech.com uClamp3301H PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time 1 110 100 90 % of Rated Power or I PP 80 70 60 50 40 30 20 10 0 0 25 50 75 100 125 150 Power Derating Curve Peak Pulse Power - P PP (kW) 0.1 0.01 0.1 1 10 Pulse Duration - tp (µs) 100 1000 Ambient Temperature - TA (oC) Clamping Voltage vs. Peak Pulse Current 12 10 Junction Capacitance vs. Reverse Voltage 25.0 f = 1 MHz Clamping Voltage - VC (V) 20.0 Capacitance - Cj (pF) 5 8 6 4 2 0 0 1 2 3 4 0.0 0 0.5 1 1.5 2 2.5 Reverse Voltage - VR (V) 3 3.5 Waveform Parameters: tr = 8µs td = 20µs 15.0 10.0 5.0 Peak Pulse Current - IPP (A) Insertion Loss S21 CH1 S21 LOG 6 dB / REF 0 dB ESD Clamping (8kV Contact per IEC 61000-4-2) START . 030 M Hz STOP 3000. 000000 M Hz  2004 Semtech Corp. 3 www.semtech.com uClamp3301H PROTECTION PRODUCTS Applications Information Device Connection Options The µclamp3301H is designed to protect one I/O, or power supply line. It will present a high impedance to the protected line up to 3.3 volts. It will “turn on” when the line voltage exceeds 3.5 volts. The device is unidirectional and may be used on lines where the signal polarity is above ground. The cathode band should be placed towards the line that is to be protected. EPD TVS Characteristics These devices are constructed using Semtech’s proprietary EPD technology. The structure of the EPD TVS is vastly different from the traditional pn-junction devices. At voltages below 5V, high leakage current and junction capacitance render conventional avalanche technology impractical for most applications. However, by utilizing the EPD technology, these devices can effectively operate at 3.3V while maintaining excellent electrical characteristics. The EPD TVS employs a complex nppn structure in contrast to the pn structure normally found in traditional silicon-avalanche TVS diodes. The EPD mechanism is achieved by engineering the center region of the device such that the reverse biased junction does not avalanche, but will “punch-through” to a conducting state. This structure results in a device with superior DC electrical parameters at low voltages while maintaining the capability to absorb high transient currents. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. Device Schematic & Pin Configuration EPD TVS IV Characteristic Curve IPP ISB IPT VF IR VRWM V VPT VC SB IF  2004 Semtech Corp. 4 www.semtech.com uClamp3301H PROTECTION PRODUCTS Outline Drawing Land Pattern  2004 Semtech Corp. 5 www.semtech.com uClamp3301H PROTECTION PRODUCTS Marking Code Ordering Information Part Number uClamp 3301H.TCT Working Voltage 5V Device Qty per Marking Reel 3H 3,000 Reel Size 7 Inch 3H Tape and Reel Specification MicroClamp, uClamp and µClamp are trademarks of Semtech Corporation Tape Specifications Device Orientation in Tape Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 www.semtech.com  2004 Semtech Corp. 6
UCLAMP3301H 价格&库存

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UCLAMP3301H.TCT
  •  国内价格
  • 1+2.76679
  • 10+2.55396
  • 30+2.51139
  • 100+2.38369

库存:97