uClamp0506T.TCT

PROTECTION PRODUCTS - MicroClamp® PROTECTION Description The μClamp series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. It is designed to replace single line devices such as multilayer varistors (MLVs) in space constrained applications such as cell phones, notebook computers, and other portable electronics. It features large cross-sectional area junctions for conducting high transient currents. TVS diodes offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The μClamp®0506T is in a 6-pin SLP1313P6T package. It measures 1.3 x 1.3 mm with a nominal height of only 0.4mm. The leads are spaced at a pitch of 0.4mm and are finished with lead-free NiPdAu. Each device features six TVS diodes with an operating voltage of 5 volts and a maximum loading capacitance of only 10pF. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact discharge). The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and notebook computers. ® Low Profile μClamp® 6-Line ESD Protection Features Transient protection for data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) Cable Discharge Event (CDE) Ultra-small package Protects six data lines Low clamping voltage Working voltage: 5V Low capacitance (10pF) Solid-state silicon-avalanche technology uClamp0506T Mechanical Characteristics SLP1313P6T package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 1.3 x 1.3 x 0.4 mm Lead Finish: NiPdAu Molding compound flammability rating: UL 94V-0 Marking : Marking code Packaging : Tape and Reel Applications Cellular Handsets & Accessories Notebooks & Handhelds mp3 Players Cordless Phones Portable Instrumentation Digital Cameras Peripherals Dimensions 1 1.30 23 Schematic 1 1.30 2 3 4 5 6 6 5 4 0.40 BSC 0.40 Center Tab (GND) Nominal Dimensions (mm) (SLP1313P6T Bottom View) Revision 10/07/2009 1 www.semtech.com uClamp0506T PROTECTION PRODUCTS Absolute Maximum Rating R ating Peak Pulse Power (tp = 8/20μs) Maximum Peak Pulse Current (tp = 8/20μs) ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) Op erating Temp erature Storage Temp erature Symbol Pp k Ip p VESD TJ TSTG Value 25 2 +/- 20 +/- 15 -55 to +125 -55 to +150 Units Watts Amps kV °C °C Electrical Characteristics (T=25oC) Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Forward Voltage Clamp ing Voltage Junction Cap acitance Junction Cap acitance Symbol VRWM V BR IR VF VC Cj Cj It = 1mA VRWM = 5V, T=25°C IF = 10mA IPP = 2A, tp = 8/20μs VR = 0V, f = 1MHz VR = 3.3V, f = 1MHz 4.5 1 6 0.25 1.2 12.5 10 Conditions Minimum Typical Maximum 5 Units V V μA V V pF pF © 2009 Semtech Corp. 2 www.semtech.com uClamp0506T PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time 10 Power Derating Curve 110 100 90 % of Rated Power or IPP 80 70 60 50 40 30 20 10 0 Peak Pulse Power - PPP (kW) 1 0.1 0.01 0.1 1 10 100 Pulse Duration - tp (us) 0 25 50 75 100 125 150 Ambient Temperature - TA (oC) Clamping Voltage vs. Peak Pulse Current 15 8 7 Clamping Voltage - VC (V) Forward Voltage - VF V) 6 5 4 3 2 1 0 0 0.5 1 1.5 2 2.5 3 0 1 Forward Voltage vs. Forward Current 10 5 Waveform Parameters: tr = 8μs td = 20μs Waveform Parameters: tr = 8μs td = 20μs 0 Peak Pulse Current - IPP (A) 2 3 4 5 6 7 8 9 10 11 12 13 14 Forward Current - IF (A) Junction Capacitance vs. Reverse Voltage ESD Clamping (8kV Contact per IEC 61000-4-2) 1.1 1 0.9 0.8 CJ(VR) / CJ(VR=0) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 1 2 3 Reverse Voltage - VR (V) 4 5 f = 1 MHz Note: Data is taken with a 10x attenuator © 2009 Semtech Corp. 3 www.semtech.com uClamp0506T PROTECTION PRODUCTS Applications Information Device Connection Options This device is designed to protect six data lines. The device is unidirectional and may be used on lines where the signal polarity is above ground. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Circuit Diagram 1 2 3 4 5 6 Center Tab (GND) © 2009 Semtech Corp. 4 www.semtech.com uClamp0506T PROTECTION PRODUCTS Applications Information - Spice Model uClamp0506T Spice Model uClamp0506T Spice Parameters Parameter IS BV VJ RS IB V CJO TT M N EG Unit Amp Volt Volt Ohm Amp Farad sec --eV D1 (T VS) 2.05e-15 7.0 0.80 0.75 1.0E-3 9e-12 2.541E-9 0.25 1.1 1.11 © 2009 Semtech Corp. 5 www.semtech.com uClamp0506T PROTECTION PRODUCTS Outline Drawing - SLP1313P6T A D B PIN 1 INDICATOR (LASER MARK) E DIM A A1 A2 b D D1 E E1 e L N aaa bbb A aaa C A2 D1 1 2 LxN E1 E/2 A1 C SEATING PLANE .015 .016 .017 0.00 .001 .002 (.005) .006 .008 .010 .047 .051 .055 .035 .039 .043 .047 .051 .055 .008 .012 .016 .016 BSC .008 .010 .012 6 .003 .004 DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX 0.37 0.40 0.43 0.00 0.03 0.05 (0.13) 0.15 0.20 0.25 1.20 1.30 1.40 0.90 1.00 1.10 1.20 1.30 1.40 0.20 0.30 0.40 0.40 BSC 0.20 0.25 0.30 6 0.08 0.10 N e D/2 bxN bbb CAB NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - SLP1313P6T P DIM C G H K P X Y Z DIMENSIONS INCHES (.050) .027 .012 .039 .016 .008 .023 .073 MILLIMETERS (1.27) 0.69 0.30 1.00 0.40 0.20 0.58 1.85 (C) H Y X K G Z NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD SHALL BE CONNECTED TO A SYSTEM GROUND PLANE. FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR FUNCTIONAL PERFORMANCE OF THE DEVICE. © 2009 Semtech Corp. 6 www.semtech.com uClamp0506T PROTECTION PRODUCTS Marking Code Ordering Information Part Number uClamp 0506T.TCT Working Voltage 5V Qty per Reel 3,000 Reel Size 7 Inch U506T YW YW = Date Code Notes: 1) This is a lead-free, RoHS/WEEE compliant product MicroClamp, uClamp and μClamp are marks of Semtech Corporation Tape and Reel Specification Pin 1 Location User Direction of feed Device Orientation in Tape A0 1.51 +/-0.05 mm B0 1.51 +/-0.05 mm K0 0.56 +/-0.05 mm Tape Width B, (Max) D 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) D1 E 1.750±.10 mm (.069±.004) F K (MAX) P 4.0±0.1 mm (.157±.004) P0 4.0±0.1 mm (.157±.004) P2 T(MAX) W 8.0 mm + 0.3 mm - 0.1 mm (.312±.012) 8 mm 4.2 mm (.165) 0.8 mm ±0.05 (.031) 3.5±0.05 mm (.138±.002) 2.4 mm (.094) 2.0±0.05mm (.079±.002) 0.4 mm (.016) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 www.semtech.com © 2009 Semtech Corp. 7