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RS2D

RS2D

  • 厂商:

    SEMTECH_ELEC

  • 封装:

  • 描述:

    RS2D - SURFACE MOUNT FAST RECOVERY RECTIFIERS - SEMTECH ELECTRONICS LTD.

  • 详情介绍
  • 数据手册
  • 价格&库存
RS2D 数据手册
RS2A THRU RS2M SURFACE MOUNT FAST RECOVERY RECTIFIERS Reverse Voltage – 50 to 1000 Volts Forward Current – 2.0 Amperes Features The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 Fast switching for high efficiency Built-in strain relief, ideal for automated placement Low reverse leakage High forward surge current capability For surface mounted applications High temperature soldering guaranteed:250℃/10 seconds at terminals. Mechanical Data • Case: Molded plastic body, JEDEC DO-214AA • Terminals: Solder plated, solderable per MIL-STD-750, method 2026 • Polarity: Color band denotes cathode end. • Mounting Position: Any Absolute Maximum Ratings and Characteristics Ratings at 25℃ ambient temperature unless otherwise specified. Single phase, half-wave 60Hz , resistive or inductive load. For capacitive load current derate by 20%. Symbols Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL = 90 OC Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC method) Maximum instantaneous forward voltage at 2A Maximum DC reverse current at rated DC blocking voltage TA = 25 C TA = 100OC O RS 2A 50 35 50 RS 2B 100 70 100 RS 2D 200 140 200 RS 2G 400 280 400 2 RS 2J 600 420 600 RS 2K 800 560 800 RS 2M 1000 700 1000 Units V V V A VRRM VRMS VDC I(AV) IFSM VF IR trr CJ RΘJA TJ TS 150 50 1.3 5 50 250 50 20 -65 to +150 -65 to +150 O A V µA 500 ns pF C/W O O Maximum reverse recovery time (Note 1) Typical junction capacitance (Note 2) Typical thermal resistance (Note 3) Operating junction temperature range storage temperature range C C Notes: 1. Reverse recovery condition IF=0.5A, IR = 1A, Irr = 0.25A. 2. Measured at 1MHZ and applied reverse voltage of 4V DC. 3. P.C.B, mounted with 0.2×0.2” (5.0×5.0mm) copper pad areas. SEMTECH ELECTRONICS LTD. ® (Subsidiary of Semtech International Holdings Limited, acompany listed on the Hong Kong Stock Exchange, Stock Code: 724) Dated : 29/03/2004 RS2A THRU RS2M RATINGS AND CHARACTERISTIC CURVES Average Forward Rectified Current, Amperes FIG. 1-Forward Current Derating Curve 2.0 1.6 1.2 0.8 0.4 0 0 25 50 75 100 125 150 175 Single Phase Half Wave 60Hz Resistive or Inductive Load FIG. 2-Maximum Non-Repetitive Peak Forward Surge Current 50 Peak Forward Surge Current, Amperes 40 30 20 10 8.3ms Single Half Sine-Wave (JEDEC Method) 0 100 1 10 Ambient Temperature,°C Number of Cycles at 60 Hz FIG. 4-Typical Reverse Characteristics Instantaneous Reverse Current, Microamperes FIG. 3-Typical Instantaneous Forward Characteristics Instantaneous Forward Current, Amperes 20 10 1 TJ=25°C Pulse Width=300us 1%Duty Cycle 1000 100 10 1 0.1 0.01 TJ=100°C 0.1 0.01 0.6 TJ=25°C 0 20 40 60 80 100 0.8 1.0 1.2 1.4 1.5 Instantaneous Forward Voltage, Volts Percent of Peak Reverse Voltage,% 200 Transient Thermal Impedance, °C/W FIG.5-Typical Junction Capacitance TJ=25°C FIG.6-Typical Transient Thermal Impedance 100 Junction Capacitance,pF 100 10 10 1 0.1 0.01 0.1 1 10 100 1 0.1 1.0 10 100 Reverse Voltage, Volts t, Pulse Duration,sec. SEMTECH ELECTRONICS LTD. ® (Subsidiary of Semtech International Holdings Limited, acompany listed on the Hong Kong Stock Exchange, Stock Code: 724) Dated : 29/03/2004
RS2D
### 物料型号 - 型号:RS2A至RS2M

### 器件简介 - 描述:表面贴装快速恢复整流器,具有反向电压50至1000伏特,正向电流2.0安培。 - 特点:塑料封装符合UL94V-0可燃性等级,快速开关以提高效率,内置应变消除,适合自动化放置,低反向漏电,高正向浪涌电流能力,适用于表面贴装应用,保证高温焊接:250℃/10秒在端子处。

### 引脚分配 - 封装:模塑塑料体,JEDEC DO-214AA。 - 端子:电镀锡,符合MIL-STD-750,方法2026。 - 极性:色带表示阴极端。

### 参数特性 - 最大重复峰值反向电压(VRRM):50至1000伏特 - 最大RMS电压(VRMS):35至700伏特 - 最大DC阻断电压(VDc):50至1000伏特 - 最大平均正向整流电流(I(AV)):2安培(在TL = 90°C时) - 峰值正向浪涌电流(IFSM):50安培(8.3ms单半正弦波叠加在额定负载上,JEDEC方法) - 最大瞬时正向电压在2A(VF):1.3伏特 - TA=25°C时最大DC反向电流(IR):5至50微安培 - 最大反向恢复时间(trr):150至500纳秒 - 典型结电容(CJ):50皮法拉 - 典型热阻(ReJA):20°C/W - 工作结温范围(TJ):-65至+150°C - 存储温度范围(Ts):-65至+150°C

### 功能详解 - 该器件为快速恢复整流器,适用于需要快速开关的应用,以提高效率。内置的应变消除使其适合自动化放置,而低反向漏电和高正向浪涌电流能力使其适用于高要求的电力电子应用。

### 应用信息 - 适用于表面贴装应用,特别是在需要快速开关和高效率的场合。

### 封装信息 - 封装类型:模塑塑料体,JEDEC DO-214AA。 - 端子:电镀锡,符合MIL-STD-750,方法2026。 - 极性:色带表示阴极端,可任意位置安装。

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