C9WT821

Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Specification C9WT821 SSC Drawn Approval CUSTOMER Approval Rev. 01 October 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet CONTENTS 1. 2. 3. 4. 5. 6. 7. 8. 9. Description Absolute Maximum Ratings Electro-Optical Characteristics Optical characteristics Reliability Test Color & Binning Bin Code Description Outline Dimension Reel Structure 10. Packing 11. Soldering 12. Precaution for use 13. Handling of Silicone Resin LEDs Rev. 01 October 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet C9WT821 1. Description TOP VIEW LED is designed for high current operation and high flux output applications. Furthermore, its thermal management characteristic is better than other LED solutions by package SMD design and good thermal emission material. According to these advantages, it enables to apply various lighting applications and design solution, automotive lighting etc. • • • C9WT821 Features White & Warm colored SMT package. • • High CRI PKG Pb-free Reflow Soldering Application • Suitable for all SMT assembly methods ; Suitable for all soldering methods RoHS Compliant MSL LEVEL 2a Applications • • • Interior lighting General lighting Indoor and out door displays • Architectural / Decorative lighting Rev. 01 October 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings Parameter Power Dissipation Forward Current Peak Forward Current (Per die) Reverse Voltage (per die) Operating Temperature Storage Temperature Symbol Pd IF IFM *2 Value 324 90 100 5 -40 ~ +85 -40 ~ +100 Unit mW mA mA V ºC ºC VR Topr Tstg *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 0.1msec of pulse width and D ≤ 1/10 of duty ratio. 3. Electric & Optical characteristics Parameter Forward Voltage (per die) Reverse Current (per die) Luminance Intensity *1 [2,600 ~ 4,700 K ] Luminance Flux [CIE X = 0.31, Y = 0.31] Color Temperature Optical Efficiency Viewing Angle *2 Symbol VF IR IV ΦV CCT Condition IF =20mA VR=5V IF =60mA IF =60mA Min 3.0 4.0 2,600 Typ 3.3 4.5 14 Max 3.6 10 7,000 Unit V µA cd lm K lm/W deg Ŋelc 2θ½ Ra IF =60mA IF =60mA IF =60mA - 71 120 92 - Color Rendering Index *1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC. Rev. 01 October 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00) Relative luminouce Flux [lm] 2.5 3.0 3.5 4.0 Forward Current [mA] Forward Current IF[mA] Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 10 35 30 25 20 15 10 5 0 4. Optical characteristics Forward Voltage vs. Forward Current (Per die) Forward Current vs. Relative Luminous Intensity 2.5 2.0 1.5 1.0 0.5 1 2.0 0.0 0 50 100 150 200 Forward Voltage[V] Forward Current IF[mA] Ambient Temperature vs. Maximum Forward Current (per die) Directivity 0 -3 0 30 -6 0 60 -9 0 -2 5 0 25 50 O 90 75 100 A m bi ent t e m p er at ur e T a ( C ) Rev. 01 October 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 5. Reliability Test Number of Damaged 0/22 0/22 0/22 0/22 0/22 Item Reference EIAJ ED-4701 EIAJ ED-4701 EIAJ ED-4701 EIAJ ED-4701 Internal Reference Internal Reference Internal Reference Internal Reference MIL-STD883D Test Conditions Ta =-40oC(30min) ~ 100oC(30min) Ta =100oC Ta =60oC, RH=90% Ta =-40oC Ta =25oC, IF =60mA Ta =60oC, RH=90%, IF =60mA Duration / Cycle 1000 Cycle 1000 Hours 1000 Hours 1000 Hours 1000 Hours 500 Hours 1000 Hours Thermal Shock High Temperature Storage High Temp. High Humidity Storage Low Temperature Storage Operating Endurance Test High Temperature High Humidity Life Test 0/22 High Temperature Life Test Low Temperature Life Test ESD(HBM) Ta =85oC, IF =60mA Ta =-40oC, IF =60mA 1KV at 1.5kΩ; 100pF 0/22 0/22 0/22 1000 Hours 3 Time □ CRITERIA FOR JUDGING THE DAMAGE Item Forward Voltage Luminous Intensity Symbol VF IV Condition IF =60mA (20mA per die) IF =60mA (20mA per die) Criteria for Judgment MIN LSL*2 × 0.5 MAX USL*1 × 1.2 - Note : *1 USL : Upper Standard Level *2 LSL : Lower Standard Level Rev. 01 October 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00) CIE (y) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 6. Color & Binning 0.9 0.8 0.7 505 520 51 5 525 530 510 535 54 0 545 550 555 560 565 570 575 580 55 8 590 595 600 61 0 620 630 83 0 0.6 500 0.5 0.4 0.3 0.2 0.1 0.0 0.0 495 490 485 480 47 5 470 460 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 CI E(x) Rev. 01 October 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00) CIE Y Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 6. Color & Binning 0.44 0.42 0.40 0.38 0.36 0.34 0.32 0.30 ENERGY STAR RANK (7000K~2600K) 2700K 2600K 2900K 3000K 3200K H1 H3 G3 3500K G1 3700K F3 H4 4000K F1 G4 H2 4200K G2 E3 F4 4500K E1 F2 4700K E4 D3 5000K D1 E2 5300K C3 D4 5600K C1 D2 B3 C4 6000K C2 B1 6500K B4 A3 B2 7000K A1 A4 A2 0.28 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 CIE X Rev. 01 October 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 6. Color & Binning ● COLOR RANK 7000 ~ 6500 K A1 CIE X 0.3028 0.3048 0.3131 0.3117 6500 ~ 6000 K A2 A3 CIE Y 0.3209 0.3113 0.3187 0.3290 A4 CIE Y 0.3393 0.3290 0.3371 0.3481 CIE Y 0.3304 0.3209 0.3290 0.3393 CIE X 0.3048 0.3068 0.3145 0.3131 CIE X 0.3117 0.3131 0.3213 0.3205 CIE X 0.3131 0.3145 0.3221 0.3213 CIE Y 0.3290 0.3187 0.3261 0.3371 6000 ~ 5600 K B1 CIE X 0.3207 0.3215 0.3293 0.3292 CIE Y 0.3462 0.3353 0.3423 0.3539 CIE X 0.3215 0.3222 0.3294 0.3293 5600 ~ 5300 K B2 CIE Y 0.3353 0.3243 0.3306 0.3423 CIE X 0.3292 0.3293 0.3371 0.3376 B3 CIE Y 0.3539 0.3423 0.3493 0.3616 CIE X 0.3293 0.3294 0.3366 0.3371 B4 CIE Y 0.3423 0.3306 0.3369 0.3493 5300 ~ 5000 K C1 CIE X 0.3376 0.3371 0.3451 0.3463 CIE Y 0.3616 0.349 0.3554 0.3687 CIE X 0.3371 0.3366 0.344 0.3451 5000 ~ 4700 K C2 CIE Y 0.349 0.3369 0.3428 0.3554 CIE X 0.3463 0.3451 0.3533 0.3551 C3 CIE Y 0.3687 0.3554 0.362 0.376 CIE X 0.3451 0.344 0.3515 0.3533 C4 CIE Y 0.3554 0.3428 0.3487 0.362 ● A~C -> CCT 4700 ~ 7000 K Rev. 01 October 2009 * Measurement Uncertainty of the Color Coordinates : ± 0.01 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 6. Color & Binning ● COLOR RANK 4700 ~ 4500 K D1 D2 CIE X CIE Y CIE X CIE Y 0.3548 0.3529 0.3615 0.3641 0.3736 0.3597 0.3659 0.3804 0.3529 0.3512 0.359 0.3615 0.3597 0.3465 0.3521 0.3659 4500 ~ 4200 K D3 CIE X 0.3641 0.3615 0.3702 0.3736 D4 CIE Y 0.3804 0.3659 0.3722 0.3874 CIE X 0.3615 0.359 0.367 0.3702 CIE Y 0.3659 0.3521 0.3578 0.3722 4200 ~4000 K E1 CIE X 0.3736 0.3702 0.3825 0.3869 CIE Y 0.3874 0.3722 0.3798 0.3958 CIE X 0.3702 0.367 0.3783 0.3825 4000 ~ 3700 k E2 CIE Y 0.3722 0.3578 0.3646 0.3798 CIE X 0.3869 0.3825 0.395 0.4006 E3 CIE Y 0.3958 0.3798 0.3875 0.4044 CIE X 0.3825 0.3783 0.3898 0.395 E4 CIE Y 0.3798 0.3646 0.3716 0.3875 3700 ~ 3500 K F1 CIE X 0.3996 0.3941 0.408 0.4146 3500 ~ 3200 K F2 F3 CIE Y 0.3848 0.369 0.3751 0.3916 F4 CIE Y 0.4089 0.3916 0.3984 0.4165 CIE Y 0.4015 0.3848 0.3916 0.4089 CIE X 0.3941 0.3889 0.4017 0.408 CIE X 0.4146 0.408 0.4221 0.4299 CIE X 0.408 0.4017 0.4147 0.4221 CIE Y 0.3916 0.3751 0.3814 0.3984 3200 ~3000 K G1 CIE X 0.4299 0.4221 0.4342 0.443 CIE Y 0.4165 0.3984 0.4028 0.4212 CIE X 0.4221 0.4147 0.4259 0.4342 3000 ~ 2900 k G2 CIE Y 0.3984 0.3814 0.3853 0.4028 CIE X 0.443 0.4342 0.4465 0.4562 G3 CIE Y 0.4212 0.4028 0.4071 0.426 CIE X 0.4342 0.4259 0.4373 0.4465 G4 CIE Y 0.4028 0.3853 0.3893 0.4071 2900 ~ 2700 K H1 H2 CIE X CIE Y CIE X CIE Y 0.4562 0.4465 0.4582 0.4687 0.426 0.4071 0.4099 0.4289 0.4465 0.4373 0.4483 0.4582 0.4071 0.3893 0.3919 0.4099 2700 ~ 2600 K H3 CIE X 0.4687 0.4582 0.47 0.4813 H4 CIE Y 0.4289 0.4099 0.4126 0.4319 CIE X 0.4582 0.4483 0.4593 0.47 CIE Y 0.4099 0.3919 0.3944 0.4126 Rev. 01 October 2009 ● D~H -> CCT 2600 ~ 4700 K * Measurement Uncertainty of the Color Coordinates : ± 0.01 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet M0 M5 N0 N5 7. Bin Code Description Bin Code Luminous Intensity [mcd] M0 Color Rank A1 Forward Voltage [V] Z1 4,700K ~ 7,000K Luminous Intensity [mcd] @ IF = 60mA RANK Min. 4,000 4,500 5,000 5,500 Max. 4,500 5,000 5,500 6,000 Color Rank @ IF = 60mA A1 A2 B1 B2 C1 C2 A3 A4 B3 B4 C3 C4 Average for Total Forward Voltage [V] @ IF = 60mA RANK Z1 Z2 Z3 A1 A2 Min. 3.0 3.1 3.2 3.3 3.45 Max. 3.1 3.2 3.3 3.45 3.6 2,600K ~ 4,700K Color Rank @ IF = 60mA D1 D2 E1 E2 F1 F2 G1 G2 H1 H2 D3 D4 E3 E4 F3 F4 G3 G4 H3 H4 Rev. 01 October 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00) 3.5±0.1 1.75±0.1 8±0.1 5° 1 . 0±0.1 3.1±0.1 8° 3.83±0.1 30° 10 22 (1) Quantity : 2000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package 60 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 8. Outline Dimension 2.80 0.75 1.9 0.85 0.80 Anode 1 4 3 3.20 2.40 1.50 4 2 3 Cathode Cathode Cathode 1 2 0.50 0.15 P acking Mark (Anode) ATTENTION MARKING ON LED IS ANODE(+) ( Tolerance: ±0.2, Unit: mm ) 9. Reel Structure 2.0±0 . 0 5 4.0±0.1 1. 5 5 ± 0 . 0 5 0. 2 2 ±0 . 0 5 2.22±0.1 11.4 ± 0.1 180 +0 -3 2.0 ± 0.2 LABLE 13 ±0.2 9.0 ± 0.3 Rev. 01 October 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 10. Packing Reel Q UANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART N UMBER : SEOUL SEMICON DUCTOR CO., LTD. HUMIDITY INDICATOR D ESI PAK Aluminum Vinyl Bag Q UANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART N UMBER : SEOUL SEMICON DUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) TYPE SIZE (mm) a c b 245 220 102 7inch 245 220 142 1 SIDE c TUV MADE I N KOREA Q UANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART N UMBER : SEOUL SEMICON DUCTOR CO., LTD. Acriche Ro HS 1 Sem icon ductor Eco Light b a Rev. 01 October 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 11. Soldering (1) Lead Solder Lead Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 120~150℃ 120 sec. Max. 240℃ Max. 10 sec. Max. 120sec. Max. 2.5~5 C / sec. Lead Solder 2.5~5 o C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC (2) Lead-Free Solder Lead-free Solder Lead Free Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 150~200℃ 120 sec. Max. 260℃ Max. 10 sec. Max. 1~5 oC / sec. 1~5 oC / sec. Pre-heating 150~200 o C 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 120sec. Max. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. [Note] In case that the soldered products are reused in soldering process, we don’t guarantee the products. Rev. 01 October 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 12. Precaution for use 1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 65%RH 2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 30% 3) In the case of more than 4 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. 4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. 5) Quick cooling shall be avoided. 6) Components shall not be mounted on warped direction of PCB. 7) Anti radioactive ray design is not considered for the products. 8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. 9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. 10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. 11) The LEDs must be soldered within seven days after opening the moisture-proof packing. 12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. 13) The appearance and specifications of the product may be modified for improvement without notice. Rev. 01 October 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 13. Handling of Silicone Resin LEDs 1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. 2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. 3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. 4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. 5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. 6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. Rev. 01 October 2009 www.acriche.com www.acriche.com SSC-QP-7-07-24 (Rev.00)