CFT732-S

Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Specification CFT732-S Preliminary SSC Drawn Approval CUSTOMER Approval Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet CONTENTS 1. Feature & Application 2. Absolute Maximum Ratings 3. Electro Characteristics 4. Optical characteristics 5. Color & Binning 6. Colors of CFT732-S 7. Outline Dimension 8. Recommend Circuit 9. Packing 10. Lot Number 11. Soldering 12. Precaution for use 13. Handling of Silicone Resin LEDs Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet CFT732-S Description This surface-mount LED comes in PLCC standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone. The package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range -40℃ to 100℃. The high reliability feature is crucial to Automotive interior and Indoor ESS. • • • • CFT732-S Features Pb-free Reflow Soldering application RoHS Compliant 6-Pin White colored SMT package and diffused (milky color) • Suitable for all SMT assembly methods • ESD-withstand voltage : up to 1 kV (MIL-STD-883D) • High Reliability (silicone resin) Applications • • • • • • Indoor and outdoor displays LCD Backlights etc. R G B – displays Automotive Signage and Channel letter Indicator Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings (Ta=25ºC) Value Parameter Forward Current Forward Peak Surge Current *2 Reverse Voltage (per die) Power Dissipation Operating Temperature Storage Temperature Symbol Red IF IFM VR 81*3 Pd Topr Tstg 120*3 263*4 -40 ~ +85 -40 ~ +100 ºC ºC 30 100 Green 30 100 5 114*3 252*3 mW Blue 30 100 Yellow 30 100 mA mA V Unit *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. *3 The value for one LED device.(Single color) *4 The value for total power dissipation when two and more devices are lit simultaneously. Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 3. Electric & Optical characteristics Parameter Forward Voltage Reverse Current R, Y G, B R, Y, G, B Red Luminance Intensity *1 Yellow Green Blue Red Luminance Flux *1 Yellow Green Blue Red Peak Wavelength Yellow Green Blue Red Dominant Wavelength Yellow Green Blue Red Spectral Bandwidth Yellow Green Blue Viewing Angle *3 R, G, B, Y Red Optical Efficiency Yellow Green Blue 2 θ½ IF =20mA (per die) IF =20mA (per chip) IF =20mA (per chip) IF =20mA (per chip) IV IF =20mA (per chip) Symbol VF IR Condition IF =20mA (per chip) VR=10V (per die) (Ta=25ºC) Min 1.8 3.0 Typ 2.2 3.2 700 370 1200 400 1.7 1.0 3.0 0.9 632 590 518 453 623 590 527 460 15 14 33 23 110 0.015 0.01 0.19 0.006 Max 2.5 3.5 1 625 596 535 465 lm/W deg. nm nm nm lm mcd Unit V µA ΦV IF =20mA (per chip) λP 620 586 520 455 - λd ∆λ ηop IF =20mA (per chip) - *1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2 Please refer to CIE 1931 chromaticity diagram *3 2　½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC. Document No. : SSC-QP-7-07-24 (Rev.00) Forward Current IFP [mA] Relative Luminosity (a.u.) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics Forward Current vs. Forward Voltage (per die) (Ta=25 OC ) 100 50 Y e llo w Red B lu e G re e n 20 10 5 1 1 .6 2 .0 2 .4 2 .8 3 .2 3 .6 4 .0 4 .4 4 .8 F o rw a rd V o lta g e V F [V ] Relative Luminous Intensity vs Forward Current 6 (Ta=25 OC ) 5 RED BLUE GREEN yellow 4 3 2 1 0 0 20 40 60 80 100 120 Forward Current IFP [mA] Document No. : SSC-QP-7-07-24 (Rev.00) Forward Current IF[mA] Forward Current IF[mA] Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics Forward Current Derating Curve : 1 Chip on 30 20 10 Red, Yellow, Green, Blue 0 0 20 40 60 o 80 100 Ambient Temperature Ta[ C] Forward Current Derating Curve : 4 Chip on 30 20 10 Red, Yellow, Green, Blue 0 0 20 40 60 o 80 100 Ambient Temperature Ta[ C] Document No. : SSC-QP-7-07-24 (Rev.00) Intensity Irel [a.u.] Intensity Irel [a.u.] Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics Spectrum (TA=25℃, IF=20mA) 1.0 0.8 RED YELLOW GREEN BLUE 0.6 0.4 0.2 0.0 400 500 600 700 W avelength λ[nm] (TA=25℃, IF=20mA/chip) 1.0 0.8 0.6 0.4 0.2 0.0 300 400 500 600 700 800 Wavelength λ[nm] Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics Radiation Diagram (Ta=25 OC ) 90 120 60 y-axis x-axis 150 30 180 0 Document No. : SSC-QP-7-07-24 (Rev.00) y Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 5. Color & Binning (Standard Binning) Red X 0.69 0.706 0.692 0.678 Y 0.3 0.298 0.312 0.312 Yellow X 0.536 0.545 0.575 0.566 Y 0.445 0.454 0.424 0.415 X 0.166 0.201 0.176 0.137 Green A Y 0.677 0.687 0.749 0.739 X 0.201 0.236 0.22 0.176 B Y 0.687 0.685 0.744 0.749 X 0.153 0.164 0.155 0.143 1 Y 0.022 0.039 0.05 0.031 X 0.143 0.155 0.148 0.134 Blue 2 Y 0.031 0.05 0.065 0.044 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 520 525 515 530 535 540 510 545 550 555 505 560 565 570 500 575 580 585 590 495 595 600 Green AB Yellow 610 620 630 830 Red 490 485 480 Blue 475 470 460 2 1 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.1 0.2 x Document No. : SSC-QP-7-07-24 (Rev.00) y 0.4 0.3 0.2 0.1 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 5. Color & Binning (Special Binning ) 0.9 0.8 0.7 0.6 0.5 x ◈ Target of Color : Bluish White (Cool White) - Color Coordinates (typ.): x 0.237 , y 0.217 - IF Condition => 10mA for Red / 20mA for Yellow / 20mA for Green / 20mA for Blue - 1 Bin, Cell Size = x 0.0341 , y 0.0217 - 9 Bin, Total Cell Size = x 0.088 , y 0.091 - Color Rank : a, b, c, d, e, f, g, h (8 BIN) Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 6. Colors of CFT732-S (Standard Color) Step 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Color (20mA per Chip) Symbol R G B Y RG RB RY GB GY BY RGB RGY RBY GBY RGBY Color Name Red Green Blue Yellow Greenish Yellow Violet Redish Orange Bluish Green Yellowish Green Purpleish Blue Bulish White Greenish Yellow Purple Greenish Blue Bulish White Color Coordinate(Typ.) X 0.700 0.164 0.146 0.562 0.445 0.279 0.660 0.150 0.289 0.193 0.258 0.466 0.304 0.188 0.281 Y 0.300 0.712 0.040 0.437 0.496 0.102 0.340 0.190 0.625 0.084 0.210 0.485 0.132 0.212 0.227 Document No. : SSC-QP-7-07-24 (Rev.00) y Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 6. Colors of CFT732-S (Standard Color) 0.9 0.8 0.7 505 515 510 520 525 530 535 540 545 550 555 2 0.6 500 9 560 565 570 0.5 0.4 0.3 0.2 0.1 0.0 0.0 495 5 12 575 580 585 4 590 595 600 7 610 490 620 1 630 830 485 8 14 15 11 13 480 475 470 460 10 3 6 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 x Document No. : SSC-QP-7-07-24 (Rev.00) y Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 6. Colors of CFT732-S (Special Color ) Step 0 1 2 3 4 5 Full White Color Balance White Bulish White Pure White Natural White Warm White Candle Light CCT 28000K Undefined 7400K 4000K 2800K 2000K Color Coordinates (Typ.) X 0.2778 0.243 0.303 0.385 0.449 0.547 Y 0.2256 0.218 0.298 0.387 0.412 0.427 R 20 10 15 20 20 20 Balance Current IFbal[mA] Y 20 20 20 15 20 6 G 20 20 20 20 14 7 B 20 20 10 4 2 0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 BLUISH 7400K 4000K 2800K 2000K Balance white x Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 7.Outline Dimension Package Outlines 6 5 4 Package Marking 1 2 3 Front View Right View Rear View ( Tolerance: ±0.2, Unit: mm ) Circuit Diagram Anode 2 Anode 5 Recommended Solder Pad 1 3 4 6 Blue Green Cathode Cathode Red Yellow Cathode Cathode * MATERIALS PARTS Package Encapsulating Resin Electrodes MATERIALS Heat-Resistant Polymer Silicone Resin (Diffused) Ag Plating Copper Alloy Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 6 1 8. Recommend Circuit Circuit Diagram Anode 2 Anode 5 1 3 4 6 Blue Green Cathode Cathode Red Yellow Cathode Cathode Circuit (Led Dot Matrix - Dynamic Drive) Scan Line 5 4 Anode 2 S1 Anode 5 Anode 2 S2 Anode 5 Anode 2 S3 Anode 5 Anode 2 S4 Anode 5 2 3 1 3 4 6 1 3 4 6 1 3 4 6 1 3 4 6 Blue Green Cathode Cathode Red Yellow Cathode Cathode Blue Green Cathode Cathode Red Yellow Cathode Cathode Blue Green Cathode Cathode Red Yellow Cathode Cathode Blue Green Cathode Cathode Red Yellow Cathode Cathode Data Line D1 D2 D3 D4 Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 9. Packing Package Marking ( Tolerance: ±0.2, Unit: mm ) 1)Quantity : 700pcs/Reel 2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm 3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10 to the carrier tape 4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet ● Reel Packing Structure Reel RANK: QUANTITY : XXXX LOT NUM BER : XXXXXXXXXX PART NUMBER : XXX XXXXXX SEOUL SEM ICONDU CTOR CO., LTD. H UM IDITY INDICATOR DESI PAK Aluminum Vinyl Bag RANK: QUANTITY : XXXX LOT NUM BER : XXXXXXXXXX PART NUMBER : XXX XXXXXX SEO UL SEM ICONDUCTOR CO., LTD. Outer Box Structure M aterial : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE RANK: QUANTITY : XXXX LOT NUM BER : XXXXXXXXXX PART NUMBER : RoHS XXX XXXXXX b c 1 SEO UL SEM ICONDUCTOR CO., LTD. a Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 10. Lot Number The lot number is composed of the following characters; CFT○□□◎◎ # ~ # CFT –First Part Name ○ – Year (6 for 2006, 7 for 2007, 8 for 2008 ) □□ – Month ( 01 for Jan., 02 for Feb.,‥‥‥11 for Nov., 12 for Dec.) ◎◎ – Day ( 01, 02, 03, 04, ‥‥‥‥‥‥28, 29, 30, 31.) # ~# – The number of the internal quality control XXX QUANTITY : 700 LOT NUMBER : CFT80426 01 512 PART NUMBER : CFT732-S SEOUL SEMICONDUCTOR CO., LTD. Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 11. Soldering (1) Lead Solder Lead Solder Lead Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 120~150℃ 120 sec. Max. 240℃ Max. 10 sec. Max. 2.5~5 C / sec. 2.5~5 o C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder L ea d -fra m e Solder Lead Free Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 150~200℃ 120 sec. Max. 260℃ Max. 10 sec. Max. 1~5 o C / sec. 1~5 o C / sec. Pre-heating 150~200 o C 26 0 oC M ax. 10 sec. M ax. 60sec. M a x. A b o ve 220 oC 120sec. M ax. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 12. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 13. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. Document No. : SSC-QP-7-07-24 (Rev.00)