F10390

Power LED TECHNICAL DATA F10390 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Rev06 – 2005/09 1 SPECIFICATIONS - Features • Super high flux output and high luminance • Designed for high current operation • Low thermal resistance • SMT solderbility • Lead (Pb) Free Product – RoHS Compliant - Applications • General Illumination - Outdoor & Indoor architectural lighting - Decorative lighting - Torch lighting - Portable lighting (Flash and lamp) and Reading lighting - LCD Backlighting - Description Z-Power series is designed for high current operation and high flux output applications. Z-Power LED's thermal management perform exceeds other power LED solutions. It incorporates state of the art SMD design and Thermal emission material. Z Power LED is ideal light sources for general illumination applications, custom designed solutions, automotive large LCD backlights. SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Rev06 – 2005/09 2 Full Code explanation of Z-Power LED series Full code form : X1 X2 X3 X4 X5 X6 – X7 X8 – X9 X10 X11 X12 X13 1. Part number - X1 : Color - X2 : Z-Power LED series number - X3 : LENS type - X4 : Chip Quantity - X5 : Package outline size - X6 : Metal PCB type 2. Internal Number - X7 - X8 3. Code Labeling - X9 : Luminous Flux (or Radiant Flux for Royal) - X10 X11X12 : Dominant Wavelength (or x,y coordinates rank code) - X13 : Forward Voltage For more information about binning and labeling, refer to the Application Note -1 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Rev06 – 2005/09 3 1. Outline Dimensions Slug (+) R G B Green Red Notes : 1. All dimensions are in millimeters. 2. Scale : none 3. This drawing is reference only for engineering SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Rev06 – 2005/09 4 White 2. Electro-Optical Characteristics (at TA=25ºC) Value Parameter Luminous Flux [1] Correlated Color Temperature [3] Forward Voltage [4] Forward Current Symbol Min ФV [2] Unit Typ 60 6000 R:2.5 ,B/G:3.4 R:237, G:370, B:120 Max lm K V mA - CCT VF IF 3. Absolute Maximum Ratings (at TA=25ºC) Parameter Forward Current Power Dissipation Junction Temperature Operating Temperature Storage Temperature ESD Sensitivity [5] Symbol IF PD Tj Topr Tstg Value 1.2 3.5 125 -30 ~ +85 -40 ~ +120 ±20,000V HBM Unit A W ºC ºC ºC - *Notes : [1] SSC maintains a tolerance of ±10% on flux and power measurements. [2] ФV is the total luminous flux output as measured with an integrated sphere. [3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. CCT ±5% tester tolerance [4] A tolerance of ±0.06V on forward voltage measurements [5] Break voltage of Metal PCB is 6.5kVAC [6] It is included the zener chip to protect the product from ESD. --------------------------Caution-------------------------Please do not drive a rated current more than 5 sec. without proper heat sink SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Rev06 – 2005/09 5 Blue 2. Electro-Optical Characteristics (at IF=350mA, TA=25ºC) Value Parameter Luminous Flux [1] Dominant Wavelength [3] Forward Voltage [4] View Angle Thermal Resistance [5] Symbol Min ФV [2] Unit Typ 11 460 3.5 130 8 Max 475 4.0 lm nm V deg. ºC /W 6 455 3.0 λD VF 2Θ 1/2 RθJ-B 3. Absolute Maximum Ratings (at TA=25ºC) Parameter Forward Current Power Dissipation Junction Temperature Operating Temperature Storage Temperature ESD Sensitivity [6] Symbol IF PD Tj Topr Tstg Value 0.4 1.6 125 -30 ~ +85 -40 ~ +120 ±20,000V HBM Unit A W ºC ºC ºC - *Notes : [1] SSC maintains a tolerance of ±10% on flux and power measurements. [2] ФV is the total luminous flux output as measured with an integrated sphere. [3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram. A tolerance of ±0.5nm for dominant wavelength [4] A tolerance of ±0.06V on forward voltage measurements [5] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC) Break voltage of Metal PCB is 6.5kVAC [6] It is included the zener chip to protect the product from ESD. --------------------------Caution-------------------------1. Please do not drive at rated current more than 5 sec. without proper heat sink 2. Blue power light sources represented here are IEC825 Class 2 for eye safety SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Rev06 – 2005/09 6 Green 2. Electro-Optical Characteristics (at IF=350mA, TA=25ºC) Value Parameter Luminous Flux [1] Dominant Wavelength [3] Forward Voltage [4] View Angle Thermal Resistance [5] Symbol Min ФV [2] Unit Typ 48 527 3.5 130 8 Max 535 4.0 lm nm V deg. ºC /W 24 520 3.0 λD VF 2Θ 1/2 RθJ-B 3. Absolute Maximum Ratings (at TA=25ºC) Parameter Forward Current Power Dissipation Junction Temperature Operating Temperature Storage Temperature ESD Sensitivity [6] Symbol IF PD Tj Topr Tstg Value 0.4 1.6 125 -30 ~ +85 -40 ~ +120 ±20,000V HBM Unit A W ºC ºC ºC - *Notes : [1] SSC maintains a tolerance of ±10% on flux and power measurements. [2] ФV is the total luminous flux output as measured with an integrated sphere. [3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram. A tolerance of ±0.5nm for dominant wavelength [4] A tolerance of ±0.06V on forward voltage measurements [5] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC) Break voltage of Metal PCB is 6.5kVAC [6] It is included the zener chip to protect the product from ESD. --------------------------Caution-------------------------Please do not drive a rated current more than 5 sec. without proper heat sink SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Rev06 – 2005/09 7 Red 2. Electro-Optical Characteristics (at IF=350mA, TA=25ºC) Value Parameter Luminous Flux [1] Dominant Wavelength [3] Forward Voltage [4] View Angle Thermal Resistance [5] Symbol Min ФV [1] Unit Typ 30 625 2.5 128 12 Max 632 3.0 lm nm V deg. º C /W 22 618 2.0 λD VF 2Θ 1/2 RθJ-B 3. Absolute Maximum Ratings (at TA=25ºC) Parameter Forward Current Power Dissipation Junction Temperature Operating Temperature Storage Temperature ESD Sensitivity [6] Symbol IF PD Tj Topr Tstg Value 0.4 1.2 100 -30 ~ +85 -40 ~ +120 ±20,000V HBM Unit A W ºC ºC ºC - *Notes : [1] SSC maintains a tolerance of ±10% on flux and power measurements. [2] ФV is the total luminous flux output as measured with an integrated sphere. [3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram. A tolerance of ±0.5nm for dominant wavelength [4] A tolerance of ±0.06V on forward voltage measurements [5] RθJ-B is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC) Break voltage of Metal PCB is 6.5kVAC [6] It is included the zener chip to protect the product from ESD. --------------------------Caution-------------------------Please do not drive a rated current more than 5 sec. without proper heat sink SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Rev06 – 2005/09 8 4. Forward Voltage vs. Forward Current (Ta=25℃) 3.8 3.6 Forward Voltage(V) 3.4 3.2 3.0 2.8 2.6 2.4 2.2 2.0 1.8 0 100 200 300 400 500 RED GREEN BLUE Forward Current(mA) 5. Forward Current vs. Normalized Relative Luminous Flux (Ta=25℃) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 100 200 300 400 500 600 Relative Luminous Flux(a.u) RED GREEN BLUE Forward Current(mA) SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Rev06 – 2005/09 9 6. Spectrum for white(Ta=25℃) 1.0 0.8 Relative Spectral Power Distribution 0.6 0.4 0.2 0.0 400 500 600 700 Wavelength (nm) 7. Wavelength Curve for Red, Green, Blue (Ta=25℃) 1.0 0.8 Relative Spectral Power Distribution 0.6 0.4 0.2 0.0 400 500 600 700 W avelength (nm) SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Rev06 – 2005/09 10 8. Radiant pattern for White 1.0 0.8 Relative Intensity 0.6 0.4 0.2 0.0 -100 -80 -60 -40 -20 0 20 40 60 80 100 Directional angle (deg.) 9. Radiant pattern for Red 1.0 0.8 Relative Intensity 0.6 0.4 0.2 0.0 -100 -80 -60 -40 -20 0 20 40 60 80 100 Directional angle (deg.) SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Rev06 – 2005/09 11 10. Radiant pattern for Green 1.0 0.8 Relative Intensity 0.6 0.4 0.2 0.0 -100 -80 -60 -40 -20 0 20 40 60 80 100 Directional angle (deg.) 11. Radiant pattern for Blue 1.0 0.8 Relative Intensity 0.6 0.4 0.2 0.0 -100 -80 -60 -40 -20 0 20 40 60 80 100 Directional angle (deg.) SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Rev06 – 2005/09 12 12. Forward Current Vs Wavelength shift (Ta=25℃) 10 8 Dominant wavelength Shift(nm) RED GREEN BLUE 6 4 2 0 -2 -4 0 50 100 F o rw a r d c u rren t ( I F ) 150 200 250 300 350 400 13. Junction Temp Vs Wavelength shift (Ta=25℃) 6 Dominant wavelength shift(nm) 5 RED GREEN BLU E 4 3 2 1 0 0 25 50 75 o 100 125 150 J u n c t io n T e m p e r a t u r e ( C ) SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Rev06 – 2005/09 13 14. Temperature of Junction vs. Relative Light Output for Blue,Green,Red (Ta=25℃) 120 100 Relative Light Output(%) 80 60 RED GREEN BLUE 40 20 0 0 20 40 60 80 o 100 120 Junction Temperature( C) 15. Ambient Temperature vs Allowable Forward Current for 1 chip White,Blue,Green,Cyan 500 400 Current (mA) 300 200 RjaT = 40 C / W RjaT = 30 C / W RjaT = 20 C / W o o o 100 0 0 20 40 60 80 Ambient Temperature T ( C) o 100 120 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Rev06 – 2005/09 14 16. Ambient Temperature vs Allowable Forward Current for 1 chip Red, Amber 500 400 Current (mA) 300 200 RjaT = 40 C / W RjaT = 30 C / W RjaT = 20 C / W o o o 100 0 0 20 Ambient Temperature TA ( C) 40 60 80 o 100 120 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Rev06 – 2005/09 15 17. Reel Packaging 10 pitch cumlative tolerance on tape ±0.2 MIN 1.5 CEN TER R 0 .3 TY PICAL 5° TY PIC A L Note : 1. The number of loaded products in the reel is 250ea 2. All dimensions are in millimeters 3. Scale none 4. This drawing is reference only engineering SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Rev06 – 2005/09 16 18. Packaging structure Aluminum Vinyl Bag PART NO. : ######-## QUANTITY : 250 LOT NO. : ########## BIN CODE NO. : ##### SEOUL SEMICONDUCTOR CO., LTD Outer Box TYPE SIZE(mm) a c b 340 350 200 c Z POWER LED PART NO. : ######-## ORDER CODE : ###### Q'YT : ###### Z POWER LED b a DATE : ###### SEOUL SEMICONDUCTOR CO.,LTD Note : 1. 5 reels are loaded in box 2. Scale none 3. This drawing is reference only engineering 4. For more information about binning and labeling, refer to the Application Note - 1 SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Rev06 – 2005/09 17 19. Recommended solder pad 5 solder point Thermal enhanced PCB Copper Silk plating is recommended at 0.2mm thickness to avoid any possible short both side SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Rev06 – 2005/09 18 20. Soldering Profile (1) Reflow Soldering Conditions / Profile Temp [°C] Tm : Reflow machine setting temp Ts : Surface temp of PCB (max) Ts : Surface temp of PCB (recommend) Ts : Surface temp of PCB (min) 260 240 220 200 180 150 ~ Pre-heating Rising 5 °C/sec Cooling -5 °C/sec 0 Time [Hr] (2) Hand Soldering conditions - Lead : Not more than 3 seconds @MAX280℃ - Slug : Use a thermal-adhesives * Caution 1. Reflow soldering should not be done more than one time. 2. Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, suitable tools have to be used. 3. Die slug is to be soldered. 4. When soldering, do not put stress on the LEDs during heating. 5. After soldering, do not warp the circuit board. 6. Recommend to use a convection type reflow machine with 7 ~ 8 zones. SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Rev06 – 2005/09 19 21. Precaution for use (1) Storage Avoid the absorption of moisture, we recommended to store Z Power LEDs in a dry box (or desiccator) with a desiccant . Otherwise, store them in the following environment: Temperature : 5℃~30℃ Humidity : 50% max. (2) Precaution after opening packaging However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. Soldering should be done right after opening the package (within 24Hrs). b. Keeping of a fraction - Sealing - Temperature : 5 ~ 40℃ Humidity : less than 30% c. If the package has been opened more than 1week or the color of desiccant changes, components should be dried for 10-12hr at 60±5℃. (3) Any mechanical force or any excess vibration shall not be applied to apply during cooling process to normal temp after soldering. (4) Avoid quick cooling (5) Components should not be mounted on warped direction of PCB. (6) Anti radioactive ray design is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or smashed in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the package maximum temperature. (10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The appearance and specifications of the product may be modified for improvement without notice. (12) The package with lens can NOT be solder reflowed. It will damage the lens. (13) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. (14) Slug polarity is anode. SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Rev06 – 2005/09 20 22. Handling of silicone resin LEDs Z-Power LED is encapsulated by silicone resin for the highest flux efficiency. Notes for handling of Silicone resin Z-Power LEDs 1) Avoid touching silicone resin parts especially by sharp tools such as Pincette(Tweezers) 2) Avoid leaving fingerprints on silicone resin parts. 3) Dust sensitivity silicone resin need containers having cover for storage. 4) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevent. 5) Please do not force over 3000 gf impact or pressure diagonally on the silicon lens. It will cause fatal damage of this product 6) Please do not recommend to cover the silicone resin of the LEDs with other resin (epoxy, urethane, etc) SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : 82-2-3281-6269 FAX : 82-2-857-5430 Rev06 – 2005/09 21