FCW100Z

*Customer: SPECIFICATION ITEM MODEL REVISION DATE FLASH LED DEVICE FCW100Z Rev1.2(070727) [Contents] 1. Features 2. Absolute maximum ratings 3. Electro-optical characteristics 4. Soldering profile 5. Outline dimension 6. Reel dimension 7. Packing 8. Precaution for use Drawn by Checked by Approved by SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 FCW100Z Seoul Semiconductor - 1/9 - 1. Features Package : 2.0 × 1.5 × 0.45 mm Color coordinates: according to CIE 1931 Tape and reel packing 2. Absolute Maximum Ratings Parameter Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Symbol Pd IF IFM*1 VR Topr Tstg Value 900 175 600 5 -30 ~ 85 -40 ~ 100 (Ta=25℃) Unit ㎽ ㎃ ㎃ V ℃ ℃ *1 IFM conditions: Pulse width Tw≤ 300ms, Duty ratio≤ 1/10 3. Electro-Optical Characteristics Characteristics Forward Voltage Reverse Current Symbol VF IR Condition IF=175㎃ VR=5V IF=175㎃ Luminous Intensity *2 IV IF=320㎃ (Flash mode) *3 IF=600㎃ (Peak current mode) *4 IF=320㎃ (Flash mode) *3 IF=175㎃ IF=175㎃ IF=175㎃ Min 6 Typ 3.0 8 13 20 26.5 13 0.31 0.32 130 (Ta=25℃) Max 50 lx@0.7m lx@1m Unit V ㎂ cd Illumination lx X Y Chromaticity Coordinates Viewing Angle ˚ Δ 1/2θ *2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *3 Flash mode condition is Pulse width Tw = 2sec, Duty ratio = 2 / 7 *4 Peak current mode is Pulse width Tw≤ 300ms, Duty ratio≤ 1/10 [Note] ( Tolerance : IV±10%, color coordinate ±0.01, VF ±0.1 ) SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 FCW100Z - 2/9 - Forward Current vs. Forward Voltage 1000 Luminous Intensity vs. Forward Current C u rre n t [ m A ] 100 L u m i n o s it y R e l a ti v e 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 [a.u.] 3 2 10 Forw ard 1 1 0 0 100 Forw ard V o lt a g e [ V ] Forw ard 200 300 C u rre nt [ m A ] 400 500 600 Forward Current Derate Curve Forward Current vs Chromaticity Coordinate 200 [a. u .] 0.33 180 160 x y x, y C o ordin ate C h r o m a ti s it y 0 25 50 o Forward current IF(mA) 140 120 100 80 60 40 20 0 -25 75 100 0.32 0.31 0.30 0.29 50 100 Ambient temperature Ta( C) Forw ard 150 C u rre nt [ m A ] 200 250 300 350 SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 FCW100Z - 3/9 - (Ta=25℃) Radiation Diagram 100 90 80 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 120 130 140 150 160 170 180 110 70 60 50 40 30 20 10 0 Y Y Spectrum 1.0 Ta = 25 C o 0.8 Intensity [a.u.] 0.6 0.4 0.2 0.0 40 0 450 500 550 600 650 700 750 W av e len gth [nm ] SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 FCW100Z - 4/9 - 4. Soldering Profile Reflow Soldering Conditions/ Profile (1) Lead Solder -Preliminary heating to be at 150℃max. for 2 minutes max. -Soldering heat to be at 240℃max. for 5 seconds max. LED Surface temperature LED Surface temperature °C Operation heating 240 150 ~ Pre-heating Temperature rise: 5°C/sec. Cooling: -5°C/sec. 120 0 60 to 120 sec. 5sec. max (2) Lead-Free Solder -Preliminary heating to be at 150℃max. for 2 minutes max. -Soldering heat to be at 260℃max. for 10 seconds max. °C Operation heating 260 150 ~ 120 0 P re - h e a t i ng Temperature rise: 5°C/sec. Cooling: -5°C/sec. 60 to 120 sec. 5 to 10 sec. (3) Hand Soldering conditions -Not more than 3 seconds @MAX280℃, under Soldering iron. SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 FCW100Z - 5/9 - 5. Outline Dimension Resin 2.00 1.60 0.18 ±0.03 Tolerance: ±0.05, Unit: ㎜ Anode 2.00 1.20 1 .5 0 0.45 ±0.05 1.50 0.50 PCB Cathode [TOP VIEW] [SIDE VIEW] [BOTTOM VIEW] [Circuit Diagram] * Recommend Solder PAD Pattern - Please refer to the “Thermal Design Guideline for Hi Power Flash LED” for heat dissipation pattern design. SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 FCW100Z - 6/9 - 6. Reel Dimension 1.75±0.1 4.0±0.1 ? 1.5 +0.1 -0 0.65±0.1 (2.75) 3.5±0.05 8.0±0.2 0.2±0.05 180 +0 -3 11.4 9 ±0.3 2 ±0.2 +0.2 -0 22 13 ±0.2 Label 60 (1) Quantity : 2000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm Tolerance: ±0.2, Unit: ㎜ (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at 10℃ angle to be the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 FCW100Z - 7/9 - 7. Packing Reel P/N : # # # # # # # # # # ### 제품명 SSC-FCW100Z DESI PAK L ot N o ######### 수량 : 2000 Aluminum Vinyl Bag P/N : # # # # # # # # # # ### 제품명 SSC-FCW100Z L ot N o ######### 수량 : 2000 Outer Box *Material: Paper(SW3B(B)) a 7inch 245 c CHIP LED PART CODE Q'Y T : : 20,000 E A : S E O UL S E MIC O N D U CT O R C O ., L T D TYPE SIZE(mm) b 220 c 142 : SSC-FC W 100Z CHIP LED b a LOT NO: DATE SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 FCW100Z - 8/9 - 8. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in the dry box (or desicator) with a desiccant . Otherwise, to store them in the following environment is recommended. Temperature : 5℃~30℃ (2) Attention after opened However LED is corresponded SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. After opened and mounted, the soldering shall be quickly. Temperature : 5 ~ 40℃ Humidity : less than 30% b. Keeping of a fraction Humidity : 60%HR max. (3) In case of more than 1 week passed after opening or change color of indicator on desiccant components shall be dried 10-12hr. at 60±5℃. (4) In case of supposed the components is humid, shall be dried dip-solder just before. 100Hr at 80±5℃ or 12Hr at 100±5℃. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. (6) Quick cooling shall not be avoid. (7) Components shall not be mounted on warped direction of PCB. (8) Anti radioactive ray design is not considered for the products listed here in. (9) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA should be used. (10) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (11) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (12) The LEDs must be soldered within seven days after opening the moisture-proof packing. (13) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (14) The appearance and specifications of the product may be modified for improvement without notice. (15) Static Electricity and surge damages the Blue LEDs. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be properly grounded. (16) It is recommended to use individual resistor separately when the LEDs applies in parallel circuit so that it may improve the light deviations. SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 FCW100Z - 9/9 -