FR2001H-T

Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Specification FR2001H-T SSC Drawn Approval CUSTOMER Approval Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 1. 2. 3. 4. 5. 6. 7. Packing Soldering CONTENTS Absolute Maximum Ratings Electro Characteristics Outline Dimension Electro-Optical characteristic Diagram Precaution for use Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet - FR2001H-T Description FR2001H-T Features • 3.5 (W) X 2.8 (D) X 0.6 (T) mm Small size suitable for compact appliances. Surface-mounted chip LED device. Pb-free and RoHS complaint component. Tape and Reel packing. Increases the life time of battery. • Chip LED of Reflector type • Viewing Angle: 140 ˚ • Dominant Wavelength : 625 nm Applications • Electric appliance • Other decoration lighting Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 1. Absolute maximum ratings (Ta=25℃) Parameter Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operation Temperature Storage Temperature Symbol Pd IF IFM *1 VR Topr. Tstg. Value 80 30 50 5 -40 ~ 100 -40 ~ 100 Unit mW mA mA V ℃ ℃ *1 IFM conditions: Pulse width Tw≤0.1ms and Duty ratio≤1/10. 2. Electro-Optical Characteristics (Ta=25℃) Parameter Forward Voltage Reverse Current Luminous Intensity*2 Luminous Flux Wavelength Spectral Bandwidth Viewing Angle*3 Symbol VF IR IV Φ λd Δλ 2θ1/2 Condition IF=20 ㎃ VR=5V IF=20 ㎃ IF=20 ㎃ IF=20 ㎃ IF=20 ㎃ IF=20 ㎃ Min - Typ 2.0 460 1.45 625 15 140 Max 2.6 10 - Unit V ㎂ mcd lm nm nm ˚ *2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *3 θ1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity. [Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC. (Tolerance : Iv ±10 %, λD ±2 nm, VF ±0.1 V) Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 3.Outline Dimension ( Tolerance: ±0.1, Unit: mm ) [TOP VIEW] [SIDE VIEW] [BOTTOM VIEW] [INNER CIRCUIT] - Recommended Soldering Design * MATERIALS PARTS Package Encapsulating Resin Electrodes MATERIALS Lead Frame Epoxy Resin Au Plating Copper Alloy Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Forward Current IF(mA) Luminous Intensity IV(%) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 4. Electro-Optical characteristic Diagram Forward Current vs. Forward Voltage (per die) 100 (Ta=25 OC ) 10 1 1.7 1.8 1.9 2.0 2.1 2.2 Forward Voltage VF(V) Relative Luminous Intensity vs Forward Current 200 (Ta=25 OC ) 160 120 80 40 0 0 5 10 15 20 25 30 35 Rev. 00 September 2008 www.ZLED.com Forward Current IF(mA) Document No. : SSC-QP-7-07-24 (Rev.00) Forward current IF(mA) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Ambient Temperature vs. Allowable Forward Current (per die) 40 30 20 10 0 -6 0 - 40 -2 0 0 20 40 60 80 100 120 A m b ie n t t e m p e r a t u r e T a ( ℃ ) Radiation Diagram (Ta=25 OC ) 90 1.0 0.8 0.6 0.4 0.2 0.0 180 150 120 60 30 0 Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) (2.75) 22 13 ±0.2 Label Tolerance: ±0.2, Unit: ㎜ (1) Quantity:2,000pcs./Reel (2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is turned off from the carrier tape at10˚angle to be the carrier tape. (4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package. Rev. 00 60 +0.2 -0 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 5. Packing 4.0±0.1 1.75±0.1 1.5 +0.1 -0 0.25±0.05 3.5±0.05 8.0±0.1 Marking Direction 0.85±0.1 180 +0 -3 11.4 9 ±0.3 2 ±0.2 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet ● Reel Packing Structure Reel P/N : # # # # # # # # # # ## 제품명 SSC-FR2001H-T L ot N o ######### 수량 : 2000 Aluminum Vinyl Bag P/N : # # # # # # # # # # ## 제품명 SSC-FR2001H-T Lot N o ######### 수량 : 2000 Outer Box *Material: Paper(SW3B(B)) SIZE(mm) a c b 7inch 245 220 142 TYPE c TUV MADE IN KOREA CHIP LED PART : SSC-FR2001H-T CODE : Q'YT : 20,000EA LOT NO : DATE : SEOUL SEMICONDUCTOR CO.,LTD Acriche RoHS Semiconductor EcoLight b a Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 6. Soldering (1) Lead Solder Lead Solder Lead Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 120~150℃ 120 sec. Max. 240℃ Max. 2.5~5 C / sec. 2.5~5 o C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. 10 sec. Max. (2) Lead-Free Solder L ea d -fra m e Solder Lead Free Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 150~200℃ 120 sec. Max. 260℃ Max. 1~5 o C / sec. 1~5 o C / sec. Pre-heating 150~200 o C 26 0 oC M ax. 10 sec. M ax. 60sec. M a x. A b o ve 220 oC 120sec. M ax. 10 sec. Max. (3) Hand Soldering conditions Do not exceed 3 seconds at maximum 280ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 7. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 65%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 30% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The LEDs must be soldered within seven days after opening the moisture-proof packing. (12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (13) The appearance and specifications of the product may be modified for improvement without notice. Rev. 00 September 2008 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)