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LB370_1

LB370_1

  • 厂商:

    SEOUL(首尔半导体)

  • 封装:

  • 描述:

    LB370_1 - BLUE LAMP LED - Seoul Semiconductor

  • 数据手册
  • 价格&库存
LB370_1 数据手册
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Rev. 0.2 Specification LB370 SSC Drawn Approval Customer Approval Rev. 00 November 2007 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Contents 1. Features 2. Absolute Maximum Ratings 3. Electric-Optical Characteristics 4. Reliability Tests 5. Characteristic Diagrams 6. Color & Binning 7. Outline Dimensions 8. Packing 9. Soldering 10. Precaution for use Rev. 00 November 2007 www.ZLED.com Rev. 0.2 Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet LB370 Description 사진 Lamp LEDs are effective in hot thermal and humid condition. This high brightness and weather-resistant packaging design m a k e s t h e s e L a mp LEDs i deal for LB370 Features • High luminous emission • 3mm type package • Transparent epoxy lens • Viewing angle : 70º • Dominant Wavelength : 470nm O u tdoor a pplicat ions s uch as t r aff i c signals, v a riable message signs an d backlighting for transparent sign panels. Applications • Electronic signs and signals • Specialty lighting • Small area illumination • Torches and head lamps • Backlighting • Outdoor displays Rev. 00 November 2007 www.ZLED.com Rev. 0.2 Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 2. Absolute Maximum Ratings ( Ta = 25ºC ) Item DC Forward Current Forward Peak Pulse Current Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Solder Temperature Symbol IF IFP [1] VR PD Topr Tstg Ts Value 30 100 5 123 -35 ~ 85 -40 ~ 100 260ºC for 10seconds [2] Unit mA mA V mW ºC ºC ºC Notes : [1] t ≤ 0.1ms, D = 1/10 [2] No lower than 3mm from the base of the epoxy bulb. 3. Electro-Optical Characteristics ( Ta = 25ºC, IF=20mA ) Item Luminous Intensity [3] Dominant Wavelength[5] Forward Voltage [6] View Angle Reverse Current (at VR = 5V) Symbol IV [4] Value Min. 100 464 Typ. 400 470 3.6 70 5 Max. 476 4.1 Unit mcd nm V deg. λd VF 2θ ½ IR µA Notes : [3] SSC maintains a tolerance of ±10% on intensity and power measurements. [4] IV is the luminous intensity output as measured with a cylinder. [5] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram. A tolerance of ±0.5nm for dominant wavelength. [6] A tolerance of ±0.05V on forward voltage measurements Rev. 00 November 2007 www.ZLED.com Rev. 0.2 Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 4. Reliability Tests Item Life Test High Temperature Operating Low Temperature Operating Thermal Shock Resistance to soldering Heat ESD (Human Body Model) High Temperature Storage Low Temperature Storage Temperature Humidity Storage Temperature Humidity Operating Condition Ta = RT, IF = 30mA Ta = 85ºC, IF = 8mA Ta = -30ºC, IF = 20mA Ta = -40ºC (30min) ~ 100º (30min) (Transfer time : 10sec, 1Cycle = 1hr) Ts = 255 ± 5ºC, t = 10sec 1kV, 1.5kΩ ; 100pF Ta = 100ºC Ta = -40ºC Ta = 85ºC, RH = 85% Ta = 85ºC, RH = 85%, IF = 8mA Note 1000hrs 1000hrs 1000hrs 100 cycles 1 time 1 time 1000hrs 1000hrs 1000hrs 100hrs Failures 0/22 0/22 0/22 0/40 0/22 0/22 0/22 0/22 0/22 0/22 < Judging Criteria For Reliability Tests > VF IR ФV Notes : [1] USL : Upper Standard Level [2] LSL : Lower Standard Level. USL[1] X 1.2 USL X 2.0 LSL [2] X 0.5 Rev. 00 November 2007 www.ZLED.com Rev. 0.2 Document No. : SSC-QP-7-07-24 (Rev.00) Relative Luminous Intensity Forward Current(mA) Relative Luminous Intensity Forward Current IF [mA] Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 5. Characteristic Diagrams Ta= 25ºC Ta= 25ºC 50 2.5 40 2.0 30 1.5 20 1.0 10 0.5 0 2.0 0.0 2.5 3.0 3.5 4.0 4.5 5.0 0 10 20 30 40 50 Forward Voltage [V] Forward Current [mA] Forward Voltage vs. Forward Current Forward Current vs. Relative Intensity Ta= 25ºC, IF= 20mA 40 1.0 0.8 30 0.6 20 0.4 10 0.2 0 -40 -20 0 20 40 60 o 80 100 0.0 -90 -60 -30 0 30 60 90 Ambient Temperature Ta[ C] Off Axis Angle [deg.] Ambient Temperature vs. Maximum Forward Current Directivity Rev. 00 November 2007 www.ZLED.com Rev. 0.2 Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 6. Color & Binning Bin Code Luminous Intensity D Dominant Wavelength 1 Forward Voltage 6 Luminous Intensity (mcd) @ IF = 20mA Bin Code A B C D Min. 100 250 400 700 Max. 250 400 700 1000 Dominant Wavelength (nm) @ IF = 20mA Bin Code 1 2 Min. 464 470 Max. 470 476 Forward Voltage (V) @ IF = 20mA Bin Code 3 4 5 6 7 8 Min. 2.8 3.0 3.2 3.4 3.6 3.8 Max. 3.0 3.2 3.4 3.6 3.8 4.0 Available ranks Rev. 00 November 2007 www.ZLED.com Rev. 0.2 Document No. : SSC-QP-7-07-24 (Rev.00) 0.5 +0.2 -0.1 2.5 ± 0.05 1.0 MIN 28.0 MIN 2.35 ± 0.1 5.3 ± 0.1 3.1 ± 0.2 Notes : Protruded epoxy is 1.0mm maximum. 4.2 ± 0.2 Rev. 00 November 2007 www.ZLED.com Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 7. Outline Dimensions Unit : mm 1.0 DETAIL ANODE 0.5 ± 0.05 3.8 ± 0.2 0.5 MAX Rev. 0.2 Document No. : SSC-QP-7-07-24 (Rev.00) 50 325 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 8. Packing Unit : mm * Antistatic poly bag (500pcs max/bag) 95 170 * Inner box (1bag max/box) 0 27 * Cardboard box (35000pcs max/box) (70boxes max/box) 480 Rev. 00 November 2007 www.ZLED.com Rev. 0.2 Document No. : SSC-QP-7-07-24 (Rev.00) Temperature [ C] O Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 9. Soldering Profile 1) Wave Soldering Conditions / Profile • Preliminary heating to be at 85ºC(120 ºC max) for 20 seconds(60 seconds max). • Soldering heat to be at 255 ºC (260ºC max) for 10 seconds • Soak time above 200 ºC is 5 seconds 300 250 PEAK 10s 255 ºC (260 ºC max) 200 150 PREHEAT 20s (60s Max) 85 ºC(120 ºC max) 100 50 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 T im e [s ] 2) Hand Soldering conditions • Not more than 3 seconds at max. 350ºC, under Soldering iron. 3) Caution • Lead frames are silver plated copper alloy. This substance has a low thermal coefficient (easily conducts heat) • The LEDs must not be repositioned after soldering. • Do not apply any stress to the lead particularly when heat. Note : In case the soldered products are reused in soldering process, we don’t guarantee the products. Rev. 00 November 2007 www.ZLED.com Rev. 0.2 Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 10. Precaution for Use 1) Storage • Before opening the package Avoid the absorption of moisture, we recommended to store Lamp LEDs in a dry box(or desiccators) with a desiccant . Otherwise, store them in the following environment: Temperature : 5℃~30℃ Humidity : 50% max. • After opening the package a. Soldering should be done right after opening the package(within 24Hrs). b. Keeping of a fraction - Sealing - Temperature : 5 ~ 40℃, Humidity : less than 30% c. If the package has been opened more than 1week or the color of desiccant changes, Components should be dried for 10-12hr at 60±5℃ • Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. • Avoid quick cooling • Leadframes are silver plated SPCC. The silver plate surface may be affected by environments which contains corrosive substances. Please avoid conditions which may cause the LEDs to corrode, tarnish or discolor. 2) Lead Forming • When the lead forming is required before soldering , care must be taken to avoid any bending and mechanical stress. The stress to the base may damage the LEDs. • When mounting the LEDs onto a PCB, the holes on the circuit board should be exactly aligned with the leads of the LEDs. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely on hand operating. Rev. 00 November 2007 www.ZLED.com Rev. 0.2 Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 3) Static Electricity • Static Electricity and surge voltage damage the LEDs. So it is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. • All devices, equipment and machinery must be properly grounded. It is recommended precautions be taken against surge voltage to the equipment that mounts the LEDs. 4) Heat Generation • Thermal is one of the important parameter to design the end product. Please consider the heat generation of the LEDs. • The operating current should be decided after considering the ambient maximum temperature of LEDs. 5) Others • The color of the LEDs is changed a little by an operating current and thermal. • Anti radioactive ray design is not considered for the products listed here in. • Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or smashed in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed. • This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA(Isopropyl Alcohol) should be used. • When the LEDs are illuminating, operating current should be decided after considering the junction temperature. Cf.) Please refer Ambient temperature vs. Forward Current graph on page 5 • The appearance and specifications of the product may be modified for improvement without notice. SEOUL SEMICONDUCTOR CO., LTD. 148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL : +82-2-3281-6269 FAX :+82-2-857-5430 www.seoulsemicon.com www.zled.com Rev. 00 November 2007 www.ZLED.com Rev. 0.2 Document No. : SSC-QP-7-07-24 (Rev.00)
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