S1W0-2835508003-0000003S-0P002 数据手册
Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Mid-Power LED - 3528 Series
S1W0-2835xx8003-00000000-0P007
(Cool, Neutral, Warm)
RoHS
Product Brief
Description
Features and Benefits
•
This White Colored surface-mount LED
comes in standard package dimension.
Package Size: 3.5x2.8x0.7mm
•
•
•
•
It has a substrate made up of a molded
plastic reflector sitting on top of a lead
frame.
•
The die is attached within the reflector
cavity and the cavity is encapsulated by
silicone.
•
Market Standard 3528 Package Size
High Color Quality, CRI Min. 80
RoHS compliant
Key Applications
•
•
•
•
The package design coupled with
careful selection of component
materials allow these products to
perform with high reliability.
Interior lighting
General lighting
Indoor and outdoor displays
Architectural / Decorative lighting
Table 1. Product Selection Table
Reference Code
Color
Cool
White
STW8A2PD-E2
Neutral
White
Warm
White
Rev 1.2, Aug 24, 2020
CRI
Nominal
CCT
Part Number
6500K
S1W0-2835658003-00000000-0P007
5700K
S1W0-2835578003-00000000-0P007
5000K
S1W0-2835508003-00000000-0P007
4000K
S1W0-2835408003-00000000-0P007
3500K
S1W0-2835358003-00000000-0P007
3000K
S1W0-2835308003-00000000-0P007
2700K
S1W0-2835278003-00000000-0P007
Min
1
80
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Table of Contents
Index
•
Product Brief
1
•
Table of Contents
2
•
Performance Characteristics
3
•
Characteristics Graph
5
•
Color Bin Structure
11
•
Mechanical Dimensions
15
•
Recommended Solder Pad
16
•
Reflow Soldering Characteristics
17
•
Emitter Tape & Reel Packaging
18
•
Product Nomenclature
20
•
Handling of Silicone Resin for LEDs
21
•
Precaution For Use
22
•
Company Information
25
Rev 1.2, Aug 24, 2020
2
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Performance Characteristics
Table 2. Product Selection Guide, IF = 65mA, Tj = 25ºC, RH30%
Min.
Nominal Min. Flux
CRI, Ra
CCT [K] [
80
1]
[lm]
Typ. Luminous
Typ. Luminous
Flux ФV [2] [lm]
Efficacy [lm/W]
@65mA
@65mA
Part Number
6500
34.2
36.0
205
S1W0-2835658003-00000000-0P007
5700
34.2
36.6
208
S1W0-2835578003-00000000-0P007
5000
35.2
37.3
213
S1W0-2835508003-00000000-0P007
4000
35.2
37.3
213
S1W0-2835408003-00000000-0P007
3500
34.2
36.2
206
S1W0-2835358003-00000000-0P007
3000
33.9
35.1
200
S1W0-2835308003-00000000-0P007
2700
32.5
34.0
194
S1W0-2835278003-00000000-0P007
Notes :
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
(2) Seoul Semiconductor maintains a tolerance of 5% on Flux and power measurements.
The luminous Flux was measured at the peak of the spatial pattern which may not be
aligned with the mechanical axis of the LED package.
Rev 1.2, Aug 24, 2020
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Performance Characteristics
Table 3. Characteristics, IF=65mA, Tj= 25ºC, RH30%
Value
Parameter
Symbol
Unit
Min.
Typ.
Max.
Forward Current
IF
-
65
-
mA
Forward Voltage
VF
2.67
2.70
2.76
V
CRI [3]
Ra
80
83
90
Viewing Angle
2Θ1/2
-
120
-
Deg.
Tstg
- 40
-
+ 85
ºC
RθJ-S
-
13
-
℃/W
Storage Temperature
Thermal resistance (J to S)
[4]
ESD Sensitivity(HBM)
-
Class 2 JESD22-A114-E
Symbol
Value
Unit
IF
300
mA
IFP
360
mA
Power Dissipation
PD
1.0
W
Junction Temperature
Tj
125
ºC
Operating Temperature
Topr
-40 ~ + 85
ºC
Storage Temperature
Tstg
-40 ~ + 100
ºC
Table 4. Absolute Maximum Ratings
Parameter
Forward Current
Pulse current
[5]
Notes :
(1) Seoul Semiconductor maintains a tolerance of 5% on Flux and power measurements.
(2) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
Color coordinate : 0.005, CCT 5% tolerance.
(3) Tolerance is 2.0 on CRI , 0.1 on VF measurements.
(4) Thermal resistance is junction to Solder.
(5) IFP conditions with pulse width ≤10ms and duty cycle ≤10%
(6) The products are sensitive to static electricity and must be carefully taken when handling products
(7) It is recommended to use it in the condition that the reliability is secured within the Max value.
•
Calculated performance values are for reference only.
•
All measurements were made under the standardized environment of Seoul Semiconductor.
Rev 1.2, Aug 24, 2020
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Characteristics Graph
Relative Emission Flux (a.u)
Fig 1. Color Spectrum, Tj = 25ºC, IF=65mA
2100~3700K
3700~4700K
4700~7000K
1.0
0.5
0.0
300
400
500
600
700
800
Wavelength [nm]
Fig 2. Radiant Pattern, Tj = 25ºC, IF=65mA
Relative Flux (%)
100
80
60
40
20
0
-100
Rev 1.2, Aug 24, 2020
-75
-50
-25
0
25
Angle [Degree]
5
50
75
100
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Characteristics Graph
Fig 3. Forward Voltage vs. Forward Current, Tj = 25ºC
0.30
0.25
IF[A]
0.20
0.15
0.10
0.05
0.00
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
VF[V]
Fig 4. Forward Current vs. Relative Luminous Flux, Tj = 25ºC
5
Relative Luminous Flux
4
3
2
1
0
0
50
100
150
200
250
300
Forward Current IF [mA]
Rev 1.2, Aug 24, 2020
6
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Characteristics Graph
Fig 5. Forward Current vs. CIE X,Y Shift, Tj = 25ºC
(2600~4200K)
0.4208
0.4200
y
300mA
180mA
0.4192
65mA
30mA
0.4184
0.4176
0.4592
0.4600
0.4608
0.4616
0.4624
x
(4200~7000K)
0.3485
0.3480
30mA
y
65mA
0.3475
180mA
0.3470
300mA
0.3465
0.3312
0.3316
0.3320
0.3324
0.3328
x
Rev 1.2, Aug 24, 2020
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Characteristics Graph
Fig 6. Junction Temperature vs. Relative Luminous Flux, IF=65mA
1.0
Relative Luminous Flux
0.8
0.6
0.4
0.2
0.0
25
45
65
85
105
125
O
Junction temperature Tj( C)
Fig 7. Junction Temperature vs. Relative Forward Voltage, IF=65mA
1.0
Relative Forward Voltage
0.8
0.6
0.4
0.2
0.0
25
45
65
85
105
125
O
Junction temperature Tj( C)
Rev 1.2, Aug 24, 2020
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Characteristics Graph
Fig 8. Chromaticity Coordinate vs. Junction Temperature, IF=65mA
(2700~3500K)
0.430
0.425
25
0.420
y
50
75
100
0.415
125
0.410
0.405
0.456
0.459
0.462
0.465
0.468
x
(4200~7000K)
0.370
25
0.365
50
y
0.360
75
0.355
100
0.350
0.345
0.330
125
0.335
0.340
0.345
0.350
x
Rev 1.2, Aug 24, 2020
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Characteristics Graph
Fig 9. Ambient Temperature vs. Maximum Forward Current, Tj_max = 125℃
300
Forward Current IF [mA]
250
200
150
100
50
0
-40
-20
0
20
40
60
80
100
O
Ambient Temperature TA [ C]
Rev 1.2, Aug 24, 2020
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Color Bin Structure
Table 5. Bin Code description, Tj=25℃, IF=65mA
Luminous Flux (lm)
Part Number
S1W02835xx8003000000000P007
Bin
Code
Min.
Max.
U0
33.0
33.9
U3
33.9
35.1
U7
35.1
36.3
V1
36.3
37.2
V4
37.2
38.1
Color
Chromaticity
Coordinate
Refer to
Page. 12
Typical Forward Voltage (V)
Bin
Code
Min.
Max.
Y1K
2.67
2.70
Y1L
2.70
2.73
Y1H
2.73
2.76
Available ranks
Table 6. Flux rank distribution
CCT
CIE
Flux Rank
6,000 ~ 7,000K
A
U0
U3
U7
V1
V4
5,300 – 6,000K
B
U0
U3
U7
V1
V4
4,700 ~ 5,300K
C
U0
U3
U7
V1
V4
3,700 ~ 4,200K
E
U0
U3
U7
V1
V4
3,200 ~ 3,700K
F
U0
U3
U7
V1
V4
2,900 ~ 3,200K
G
U0
U3
U7
V1
V4
2,600 ~ 2,900K
H
U0
U3
U7
V1
V4
*Notes :
•
All measurements were made under the standardized environment of Seoul Semiconductor.
In order to ensure availability, single color rank will not be orderable.
Rev 1.2, Aug 24, 2020
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Color Bin Structure
CIE Chromaticity Diagram Tj=25℃, IF=65mA
0.38
5000K
CB
4C
0.36
CA
5700K
3C
BB
4B
BA
6500K
0.34
AB
CD
3B
3A
0.32
AC
C
BC
4A
AA
CC
B
BD
A
AD
0.30
0.30
0.32
0.34
0.36
6500K 3Step
3A
Center point 0.3123 : 0.3282
Major Axis a
0.00669
Minor Axis b
0.00285
Ellipse
58.57
Rotation Angle
5700K 3Step
3B
Center point 0.3287 : 0.3417
Major Axis a
0.00746
Minor Axis b
0.00320
Ellipse
59.09
Rotation Angle
5000K 3Step
3C
Center point 0.3447 : 0.3553
Major Axis a
0.00822
Minor Axis b
0.00354
Ellipse
59.62
Rotation Angle
6500K 4Step
4A
Center point 0.3123 : 0.3282
Major Axis a
0.00892
Minor Axis b
0.00380
Ellipse
58.57
Rotation Angle
5700K 4Step
4B
Center point 0.3287 : 0.3417
Major Axis a
0.00995
Minor Axis b
0.00427
Ellipse
59.09
Rotation Angle
5000K 4Step
4C
Center point 0.3447 : 0.3553
Major Axis a
0.01096
Minor Axis b
0.00472
Ellipse
59.62
Rotation Angle
AA
CIE X
0.3028
0.3048
0.3131
0.3115
AB
CIE Y
0.3304
0.3209
0.329
0.3393
CIE X
0.3115
0.3131
0.3213
0.3205
CIE Y
0.3462
0.3353
0.3423
0.3539
CIE X
0.3292
0.3293
0.3371
0.3376
CIE Y
0.3616
0.3493
0.3558
0.3687
CIE X
0.3463
0.3452
0.3533
0.3551
BA
CIE X
0.3207
0.3215
0.3293
0.3292
CIE X
0.3131
0.3146
0.3221
0.3213
CIE Y
0.3539
0.3423
0.3493
0.3616
CIE X
0.3293
0.3294
0.3366
0.3371
CIE Y
0.3687
0.3558
0.3624
0.376
CIE X
0.3452
0.344
0.3514
0.3533
BB
CA
CIE X
0.3376
0.3371
0.3452
0.3463
AC
CIE Y
0.3393
0.329
0.3371
0.3481
CIE X
0.3048
0.3068
0.3146
0.3131
CIE Y
0.3423
0.3306
0.3369
0.3493
CIE X
0.3215
0.3222
0.3294
0.3293
CIE Y
0.3558
0.3428
0.3487
0.3624
CIE X
0.3371
0.3366
0.344
0.3452
BC
CB
Rev 1.2, Aug 24, 2020
AD
CIE Y
0.329
0.3187
0.3261
0.3371
BD
CC
12
CIE Y
0.3209
0.3113
0.3187
0.329
CIE Y
0.3353
0.3243
0.3306
0.3423
CD
CIE Y
0.3493
0.3369
0.3428
0.3558
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Color Bin Structure
CIE Chromaticity Diagram Tj=25℃, IF=65mA
4000K
CIE Y
0.40
EB
4E
EA
3E
0.38
EC
ED
0.36
0.37
0.38
0.39
0.40
CIE X
4000K 3Step
3E
Center point 0.3818 : 0.3797
Major Axis a
0.00939
Minor Axis b
0.00402
Ellipse
53.72
Rotation Angle
4000K 4Step
4E
Center point 0.3818 : 0.3797
Major Axis a
0.01252
Minor Axis b
0.00536
Ellipse
53.72
Rotation Angle
EA
EB
EC
ED
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3736
0.3874
0.3871
0.3959
0.3828
0.3803
0.3703
0.3726
0.3703
0.3726
0.3828
0.3803
0.3784
0.3647
0.367
0.3578
0.3828
0.3803
0.3952
0.388
0.3898
0.3716
0.3784
0.3647
0.3871
0.3959
0.4006
0.4044
0.3952
0.388
0.3828
0.3803
Rev 1.2, Aug 24, 2020
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Color Bin Structure
CIE Chromaticity Diagram Tj=25℃, IF=65mA
0.44
2700K
3000K
HB
HA
0.42
GB
3500K
GA
4G
3H
FB
3G
4F
0.40
FA
HD
3F
4H
HC
GC
GD
FC
0.38
FD
0.36
0.40
0.42
0.44
0.46
0.48
3500K 3Step
3 Step
Center point 0.4073 : 0.3917
Major Axis a
0.00927
Minor Axis b
0.00414
Ellipse
54.00
Rotation Angle
3000K 3Step
3 Step
Center point 0.4338 : 0.4030
Major Axis a
0.00834
Minor Axis b
0.00408
Ellipse
53.22
Rotation Angle
2700K 3Step
3 Step
Center point 0.4578 : 0.4101
Major Axis a
0.00810
Minor Axis b
0.00420
Ellipse
53.70
Rotation Angle
3500K 4Step
4 Step
Center point 0.4073 : 0.3917
Major Axis a
0.01236
Minor Axis b
0.00552
Ellipse
54.00
Rotation Angle
3000K 4Step
4 Step
Center point 0.4338 : 0.4030
Major Axis a
0.01112
Minor Axis b
0.00544
Ellipse
53.22
Rotation Angle
2700K 4Step
4 Step
Center point 0.4578 : 0.4101
Major Axis a
0.01080
Minor Axis b
0.00560
Ellipse
53.70
Rotation Angle
FA
CIE X
0.3996
0.3943
0.4082
0.4146
FB
CIE Y
0.4015
0.3853
0.392
0.4089
CIE X
0.4146
0.4082
0.4223
0.4299
CIE Y
0.4165
0.399
0.4033
0.4212
CIE X
0.443
0.4345
0.4468
0.4562
CIE Y
0.426
0.4077
0.4104
0.4289
CIE X
0.4687
0.4585
0.4703
0.481
GA
CIE X
0.4299
0.4223
0.4345
0.443
CIE X
0.4082
0.4017
0.4147
0.4223
CIE Y
0.4212
0.4033
0.4077
0.426
CIE X
0.4345
0.4259
0.4373
0.4468
CIE Y
0.4289
0.4104
0.4132
0.4319
CIE X
0.4585
0.4483
0.4593
0.4703
GB
HA
CIE X
0.4562
0.4468
0.4585
0.4687
FC
CIE Y
0.4089
0.392
0.399
0.4165
CIE X
0.3943
0.3889
0.4017
0.4082
CIE Y
0.4033
0.3853
0.3893
0.4077
CIE X
0.4223
0.4147
0.4259
0.4345
CIE Y
0.4104
0.3919
0.3944
0.4132
CIE X
0.4468
0.4373
0.4483
0.4585
GC
HB
Rev 1.2, Aug 24, 2020
FD
CIE Y
0.392
0.3751
0.3814
0.399
GD
HC
14
CIE Y
0.3853
0.369
0.3751
0.392
CIE Y
0.399
0.3814
0.3853
0.4033
HD
CIE Y
0.4077
0.3893
0.3919
0.4104
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Mechanical Dimensions
Bottom View
Top View
Cathode
Cathode Mark
Side View
Notes :
(1) All dimensions are in millimeters.
(2) Scale : none
(3) Undefined tolerance is ± 0.2mm
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Recommended Solder Pad
Notes :
(1) All dimensions are in millimeters.
(2) Scale : none
(3) This drawing without tolerances are for reference only
(4) Undefined tolerance is ± 0.1mm
(5) The appearance and specifications of the product may be changed for improvement without notice.
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Reflow Soldering Characteristics
IPC/JEDEC J-STD-020
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate (Ts_max to Tp)
3° C/second max.
3° C/second max.
Preheat
- Temperature Min (Ts_min)
- Temperature Max (Ts_max)
- Time (Ts_min to Ts_max) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak Temperature (Tp)
215℃
260℃
Time within 5°C of actual Peak
Temperature (tp)2
10-30 seconds
20-40 seconds
Ramp-down Rate
6 °C/second max.
6 °C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
Caution :
(1) Reflow soldering is recommended not to be done more than two times
In the case of more than 24 hours passed soldering after first, LEDs will be damaged.
(2) Repairs should not be done after the LEDs have been soldered
When repair is unavoidable, suitable tools must be used.
(3) Die slug is to be soldered.
(4) When soldering, do not put stress on the LEDs during heating.
(5) After soldering, do not warp the circuit board.
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Emitter Tape & Reel Packaging
Package
Cathode marker
User feed direction
Notes :
(1) Quantity : Max 16,000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ± 0.2mm
(3) Adhesion Strength of Cover Tape
Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape
at the angle of 10˚ to the carrier tape.
(4) Package : P/N, Manufacturing data Code No. and Quantity to be indicated on a damp proof Package.
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Emitter Tape & Reel Packaging
Reel
Aluminum Bag
Outer Box
Rev 1.2, Aug 24, 2020
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Product Nomenclature
Table 7. Part Numbering System
Part Number Code
Description
Part Number
Value
X1
Company
S
Seoul Semiconductor
X2
Level of Integration
1
Discrete LED
X3X4
Technology
W0
General White
X5X6X7X8
Dimension
2835
X9X10
CCT
xx
X11X12
CRI
80
X13X14
Vf
03
X15X16X17
Characteristic code
Flux Rank
000
X18X19X20
Characteristic code
Vf Rank
000
X21X22
Characteristic code
Color Step
00
X23X24
Type
0P
X25X26X27
Internal code
007
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Handling of Silicone Resin for LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions regarding the form
of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be
prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These
conditions must be considered during the handling of such devices. Compared to standard
encapsulants, silicone is generally softer, and the surface is more likely to attract dust.
As mentioned previously, the increased sensitivity to dust requires special care during processing.
In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning
solution must be applied to the surface after the soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be
assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
(6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this.
product with acid or sulfur material in sealed space.
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Precaution for Use
(1) Storage
To avoid the moisture penetration, we recommend store in a dry box with a desiccant.
The maximum storage temperature range is 40℃ and a maximum humidity of
RH90%.
(2) Use Precaution after Opening the Packaging
Use SMT techniques properly when the LED is to be soldered dipped as separation of the lens m
ay affect the light output efficiency.
Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing
- Temperature : 30℃ Humidity : less than RH60%
b. If the package has been opened more than 4 week(MSL_2a) or the color of the desiccant
changes, components should be dried for 10-24hr at 65± 5℃
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
(4) Do not rapidly cool device after soldering.
(5) Components should not be mounted on warped (non coplanar) portion of PCB.
(6) Radioactive exposure is not considered for the products listed here in.
(7) Gallium arsenide is used in some of the products listed in this publication.
These products are dangerous if they are burned or shredded in the process of disposal.
It is also dangerous to drink the liquid or inhale the gas generated by such products when
chemically disposed of.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
(9) When the LEDs are in operation the maximum current should be decided after measuring
the package temperature.
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Precaution for Use
(10) The appearance and specifications of the product may be modified for improvement without
notice.
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures
can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic
energy. The result can be a significant loss of light output from the fixture. Knowledge of the
properties of the materials selected to be used in the construction of fixtures can help prevent
these issues.
(13) Attaching LEDs, do not use adhesives that outgas organic vapor.
(14) The driving circuit must be designed to allow forward voltage only when it is ON or OFF.
If the reverse voltage is applied to LED, migration can be generated resulting in LED damage.
(15) Similar to most Solid state devices;
LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS).
Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects.
a. ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact. While most ESD events are considered harmless, it can be an expensive problem in
many industrial environments during production and storage. The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as:
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event.
One or more recommended work area suggestions:
- Ionizing fan setup
- ESD table/shelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options:
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls:
- Humidity control (ESD gets worse in a dry environment)
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Precaution for Use
b. EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device.
The effects from an EOS event can be noticed through product performance like:
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation.)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary, but there are some
common signs that will indicate an EOS event has occurred:
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires.
- This damage usually appears due to the thermal stress produced during the EOS event.
c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing:
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
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Product Data Sheet
S1W0-2835xx8003-00000000-0P007 – Mid-Power LED
Company Information
Published by
Seoul Semiconductor © 2013 All Rights Reserved.
Company Information
Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage
and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than
10,000 patents globally, while offering a wide range of LED technology and production capacity in
areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs.
The company’s broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type
LEDs as well as custom modules, displays, and sensors.
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products. With
respect to any examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual
property rights of any third party. The appearance and specifications of the product can be changed
to improve the quality and/or performance without notice.
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