S1W0-3030408003-0000003S-0P004

Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Achieving the best system cost in Mid/High Power Mid-Power LED – 3030 Series S1W0-3030xx8003-00000000-0P004 (Cool, Neutral, Warm) RoHS Product Brief Description Features and Benefits • This White Colored surface-mount LED comes in standard package dimension. Package Size : 3.0x3.0x0.6mm • It has a substrate made up of a molded plastic reflector sitting on top of a lead frame. • • • • • • • The die is attached within the reflector cavity and the cavity is encapsulated by silicone. • Thermally Enhanced Package Design Mid Power to High Power up to 1.4W Max. Driving Current 400mA Compact Package Size High Color Quality with CRI Min.80(R9>0) Pb-free Reflow Soldering Application Key Applications • • • • The package design coupled with careful selection of component materials allow these products to perform with high reliability. Replacement lamps – Bulb, Tube Commercial Industrial Residential Table 1. Product Selection Table Reference Code Color Cool White STW8C2PB-E1 Neutral White Warm White CRI Nominal CCT Part Number 6500K S1W0-3030658003-00000000-0P004 5700K S1W0-3030578003-00000000-0P004 5000K S1W0-3030508003-00000000-0P004 4000K S1W0-3030408003-00000000-0P004 3500K S1W0-3030358003-00000000-0P004 3000K S1W0-3030308003-00000000-0P004 2700K S1W0-3030278003-00000000-0P004 Min 80 1 Rev0.1, July 13, 2018 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Table of Contents Index • Product Brief 1 • Table of Contents 2 • Performance Characteristics 3 • Characteristics Graph 5 • Color Bin Structure 11 • Mechanical Dimensions 15 • Recommended Solder Pad 16 • Reflow Soldering Characteristics 17 • Emitter Tape & Reel Packaging 18 • Product Nomenclature 20 • Handling of Silicone Resin for LEDs 21 • Precaution For Use 22 • Company Information 25 Rev0.1, July 13, 2018 2 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Performance Characteristics Table 2. Product Selection Guide, IF = 65mA , Tj = 25ºC, RH30% Min. CRI, Ra[4] Nominal CCT [K] [1] 80 Min. Flux [lm] Typ. Luminous Flux ФV [3] [lm] Typ. Luminous Efficacy [lm/W] @65mA @65mA Part Number 6500 32.6 33.5 187 S1W0-303065800300000000-0P004 5700 32.6 34.1 190 S1W0-303057800300000000-0P004 5000 34.1 35.2 196 S1W0-303050800300000000-0P004 4000 33.6 34.9 195 S1W0-303040800300000000-0P004 3500 31.5 33.6 187 S1W0-303035800300000000-0P004 3000 31.5 32.7 182 S1W0-303030800300000000-0P004 2700 31.5 32.3 180 S1W0-303027800300000000-0P004 Notes : (1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. (2) Seoul Semiconductor maintains a tolerance of 7% on Intensity and power measurements. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. (3) The lumen table is only for reference. Rev0.1, July 13, 2018 3 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Performance Characteristics Table 3. Characteristics, IF=65mA, Tj= 25ºC, RH30% Value Parameter Symbol Unit Min. Typ. Max. Forward Current IF - 65 - mA Forward Voltage[1] VF 2.7 2.8 2.9 V CRI[1] Ra 80 - - Viewing Angle [2] 2Θ1/2 - 120 - Deg. Thermal resistance (J to S) [3] RθJ-S - 10 - ℃/W ESD Sensitivity(HBM) - Class 3A JEDEC JS-001-2017 Table 4. Absolute Maximum Ratings Parameter Symbol Value Unit Forward Current IF 400 mA Power Dissipation PD 1.16 W Junction Temperature Tj 125 ºC Operating Temperature Topr -40~ + 85 ºC Storage Temperature Tstg -40 ~ + 100 ºC Notes : (1) Tolerance : VF :±0.1V, IV :±7%, Ra :±2, x,y :±0.005 (2) 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. (3) Thermal resistance : RthJS (Junction / solder) • LED’s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. • Thermal resistance can be increased substantially depending on the heat sink design/operating condition, and the maximum possible driving current will decrease accordingly. • All measurements were made under the standardized environment of Seoul Semiconductor. Rev0.1, July 13, 2018 4 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Characteristics Graph Relative Emission Intensity (a.u) Fig 1. Color Spectrum, Tj = 25ºC 2600~3700K 3700~4700K 4700~7000K 1.0 0.5 0.0 300 400 500 600 700 800 Wavelength [nm] Fig 2. Radiant Pattern, Tj = 25ºC 100 Relative Intensity (%) 80 60 40 20 0 -100 -75 -50 -25 0 25 50 75 100 Angle [Degree] Rev0.1, July 13, 2018 5 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Characteristics Graph Fig 3. Forward Voltage vs. Forward Current, Tj = 25ºC 0.40 Forward Current [A] 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 0 1 2 3 4 Forward Voltage [V] Fig 4. Forward Current vs. Relative Luminous Intensity, Tj = 25ºC Relative Luminous Intensity [a.u.] 6 5 4 3 2 1 0 0 50 100 150 200 250 300 350 400 Forward Current [mA] Rev0.1, July 13, 2018 6 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Characteristics Graph Fig 5. Forward Current vs. CIE X, Y Shift, Tj = 25ºC (4200K~7000K) 0.368 0.366 CIE Y 0.364 200mA 300mA 0.362 65mA 400mA 0.360 0.358 0.356 0.342 0.344 0.346 0.348 0.350 0.352 0.354 CIE X (2600K~4200K) 0.420 CIE Y 0.419 300mA 200mA 65mA 400mA 0.418 0.417 0.416 0.460 0.461 0.462 0.463 0.464 0.465 0.466 CIE X Rev0.1, July 13, 2018 7 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Characteristics Graph Fig 6. Junction Temperature vs. Relative Luminous Intensity, IF=65mA Relative Luminous Intensity [a.u.] 1.0 0.8 0.6 0.4 0.2 0.0 25 45 65 85 105 125 O Junction Temperature Tj( C) Fig 7. Junction Temperature vs. Relative Forward Voltage, IF=65mA Relative Forward Voltage 1.0 0.8 0.6 0.4 0.2 0.0 25 45 65 85 105 125 O Junction Temperature Tj( C) Rev0.1, July 13, 2018 8 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Characteristics Graph Fig 8. Chromaticity Coordinate vs. Junction Temperature, IF=65mA (4200K~7000K) 0.41 0.40 CIE Y 0.39 o 25 C o 70 C 0.38 o 100 C o 125 C 0.37 0.36 0.35 0.34 0.35 0.36 0.37 0.38 0.39 CIE X (2600K~4200K) 0.430 0.425 CIE Y 0.420 o 25 C o 70 C 0.415 o 100 C o 125 C 0.410 0.405 0.400 0.450 0.455 0.460 0.465 0.470 CIE X Rev0.1, July 13, 2018 9 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Characteristics Graph Fig 9. Ambient Temperature vs. Maximum Forward Current, Tj_max = 125℃ 500 Forward Current [mA] 400 Rth j-a = 40℃/W 300 200 100 0 0 20 40 60 80 100 O Ambient Temperature [ C] Rev0.1, July 13, 2018 10 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Color Bin Structure Table 5. Bin Code description, Tj=25℃, IF=65mA Luminous Flux (lm) @5000K Typical Forward Voltage (V) Color Chromaticity Coordinate Part Number S1W03030xx800300000000-0P004 Bin Code Min. Max. Bin Code Min. Max. T5 32.6 34.1 Y1 2.7 2.8 U0 34.1 35.0 Y2 2.8 2.9 U3 35.0 36.3 U7 36.3 38.8 Refer to page.12~14 Table 6. Intensity rank distribution Available ranks CCT CIE 6000- 7000K A T5 U0 U3 U7 5300- 6000K B T5 U0 U3 U7 4700 ~ 5300K C T5 U0 U3 U7 3700 ~ 4200K E T5 U0 U3 U7 3200 ~ 3700K F T5 U0 U3 U7 2900 ~ 3200K G T5 U0 U3 U7 2600 ~ 2900K H T5 U0 U3 U7 Rev0.1, July 13, 2018 IV Rank 11 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Color Bin Structure CIE Chromaticity Diagram (Cool white), Tj=25℃, IF=100mA 0.38 5000K CB 4C 0.36 CA 5700K 3C BB 4B 6500K 3B AB 0.34 3A 0.32 AD CD C BC 4A AA CC BA BD B AC A 0.30 0.30 0.32 0.34 0.36 6500K 3Step 3A Center point 0.3123 : 0.3282 Major Axis a 0.0066 Minor Axis b 0.0027 Ellipse 58 Rotation Angle 5700K 3Step 3B Center point 0.3287 : 0.3417 Major Axis a 0.0071 Minor Axis b 0.0030 Ellipse 59 Rotation Angle 5000K 3Step 3C Center point 0.3447 : 0.3553 Major Axis a 0.0081 Minor Axis b 0.0035 Ellipse 60 Rotation Angle 6500K 4Step 4A Center point 0.3123 : 0.3282 Major Axis a 0.0088 Minor Axis b 0.0036 Ellipse 58 Rotation Angle 5700K 4Step 4B Center point 0.3287 : 0.3417 Major Axis a 0.0095 Minor Axis b 0.0040 Ellipse 59 Rotation Angle 5000K 4Step 4C Center point 0.3447 : 0.3553 Major Axis a 0.0108 Minor Axis b 0.0047 Ellipse 60 Rotation Angle AA CIE X 0.3028 0.3048 0.3131 0.3115 AB CIE Y 0.3304 0.3209 0.329 0.3393 CIE X 0.3115 0.3131 0.3213 0.3205 CIE Y 0.3462 0.3353 0.3423 0.3539 CIE X 0.3292 0.3293 0.3371 0.3376 CIE Y 0.3616 0.3493 0.3558 0.3687 CIE X 0.3463 0.3452 0.3533 0.3551 BA CIE X 0.3207 0.3215 0.3293 0.3292 CIE X 0.3131 0.3146 0.3221 0.3213 CIE Y 0.3539 0.3423 0.3493 0.3616 CIE X 0.3293 0.3294 0.3366 0.3371 CIE Y 0.3687 0.3558 0.3624 0.376 CIE X 0.3452 0.344 0.3514 0.3533 BB CA CIE X 0.3376 0.3371 0.3452 0.3463 AC CIE Y 0.3393 0.329 0.3371 0.3481 CIE X 0.3048 0.3068 0.3146 0.3131 CIE Y 0.3423 0.3306 0.3369 0.3493 CIE X 0.3215 0.3222 0.3294 0.3293 CIE Y 0.3558 0.3428 0.3487 0.3624 CIE X 0.3371 0.3366 0.344 0.3452 BC CB Rev0.1, July 13, 2018 AD CIE Y 0.329 0.3187 0.3261 0.3371 BD CC 12 CIE Y 0.3209 0.3113 0.3187 0.329 CIE Y 0.3353 0.3243 0.3306 0.3423 CD CIE Y 0.3493 0.3369 0.3428 0.3558 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Color Bin Structure CIE Chromaticity Diagram (Cool white), Tj=25℃, IF=100mA 0.40 4000K EB 4E EA 0.38 3E EC ED E 0.36 0.34 0.36 0.38 0.40 4500K 3Step 3D Center point 0.3611 : 0.3658 Major Axis a 0.0090 Minor Axis b 0.0039 Ellipse 55 Rotation Angle 4000K 3Step 3E Center point 0.3818 : 0.3797 Major Axis a 0.0094 Minor Axis b 0.0040 Ellipse 53 Rotation Angle 4500K 4Step 4D Center point 0.3611 : 0.3658 Major Axis a 0.0120 Minor Axis b 0.0052 Ellipse 55 Rotation Angle 4000K 4Step 4E Center point 0.3818 : 0.3797 Major Axis a 0.0125 Minor Axis b 0.0053 Ellipse 53 Rotation Angle DA DB DC DD CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3548 0.3736 0.3641 0.3804 0.3616 0.3663 0.353 0.3601 0.353 0.3601 0.3616 0.3663 0.359 0.3521 0.3511 0.3465 0.3616 0.3663 0.3703 0.3726 0.367 0.3578 0.359 0.3521 0.3641 0.3804 0.3736 0.3874 0.3703 0.3726 0.3616 0.3663 CIE X CIE Y CIE X CIE Y CIE X CIE Y CIE X CIE Y 0.3736 0.3874 0.3871 0.3959 0.3828 0.3803 0.3703 0.3726 0.3703 0.3726 0.3828 0.3803 0.3784 0.3647 0.367 0.3578 0.3828 0.3803 0.3952 0.388 0.3898 0.3716 0.3784 0.3647 0.3871 0.3959 0.4006 0.4044 0.3952 0.388 0.3828 0.3803 EA EB Rev0.1, July 13, 2018 EC 13 ED www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Color Bin Structure CIE Chromaticity Diagram (Cool white), Tj=25℃, IF=100mA 0.44 2700K 3000K HB HA 0.42 GB 3500K GA 4G 3H FB 3G 4F 0.40 FA HC HD 3F 4H GD GC FC 0.38 FD 0.36 0.46 0.44 0.42 0.40 0.48 3500K 3Step 3 Step Center point 0.4073 : 0.3917 Major Axis a 0.0093 Minor Axis b 0.0041 Ellipse 53 Rotation Angle 3000K 3Step 3 Step Center point 0.4338 : 0.4030 Major Axis a 0.0085 Minor Axis b 0.0041 Ellipse 53 Rotation Angle 2700K 3Step 3 Step Center point 0.4578 : 0.4101 Major Axis a 0.0079 Minor Axis b 0.0041 Ellipse 54 Rotation Angle 3500K 4Step 4 Step Center point 0.4073 : 0.3917 Major Axis a 0.0124 Minor Axis b 0.0055 Ellipse 53 Rotation Angle 3000K 4Step 4 Step Center point 0.4338 : 0.4030 Major Axis a 0.0113 Minor Axis b 0.0055 Ellipse 53 Rotation Angle 2700K 4Step 4 Step Center point 0.4578 : 0.4101 Major Axis a 0.0105 Minor Axis b 0.0055 Ellipse 54 Rotation Angle FA CIE X 0.3996 0.3943 0.4082 0.4146 FB CIE Y 0.4015 0.3853 0.392 0.4089 CIE X 0.4146 0.4082 0.4223 0.4299 CIE Y 0.4165 0.399 0.4033 0.4212 CIE X 0.443 0.4345 0.4468 0.4562 CIE Y 0.426 0.4077 0.4104 0.4289 CIE X 0.4687 0.4585 0.4703 0.481 GA CIE X 0.4299 0.4223 0.4345 0.443 CIE X 0.4082 0.4017 0.4147 0.4223 CIE Y 0.4212 0.4033 0.4077 0.426 CIE X 0.4345 0.4259 0.4373 0.4468 CIE Y 0.4289 0.4104 0.4132 0.4319 CIE X 0.4585 0.4483 0.4593 0.4703 GB HA CIE X 0.4562 0.4468 0.4585 0.4687 FC CIE Y 0.4089 0.392 0.399 0.4165 CIE X 0.3943 0.3889 0.4017 0.4082 CIE Y 0.4033 0.3853 0.3893 0.4077 CIE X 0.4223 0.4147 0.4259 0.4345 CIE Y 0.4104 0.3919 0.3944 0.4132 CIE X 0.4468 0.4373 0.4483 0.4585 GC HB Rev0.1, July 13, 2018 FD CIE Y 0.392 0.3751 0.3814 0.399 GD HC 14 CIE Y 0.3853 0.369 0.3751 0.392 CIE Y 0.399 0.3814 0.3853 0.4033 HD CIE Y 0.4077 0.3893 0.3919 0.4104 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Mechanical Dimensions Top View Bottom View Cathode Anode (+) Circuit Side View (1) All dimensions are in millimeters. (2) Scale : none (3) Undefined tolerance is ±0.2mm Rev0.1, July 13, 2018 15 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Recommended Solder Pad Notes : (1) All dimensions are in millimeters. (2) Scale : none (3) This drawing without tolerances are for reference only (4) Undefined tolerance is ±0.1mm Rev0.1, July 13, 2018 16 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Reflow Soldering Characteristics IPC/JEDEC J-STD-020 Table 7. Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3° C/second max. 3° C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak Temperature (Tp) 215℃ 260℃ Time within 5°C of actual Peak Temperature (tp)2 10-30 seconds 20-40 seconds Ramp-down Rate 6 °C/second max. 6 °C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Caution (1) Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. (2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. (3) When soldering, do not put stress on the LEDs during heating. (4) After soldering, do not warp the circuit board. Rev0.1, July 13, 2018 17 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Emitter Tape & Reel Packing Anode (+) ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : 4,500pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10˚ to the carrier tape. (4) Package : P/N, Manufacturing data Code No. and Quantity to be indicated on a damp proof Package. Rev0.1, July 13, 2018 18 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Emitter Tape & Reel Packing Reel Aluminum Bag Outer Box Rev0.1, July 13, 2018 19 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Product Nomenclature Table 8. Part Numbering System Part Number Code Description Part Number Value X1 Company S Seoul Semiconductor X2 Level of Integration 1 Discrete LED X3X4 Technology W0 General White X5X6X7X8 Dimension 3030 X9X10 CCT xx X11X12 CRI 80 X13X14 Vf 03 X15X16X17 Characteristic code Flux Rank 000 X18X19X20 Characteristic code Vf Rank 000 X21X22 Characteristic code Color Step 00 X23X24 Type 0P X25X26X27 Internal code 004 Rev0.1, July 13, 2018 20 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this. product with acid or sulfur material in sealed space. Rev0.1, July 13, 2018 21 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Precaution for Use (1) Storage To avoid the moisture penetration, we recommend store in a dry box with a desiccant. The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use proper SMT techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 30℃ Humidity : less than RH60% b. If the package has been opened more than 4 week(MSL_2a) or the color of the desiccant changes, components should be dried for 10-24hr at 65±5℃ (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. Rev0.1, July 13, 2018 22 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Precaution for Use (10) The appearance and specifications of the product may be modified for improvement without notice. (11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. (12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (13) Attaching LEDs, do not use adhesives that outgas organic vapor. (14) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (15) Similar to most Solid state devices; LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment) Rev0.1, July 13, 2018 23 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Precaution for Use b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires. - This damage usually appears due to the thermal stress produced during the EOS event. c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device Rev0.1, July 13, 2018 24 www.seoulsemicon.com Preliminary Product Data Sheet S1W0-3030xx8003-00000000-0P004 – Mid-Power LED Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type LEDs as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. Rev0.1, July 13, 2018 25 www.seoulsemicon.com