Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Superior high Flux for High Voltage System
High-Power LED - 5050 6V Series
S1W0-5050xxxx06-00000000-00002
LM-80
RoHS
Product Brief
Description
Features and Benefits
•
•
This White Colored surface-mount LED
comes in standard package dimension.
Package Size : 5.0x5.0x0.7mm
•
It has a substrate made up of a molded
plastic reflector sitting on top of a lead
frame.
•
The die is attached within the reflector
cavity and the cavity is encapsulated by
silicone.
•
•
•
•
•
•
High Intensity output and high
luminance
Designed for high voltage operation
SMT solderable
RoHS compliant
Color coordinate: 2200K-6500K,CRI70
2700K-6500K,CRI80
CRI line up 70& 80
Key Applications
•
•
•
•
The package design coupled with
careful selection of component materials
allow these products to perform with
high reliability
General lighting
Architectural lighting
LED Bulbs
Decorative / Pathway lighting
Table 1-1. Product Selection Table
Reference Code
Color
Cool White
STW0L8PA
Neutral White
CRI
Nominal
CCT
Part Number
6500K
S1W0-5050657006-00000000-00002
5700K
S1W0-5050577006-00000000-00002
5000K
S1W0-5050507006-00000000-00002
4000K
S1W0-5050407006-00000000-00002
3500K
S1W0-5050357006-00000000-00002
3000K
S1W0-5050307006-00000000-00002
2700K
S1W0-5050277006-00000000-00002
2200K
S1W0-5050227006-00000000-00002
Min
70
Warm White
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Table 1-2. Product Selection Table
Reference Code
Color
Cool White
STW8L8PA
Neutral White
Warm White
Rev3.0, November 7, 2019
CRI
Nominal
CCT
Part Number
6500K
S1W0-5050658006-00000000-00002
5700K
S1W0-5050578006-00000000-00002
5000K
S1W0-5050508006-00000000-00002
4000K
S1W0-5050408006-00000000-00002
3500K
S1W0-5050358006-00000000-00002
3000K
S1W0-5050308006-00000000-00002
2700K
S1W0-5050278006-00000000-00002
Min
2
80
www.seoulsemicon.com
Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Table of Contents
Index
•
Product Brief
1
•
Table of Contents
3
•
Performance Characteristics
4
•
Characteristics Graph
6
•
Color Bin Structure
19
•
Mechanical Dimensions
25
•
Recommended Solder Pad
26
•
Reflow Soldering Characteristics
27
•
Emitter Tape & Reel Packaging
28
•
Product Nomenclature
30
•
Handling of Silicone Resin for LEDs
31
•
Precaution For Use
32
•
Company Information
35
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Product Performance & Characterization Guide
Table 2. Product Selection Guide, IF = 640mA, Tj = 25ºC, RH30%
Min.
CRI, Ra[4]
Nominal
CCT [K] [1]
Min. Flux
[lm]
Typ.
Luminous
Flux ФV [2,3]
[lm]
Typ.
Luminous
Efficacy
[lm/W]
@640mA
@640mA
Part Number
@640mA
6500
600
667
168
S1W0-5050657006-00000000-00002
5700
650
678
171
S1W0-5050577006-00000000-00002
5000
650
690
174
S1W0-5050507006-00000000-00002
4000
650
700
176
S1W0-5050407006-00000000-00002
3500
600
657
165
S1W0-5050357006-00000000-00002
3000
600
650
164
S1W0-5050307006-00000000-00002
2700
550
634
160
S1W0-5050277006-00000000-00002
2200
500
540
136
S1W0-5050227006-00000000-00002
6500
600
620
156
S1W0-5050658006-00000000-00002
5700
600
630
159
S1W0-5050578006-00000000-00002
5000
600
635
160
S1W0-5050508006-00000000-00002
4000
600
635
160
S1W0-5050408006-00000000-00002
3500
600
615
155
S1W0-5050358006-00000000-00002
3000
550
610
154
S1W0-5050308006-00000000-00002
2700
550
595
150
S1W0-5050278006-00000000-00002
70
80
Notes :
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT 5% tolerance.
(2) Seoul Semiconductor maintains a tolerance of 7% on flux and power measurements.
(3) ФV is the total luminous flux output as measured with an integrating sphere.
(4) Tolerance is 2.0 on CRI, 0.2 on VF measurements.
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Product Performance & Characterization Guide
Table 3. Characteristics, IF=640mA, Tj=25ºC
Value
Parameter
Symbol
Unit
Min.
Typ.
Max.
5.8
-
6.4
V
500
-
750
lm
CCT
2,700
-
7,000
K
CRI[4]
Ra
70
80
-
80
90
-
Viewing Angle
2Θ1/2
-
120
-
deg.
Thermal resistance (J to S)[5]
Rθj-s
-
2.0
-
K/W
ESD Sensitivity(HBM)
-
Forward Voltage
Luminous Flux
Correlated Color
Temperature[3]
VF
Φv
[2]
Class 2 JEDEC JS-001-2017
Table 4. Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
800
mA
Power Dissipation
PD
5.0
W
Junction Temperature
Tj
125
ºC
Operating Temperature
Topr
-40 ~ + 100
ºC
Storage Temperature
Tstg
-40 ~ + 100
ºC
Notes :
(1) Seoul Semiconductor maintains a tolerance of 7% on flux and power measurements.
(2) ФV is the total luminous flux output as measured with an integrating sphere.
(3) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
Color coordinate : 0.005, CCT 5% tolerance.
(4) Tolerance is 2.0 on CRI, 0.2 on VF measurements.
•
Calculated performance values are for reference only.
•
All measurements were made under the standardized environment of Seoul Semiconductor.
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Characteristics Graph
Fig 1. Color Spectrum, Tj=25℃, IF=640mA (CRI70)
Relative Spectral Power Distribution
1.0
4700~7000K
7000~4700K
2600~3700K
2200K
0.8
0.6
0.4
0.2
0.0
350
400
450
500
550
600
650
700
750
800
Wavelength [nm]
Fig 1. Color Spectrum, Tj=25℃, IF=640mA (CRI80)
Relative Spectral Power Distribution
1.0
4700~7000K
3700~4700K
2600~3700K
0.8
0.6
0.4
0.2
0.0
350
400
450
500
550
600
650
700
750
800
Wavelength [nm]
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Characteristics Graph
Fig 2. Radiant pattern, Tj=25℃, IF=640mA
Relative Luminous Flux [a.u.]
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-90
-75
-60
-45
-30
-15
0
15
30
45
60
75
90
Angle [deg.]
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Characteristics Graph
Fig 3. Forward Voltage vs. Forward Current, Tj=25℃
Forward Current [IF, mA]
1000
800
600
400
200
0
5.0
5.2
5.4
5.6
5.8
6.0
6.2
6.4
6.6
Forward Voltage [VF, V]
Fig 4. Forward Current vs. Relative Luminous Flux, Tj=25℃
1.4
Relative luminous flux [a.u.]
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
200
400
600
800
1000
Forward Current [mA]
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Characteristics Graph
Fig 5. Forward Current vs. CIE X, Y Shift , Tj=25℃ (CRI70)
(4700K~7000K)
0.375
0.370
80mA
CIE Y
0.365
180mA
360mA
0.360
640mA
0.355
800mA
0.350
0.345
0.340
0.341
0.342
0.343
0.344
0.345
0.346
0.347
0.348
CIE X
(3700K~4700K)
0.400
0.395
80mA
180mA
CIE Y
0.390
360mA
0.385
0.380
640mA
800mA
0.375
0.370
0.382
0.383
0.384
0.385
0.386
0.387
0.388
CIE X
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Characteristics Graph
Fig 5. Forward Current vs. CIE X, Y Shift , Tj=25℃ (CRI70)
(3700K~2600K)
0.410
0.405
80mA
180mA
360mA
CIE Y
0.400
640mA
0.395
800mA
0.390
0.385
0.430
0.432
0.434
0.436
0.438
CIE X
(2200K)
0.425
0.420
180mA
CIE Y
0.415
80mA
360mA
640mA
0.410
800mA
0.405
0.400
0.496
0.498
0.500
0.502
0.504
CIE X
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Characteristics Graph
Fig 5. Forward Current vs. CIE X, Y Shift , Tj=25℃ (CRI80)
(4700K~7000K)
0.370
CIE Y
0.365
640mA
0.360
180mA
360mA
80mA
800mA
0.355
0.350
0.346
0.347
0.348
0.349
0.350
0.351
0.352
0.353
CIE X
(3700K~4700K)
0.400
0.395
CIE Y
0.390
0.385
640mA
360mA 180mA
80mA
800mA
0.380
0.375
0.388
0.390
0.392
0.394
0.396
CIE X
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Characteristics Graph
Fig 5. Forward Current vs. CIE X, Y Shift , Tj=25℃ (CRI80)
(3700K~2600K)
0.420
0.415
0.410
CIE Y
640mA
0.405
360mA
180mA
800mA
80mA
0.400
0.395
0.390
0.436
0.438
0.440
0.442
0.444
0.446
0.448
CIE X
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Characteristics Graph
Fig 6. Relative Light Output vs. Junction Temperature, IF=640mA
Relative Light Output [a.u.]
1.1
1.0
0.9
0.8
0.7
20
40
60
80
100
120
140
o
Junction Temperature [ C]
Fig 7. Relative Forward Voltage vs. Junction Temperature, IF=640mA
Relative Forward Voltage [a.u.]
1.1
1.0
0.9
0.8
0.7
20
40
60
80
100
120
140
o
Junction Temperature [ C]
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Characteristics Graph
Fig 8. Junction Temp. vs. CIE X, Y Shift, IF=640mA (CRI70)
(4700K~7000K)
0.004
CIE X
CIE Y
0.000
-0.004
-0.008
-0.012
-0.016
20
40
60
80
100
120
140
o
Junction Temperature [ C]
(3700K~4700K)
0.004
CIE X
CIE Y
0.000
-0.004
-0.008
-0.012
-0.016
20
40
60
80
100
120
140
o
Junction Temperature [ C]
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Characteristics Graph
Fig 8. Junction Temp. vs. CIE X, Y Shift, IF=640mA (CRI70)
(2600K~3700K)
0.004
CIE X
CIE Y
0.000
-0.004
-0.008
-0.012
-0.016
20
40
60
80
100
120
140
o
Junction Temperature [ C]
(2200K)
0.008
CIE X
CIE Y
0.004
0.000
-0.004
-0.008
20
40
60
80
100
120
140
o
Junction Temperature [ C]
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Characteristics Graph
Fig 8. Junction Temp. vs. CIE X, Y Shift, IF=640mA (CRI80)
(4700K~7000K)
0.004
CIE X
CIE Y
0.000
-0.004
-0.008
-0.012
-0.016
20
40
60
80
100
120
140
o
Junction Temperature [ C]
(3700K~4700K)
0.004
CIE X
CIE Y
0.000
-0.004
-0.008
-0.012
-0.016
20
40
60
80
100
120
140
o
Junction Temperature [ C]
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Characteristics Graph
Fig 8. Junction Temp. vs. CIE X, Y Shift, IF=640mA (CRI80)
(2600K~3700K)
0.004
CIE X
CIE Y
0.000
-0.004
-0.008
-0.012
-0.016
20
40
60
80
100
120
140
o
Junction Temperature [ C]
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Characteristics Graph
Fig 9. Maximum Forward Current vs. Ambient Temperature, Tj(max.)=125℃, IF=800mA
Forward Current (mA)
1000
800
600
400
Rth j-a = 7K/W
Rth j-a = 10K/W
Rth j-a = 15K/W
200
0
0
25
50
75
100
125
O
Ambient Temperature ( C)
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Color Bin Structure
Table 5. Bin Code description
Part Number
S1W05050xxxx060000000000002
Luminous Flux (lm)
IF=640mA, Tj=25℃
Bin
Code
Min.
Max.
V3
500
550
W1
550
600
W2
600
650
W3
650
700
W4
700
750
Forward Voltage (Vf)
IF=640mA, Tj=25℃
Color Chromaticity
Coordinate
IF=640mA, Tj=85℃
Refer to page.
20 ~ 24
CRI
Bin
Code
Min.
Max.
Y8
5.8
6.0
Z0
6.0
6.2
Z2
6.2
6.4
70
80
Table 6. Luminous Flux & Forward Voltage rank distribution
CRI
70
80
CCT
CIE
Flux Rank
VF Rank
7000 ~ 6000K
A
V3
W1
W2
W3
W4
Y8
Z0
Z2
6000 ~ 5300K
B
V3
W1
W2
W3
W4
Y8
Z0
Z2
5300 ~ 4700K
C
V3
W1
W2
W3
W4
Y8
Z0
Z2
4200 ~ 3700K
E
V3
W1
W2
W3
W4
Y8
Z0
Z2
3700 ~ 3200K
F
V3
W1
W2
W3
W4
Y8
Z0
Z2
3200 ~ 2900K
G
V3
W1
W2
W3
W4
Y8
Z0
Z2
2900 ~ 2600K
H
V3
W1
W2
W3
W4
Y8
Z0
Z2
2600 ~ 2200K
K
V3
W1
W2
W3
W4
Y8
Z0
Z2
7000 ~ 6000K
A
V3
W1
W2
W3
W4
Y8
Z0
Z2
6000 ~ 5300K
B
V3
W1
W2
W3
W4
Y8
Z0
Z2
5300 ~ 4700K
C
V3
W1
W2
W3
W4
Y8
Z0
Z2
4200 ~ 3700K
E
V3
W1
W2
W3
W4
Y8
Z0
Z2
3700 ~ 3200K
F
V3
W1
W2
W3
W4
Y8
Z0
Z2
3200 ~ 2900K
G
V3
W1
W2
W3
W4
Y8
Z0
Z2
2900 ~ 2600K
H
V3
W1
W2
W3
W4
Y8
Z0
Z2
Available ranks
Not yet available ranks
•
All measurements were made under the standardized environment of Seoul Semiconductor.
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Color Bin Structure
CIE Chromaticity Diagram Tj=85℃, IF=640mA
0.48
0.46
0.44
2700K
2200K
3000K
0.42
3500K
4000K
CIE y
0.40
0.38
5000K
5700K
0.36
6500K
0.34
K
C
0.32
0.30
F
E
G H
B
3step ellipse
5step ellipse
A
0.28
0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52 0.54
CIE x
*Notes :
• Energy Star binning applied to all 2600~7000K.
• Measurement Uncertainty of the Color Coordinates : ± 0.005
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Color Bin Structure
CIE Chromaticity Diagram (Cool white), Tj=85℃, IF=640mA
0.38
5000K
5C
0.36
5700K
3C
5B
6500K
3B
0.34
5A
3A
0.32
0.30
0.30
0.32
0.34
0.36
6500K 3Step
5700K 3Step
5000K 3Step
3A
Center point 0.3123 : 0.3282
Major Axis a
0.0066
Minor Axis b
0.0027
Ellipse
58
Rotation Angle
3B
Center point 0.3287 : 0.3417
Major Axis a
0.0071
Minor Axis b
0.003
Ellipse
59
Rotation Angle
3C
Center point 0.3447 : 0.3553
Major Axis a
0.0081
Minor Axis b
0.0035
Ellipse
60
Rotation Angle
6500K 5Step
5700K 5Step
5000K 5Step
5A
Center point 0.3123 : 0.3282
Major Axis a
0.0110
Minor Axis b
0.0045
Ellipse
58
Rotation Angle
5B
Center point 0.3287 : 0.3417
Major Axis a
0.0118
Minor Axis b
0.0050
Ellipse
59
Rotation Angle
5C
Center point 0.3447 : 0.3553
Major Axis a
0.0135
Minor Axis b
0.0058
Ellipse
60
Rotation Angle
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Color Bin Structure
CIE Chromaticity Diagram (Neutral white), Tj=85℃, IF=640mA
4000K
0.40
5E
3E
0.38
0.36
0.34
0.36
0.38
0.40
0.42
4000K 3Step
3E
Center point
Major Axis a
Minor Axis b
Ellipse
Rotation Angle
0.3818 : 0.3797
0.00940
0.00400
53
4000K 5Step
5E
Center point
0.3818 : 0.3797
Major Axis a
0.0157
Minor Axis b
0.0067
Ellipse
53
Rotation Angle
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Color Bin Structure
CIE Chromaticity Diagram (Warm white), Tj=85℃, IF=640mA
0.44
2700K
3000K
0.42
5H
3500K
5G
3G
5F
0.40
3H
3F
0.38
0.36
0.40
0.42
0.44
0.46
0.48
3500K 3Step
3000K 3Step
2700K 3Step
3F
Center point 0.4073 : 0.3917
Major Axis a
0.0093
Minor Axis b
0.0041
Ellipse
53
Rotation Angle
3G
Center point 0.4338 : 0.4030
Major Axis a
0.0085
Minor Axis b
0.0041
Ellipse
53
Rotation Angle
3H
Center point 0.4578 : 0.4101
Major Axis a
0.0079
Minor Axis b
0.0041
Ellipse
54
Rotation Angle
3500K 5Step
3000K 5Step
2700K 5Step
5F
Center point 0.4073 : 0.3917
Major Axis a
0.0155
Minor Axis b
0.0068
Ellipse
53
Rotation Angle
5G
Center point 0.4338 : 0.4030
Major Axis a
0.0142
Minor Axis b
0.0068
Ellipse
53
Rotation Angle
5H
Center point 0.4578 : 0.4101
Major Axis a
0.0132
Minor Axis b
0.0068
Ellipse
54
Rotation Angle
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Color Bin Structure
CIE Chromaticity Diagram (Warm white), Tj=85℃, IF=640mA
0.44
2200K
5K
0.42
3K
0.40
0.38
0.46
0.48
0.50
0.52
0.54
2200K 3Step
3K
Center point
Major Axis a
Minor Axis b
Ellipse
Rotation Angle
0.5018 : 0.4153
0.00863
0.00398
49
2200K 5Step
5K
Center point
0.5018 : 0.4153
Major Axis a
0.01438
Minor Axis b
0.00663
Ellipse
49
Rotation Angle
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Mechanical Dimensions
< Top View >
< Bottom View >
Anode Mark
Cathode
Cathode Mark
< Side view>
Notes :
(1) All dimensions are in millimeters.
(2) Scale : none
(3) Undefined tolerance is ±0.2mm
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Recommended Solder Pad
Notes :
(1)
(2)
(3)
(4)
All dimensions are in millimeters.
Scale : none
Undefined tolerance is ±0.2mm
This drawing without tolerances are for reference only.
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Reflow Soldering Characteristics
IPC/JEDEC J-STD-020
Table 7.
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp)
3° C/second max.
3° C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak Temperature (Tp)
215℃
260℃
Time within 5°C of actual Peak
Temperature (tp)2
10-30 seconds
20-40 seconds
Ramp-down Rate
6 °C/second max.
6 °C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
Caution
(1) Reflow soldering is recommended not to be done more than two times. In the case of more than
24 hours passed soldering after first, LEDs will be damaged.
(2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable,
suitable tools must be used.
(3) Die slug is to be soldered.
(4) When soldering, do not put stress on the LEDs during heating.
(5) After soldering, do not warp the circuit board.
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Emitter Tape & Reel Packaging
Cathode Mark
(-)
(+)
Symbol
W
T
K0
A0
B0
E
Dimension
(㎜)
12.00
±0.10
0.30
±0.30
0.95
±0.10
5.30
±0.10
5.30
±0.10
1.75
±0.10
Symbol
F
D0
D1
P0
P1
P2
Dimension
(㎜)
5.50
±0.10
1.60
±0.10
1.60
±0.10
4.00
±0.10
8.00
±0.10
2.00
±0.10
Notes :
(1) Quantity : 7 inch reel type ( 1,000 pcs / Reel ± 1pcs)
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is
turned off from the carrier tape at the angle of 10º to the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package.
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Emitter Tape & Reel Packaging
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Product Nomenclature
Table 8. Part Numbering System
Part Number Code
Description
Part Number
Value
X1
Company
S
Seoul Semiconductor
X2
Level of Integration
1
Discrete LED
X3X4
Technology
W0
White General
X5X6X7X8
Dimension
5050
5.0x5.0mm
X9X10
CCT
xx
65: 6500K
57: 5700K
50: 5000K
40: 4000K
35: 3500K
30: 3000K
27: 2700K
X11X12
CRI
xx
CRI70
CRI80
X13X14
Vf
06
X15X16X17
Characteristic code
Flux Rank
000
X18X19X20
Characteristic code
Vf Rank
000
X21X22
Characteristic code
Color Step
xx
X23X24
Type
00
X25X26X27
Internal code
002
Rev3.0, November 7, 2019
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3S: 3step ellipse
5S: 5step ellipse
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Handling of Silicone Resin for LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions regarding the form
of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be
prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These
conditions must be considered during the handling of such devices. Compared to standard
encapsulants, silicone is generally softer, and the surface is more likely to attract dust.
As mentioned previously, the increased sensitivity to dust requires special care during processing.
In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning
solution must be applied to the surface after the soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be
assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
(6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this.
product with acid or sulfur material in sealed space.
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Precaution for Use
(1) Storage
To avoid the moisture penetration, we recommend store in a dry box with a desiccant . The
recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%.
(2) Use Precaution after Opening the Packaging
Use SMT techniques properly when you solder the LED as separation of the lens may affect the light
output efficiency.
Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing / Temperature : 5 ~ 40℃ Humidity : less than RH30%
b. If the package has been opened more than 4 week(MSL_2a) or the color of the
desiccant changes, components should be dried for 10-12hr at 60±5℃
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
(4) Do not rapidly cool device after soldering.
(5) Components should not be mounted on warped (non coplanar) portion of PCB.
(6) Radioactive exposure is not considered for the products listed here in.
(7) Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the
liquid or inhale the gas generated by such products when chemically disposed of.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature.
(10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or
more after being shipped from Seoul Semiconductor. A sealed container with a nitrogen atmosphere
should be used for storage.
(11) The appearance and specifications of the product may be modified for improvement without
notice.
(12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Precaution for Use
(13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures
can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy.
The result can be a significant loss of light output from the fixture. Knowledge of the properties of the
materials selected to be used in the construction of fixtures can help prevent these issues.
(14) The slug is electrically isolated.
(15) Attaching LEDs, do not use adhesives that outgas organic vapor.
(16) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the
reverse voltage is applied to LED, migration can be generated resulting in LED damage.
(17) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is
a list of suggestions that Seoul Semiconductor purposes to minimize these effects.
a. ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact. While most ESD events are considered harmless, it can be an expensive problem in
many industrial environments during production and storage. The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as:
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event.
One or more recommended work area suggestions:
- Ionizing fan setup
- ESD table/shelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options:
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls:
- Humidity control (ESD gets worse in a dry environment)
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Precaution for Use
b. EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device.
The effects from an EOS event can be noticed through product performance like:
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation.)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary, but there are some
common signs that will indicate an EOS event has occurred:
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires.
- This damage usually appears due to the thermal stress produced during the EOS event.
c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing:
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
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Product Data Sheet
S1W0-5050xxxx06-00000000-00002 -5050Series
Company Information
Published by
Seoul Semiconductor © 2013 All Rights Reserved.
Company Information
Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage
and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than
10,000 patents globally, while offering a wide range of LED technology and production capacity in
areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs.
The company’s broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type
LEDs as well as custom modules, displays, and sensors.
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products. With
respect to any examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual
property rights of any third party. The appearance and specifications of the product can be changed
to improve the quality and/or performance without notice.
Rev3.0, November 7, 2019
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