S4SM-1566409736-0C500H3S-00001

Pre-Product Data Sheet S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Natural light closest to the sunlight SunLike COB Series S4SM-1566xx9736-0C500H3S-00001 Product Brief Description Features and Benefits • The SunLike COB series deliver natural sunlight spectrum. • It is especially designed light source for human centric lighting by using violet LED and TRI-R phosphor technology. • It‘s thermal management is excellent than other power LED solutions with wider Metal area. • • • • • • • • SunLike series are ideal light sources for commercial lightings including shop, museum, hospital and other premium light quality required applications. CRI typ. 97 (on the BBL) Size 19mm * 19mm LES 14.5mm MacAdam 3-step binning Uniformed Shadow Excellent thermal management RoHs compliant Key Applications Rev0.4, December 22, 2017 • • • • 1 Commercial – Spot, Downlight Replacement lamps – bulb, PAR, MR16 Industrial Residential www.seoulsemicon.com Pre-Product Data Sheet S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Table.1 Product Selection Table Reference Code Color CRI Nominal CCT Part Number 6500K S4SM-1566659736-0C500H3S-00001 5000K S4SM-1566509736-0C500H3S-00001 4000K S4SM-1566409736-0C500H3S-00001 3000K S4SM-1566309736-0C500H3S-00001 2700K S4SM-1566279736-0C500H3S-00001 Typ. Cool White SAWS1566A Neutral White 97 Warm White Rev0.4, December 22, 2017 2 www.seoulsemicon.com Pre-Product Data Sheet S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Table of Contents Index • Product Brief 1 • Table of Contents 3 • Performance Characteristics 4 • Characteristics Graph 6 • Color Bin Structure 15 • Mechanical Dimensions 17 • Packaging Specification 18 • Product Nomenclature (Labeling Information) 20 • Handling of Silicone Resin for LED 21 • Precaution for Use 22 • Company Information 25 Rev0.4, December 22, 2017 3 www.seoulsemicon.com Pre-Product Data Sheet S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Performance Characteristics Table.2 Electro Optical Characteristics, Tj=85oC CCT (K) [1] Typical Luminous Flux [2] ФV [3] (lm) Typical Forward Voltage (VF) [4] CRI [5], Ra Viewing Angle (degrees) 2Θ ½ Typ. 0.72A 0.72A Typ. Typ. S4SM-1566659736 -0C500H3S-00001 6500 2615 35.2 97 115 S4SM-1566509736 -0C500H3S-00001 5000 2655 35.2 97 115 S4SM-1566409736 -0C500H3S-00001 4000 2540 35.2 97 115 S4SM-1566309736 -0C500H3S-00001 3000 2335 35.2 97 115 S4SM-1566279736 -0C500H3S-00001 2700 2275 35.2 97 115 Part Number Notes : (1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color coordinate : 0.005, CCT 5% tolerance. (2) Seoul Semiconductor maintains a tolerance of ±7% on flux and power measurements. (3) ФV is the total luminous flux output as measured with an integrating sphere. (4) Tolerance is ±3% on forward voltage measurements. (5) Tolerance is ±2 on CRI measurements. * For reference only. Rev0.4, December 22, 2017 4 www.seoulsemicon.com Pre-Product Data Sheet S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Performance Characteristics Table.3 Absolute Maximum Ratings Value Parameter Symbol Unit Min. Typ. Max. Forward Current IF - 0.72 1.44 A Power Dissipation Pd - 25.4 56.2 W Junction Temperature Tj - - 125 ºC Operating Temperature Topr - 40 - 85 ºC Surface Temperature TS - 40 - 105 ºC Storage Temperature Tstg - 40 - 105 ºC Thermal resistance (J to S) [1] RθJ-S - 0.34 - K/W ESD Sensitivity(HBM) Class 3A JESD22-A114-E Notes : (1) Thermal resistance : RθJ-S At thermal resistance, J to S means junction to COB’s substrate bottom. •LED’s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. •Thermal resistance can be increased substantially depending on the heat sink design/operating condition, and the maximum possible driving current will decrease accordingly. •All measurements were made under the standardized environment of Seoul Semiconductor.. Rev0.4, December 22, 2017 5 www.seoulsemicon.com Pre-Product Data Sheet S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Performance Characteristics Fig 1. Color Spectrum, 120 5000K 4000K 3000K Relative Intensity (%) 100 80 60 40 20 0 350 400 450 500 550 600 650 700 750 800 Wavelength (nm) Rev0.4, December 22, 2017 6 www.seoulsemicon.com Pre-Product Data Sheet S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Performance Characteristics Fig 2. Radiant Pattern 120 Relative Intensity (%) 100 80 60 40 20 0 -100 -80 -60 -40 -20 0 20 40 60 80 100 Angle (Degree) Rev0.4, December 22, 2017 7 www.seoulsemicon.com Pre-Product Data Sheet S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Performance Characteristics Fig 3. Forward Voltage vs. Forward Current, Tj=85℃ Forward Current (A) 1.6 1.2 0.8 0.4 0.0 25 30 35 40 45 Foward Voltage (V) Fig 4. Forward Current vs. Relative Luminous Flux, Tj=85℃ Relative Luminous Flux (%) 200 150 100 50 0 0.0 0.4 0.8 1.2 1.6 Forward Current (A) Rev0.4, December 22, 2017 8 www.seoulsemicon.com Pre-Product Data Sheet S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Performance Characteristics Fig 5. Junction Temperature vs. Relative Luminous Flux, IF=0.72A Relative Luminous Flux (%) 120 110 100 90 80 70 60 50 0 25 45 65 85 105 125 o Junction Temperature ( C) Fig 6. Junction Temperature vs. Forward Voltage, IF=0.72A Relative Forward Voltage (%) 110 100 90 80 70 60 50 0 25 45 65 85 105 125 o Junction Temperature ( C) Rev0.4, December 22, 2017 9 www.seoulsemicon.com Pre-Product Data Sheet S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Performance Characteristics Fig 7. Junction Temperature vs. CIE x,y Shift, IF=0.72A (5000K) Relative CIE x,y Variation 0.03 CIE-X(5000K) CIE-Y(5000K) 0.02 0.01 0.00 -0.01 -0.02 -0.03 25 45 65 85 105 125 Junction Temperature (oC) Fig 8. Junction Temperature vs. CIE x,y Shift, IF=0.72A (4000K) Relative CIE x,y Variation 0.03 CIE-X(4000K) CIE-Y(4000K) 0.02 0.01 0.00 -0.01 -0.02 -0.03 25 45 65 85 105 125 Junction Temperature (oC) Rev0.4, December 22, 2017 10 www.seoulsemicon.com Pre-Product Data Sheet S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Performance Characteristics Fig 9. Junction Temperature vs. CIE x,y Shift, IF=0.72A (3000K) Relative CIE x,y Variation 0.03 CIE-X(3000K) CIE-Y(3000K) 0.02 0.01 0.00 -0.01 -0.02 -0.03 25 45 65 85 105 125 Junction Temperature (oC) Rev0.4, December 22, 2017 11 www.seoulsemicon.com Pre-Product Data Sheet S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Performance Characteristics Fig 10. Forward Current vs. CIE x,y Shift, Tj=85oC (5000K) Relative CIE x,y Variation 0.03 CIE-X(5000K) CIE-Y(5000K) 0.02 0.01 0.00 -0.01 -0.02 -0.03 0.0 0.4 0.8 1.2 1.6 Forward Current (A) Fig 11. Forward Current vs. CIE x,y Shift, Tj=85oC (4000K) Relative CIE x,y Variation 0.03 CIE-X(4000K) CIE-Y(4000K) 0.02 0.01 0.00 -0.01 -0.02 -0.03 0.0 0.4 0.8 1.2 1.6 Forward Current (A) Rev0.4, December 22, 2017 12 www.seoulsemicon.com Pre-Product Data Sheet S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Performance Characteristics Fig 12. Forward Current vs. CIE x,y Shift, Tj=85oC (3000K) Relative CIE x,y Variation 0.03 CIE-X(3000K) CIE-Y(3000K) 0.02 0.01 0.00 -0.01 -0.02 -0.03 0.0 0.4 0.8 1.2 1.6 Forward Current (A) Rev0.4, December 22, 2017 13 www.seoulsemicon.com Pre-Product Data Sheet S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Performance Characteristics Fig 13. Surface Temperature vs. Maximum Forward Current, Tj(max.)=125oC Maximum Forward Current (A) 1.6 1.2 0.8 0.4 0.0 0 20 40 60 80 100 120 o Surface Temperature ( C) Rev0.4, December 22, 2017 14 www.seoulsemicon.com Pre-Product Data Sheet S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Color Bin Structure Table 4. Bin Code Description, Tj=85oC, IF=0.72A Part Number S4SM1566xx97360C500H3S00001 Luminous Flux (lm) Typical Forward Voltage (V) Color Chromaticity CRI Bin Code Min. Typ. Bin Code Typ. CCT Bin Code Min. Max. Bin Code Typ. C5 2405 2615 AE3 6500K H 33.3 37.0 S 97 C5 2445 2655 CE3 5000K H 33.3 37.0 S 97 C5 2335 2540 EE3 4000K H 33.3 37.0 S 97 C5 2150 2335 GE3 3000K H 33.3 37.0 S 97 C5 2095 2275 HE3 2700K H 33.3 37.0 S 97 Rev0.4, December 22, 2017 15 www.seoulsemicon.com Pre-Product Data Sheet S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Color Bin Structure CIE Chromaticity Diagram, Tj=85℃ 0.45 0.42 CIE Y 0.39 0.36 0.33 ANSI C78.377 Quadrangles 3-step MacAdam ellipse BBL 0.30 0.30 0.33 0.36 0.39 0.42 0.45 0.48 CIE X Table 5. 3-step MacAdam Ellipse Color Bin Definitions Color Region 3-step MacAdam Ellipse CCT (K) Center Point Major Axis (a) Minor Axis (b) Rotation Angle (θ) CIE x CIE y 6500 0.3123 0.3283 0.00669 0.00285 58.38 5000 0.3446 0.3551 0.00822 0.00354 59.62 4000 0.3818 0.3797 0.00939 0.00402 54.00 3000 0.4339 0.4033 0.00834 0.00408 53.17 2700 0.4578 0.4101 0.00774 0.00411 57.28 Notes : (1) The chromaticity center refers to ANSI C78.377:2015. (2) (a), (b), and (θ) indicate the major axis length, the minor axis length, and the rotation angle from the X axis of the ellipse bin, respectively. Rev0.4, December 22, 2017 16 www.seoulsemicon.com Pre-Product Data Sheet Mechanical Dimensions S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Notes : 1. 2. 3. All dimensions are in millimeters. Not to scale Undefined tolerance is ±0.2mm Rev0.4, December 22, 2017 17 www.seoulsemicon.com Pre-Product Data Sheet Packaging Specification S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Notes : (1) Quantity : 20pcs/Tray (2) All dimensions are in millimeters (tolerance : ±0.3) (3) Not to scale Rev0.4, December 22, 2017 18 www.seoulsemicon.com Pre-Product Data Sheet Packaging Specification S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Notes : (1) Heat Sealed after packing (Use Zipper Bag) (2) Quantity : 1Tray(20pcs) /Bag (3) Smallest packing quantity : 3Bags(60pcs) / small box Rev0.4, December 22, 2017 19 www.seoulsemicon.com Pre-Product Data Sheet S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Product Nomenclature Table 6. Part Numbering System Part Number Code Description Part Number Value X1 Company S Seoul Semiconductor X2 Level of Integration 4 COB X3X4 Technology SM SunLike X5X6X7X8 LES + Series and Parallel 1566 X9X10 CCT xx X11X12 CRI 97 X13X14 VF 36 X15X16X17 Characteristic code Flux Rank 0C5 X18X19X20 Characteristic code VF Rank 00H X21X22 Characteristic code Color Step 3S X23X24 Type 00 X25X26X27 Internal Code 001 Rev0.4, December 22, 2017 20 3-step ellipse www.seoulsemicon.com Pre-Product Data Sheet S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Handling of Silicone Resin for LED (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LED should only be handled from the side. By the way, this also applies to LED without a silicone sealant, since the surface can also become scratched. (3) Silicone differs from materials conventionally used for the manufacturing of LED. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of wire. (4) Seoul Semiconductor suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (5) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. (6) Avoid leaving fingerprints on silicone resin parts. Rev0.4, December 22, 2017 21 www.seoulsemicon.com Pre-Product Data Sheet Precaution for Use S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board (1) Storage To avoid the moisture penetration, we recommend storing LED in a dry box with a desiccant . The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%. (2) For manual soldering Seoul Semiconductor recommends the soldering condition (ZC series product is not adaptable to reflow process) a. Use lead-free soldering b. Soldering should be implemented using a soldering equipment at temperature lower than 350°C. c. Before proceeding the next step, product temperature must be stabilized at room temperature (3) Radioactive exposure is not considered for the products listed here in. (4) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (5) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (6) When the LED are in operation the maximum current should be decided after measuring the package temperature. (7) LED must be stored in a clean environment. We recommend LED store in nitrogen-filled container. (8) The appearance and specifications of the product may be modified for improvement without notice. (9 Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. (10) Attaching LED, do not use adhesive that outgas organic vapor. (11) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (12) Please do not touch any of the circuit board, components or terminals with bare hands or metal while circuit is electrically active. Rev0.4, December 22, 2017 22 www.seoulsemicon.com Pre-Product Data Sheet Precaution for Use S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures ca n penetrate silicone encapsulants of LED and discolor when exposed to heat and photonic energy. Th e result can be a significant loss of light output from the fixture. Knowledge of the properties of the mat erials selected to be used in the construction of fixtures can help prevent these issues. (14) LED are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LED may c ause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment) Rev0.4, December 22, 2017 23 www.seoulsemicon.com Pre-Product Data Sheet Precaution for Use S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires. - This damage usually appears due to the thermal stress produced during the EOS event. c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device Rev0.4, December 22, 2017 24 www.seoulsemicon.com Pre-Product Data Sheet Company Information S4SM-1566xx9736-0C500H3S-00001(SunLike COB) – Chip on Board Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LED) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LED. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LED, mid-power LED, side-view LED, and through-hole type LED as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. Rev0.4, December 22, 2017 25 www.seoulsemicon.com