SFT821N-BS

*Customer: SPECIFICATION Preliminary ITEM MODEL [Contents] Top View LED SSC-SFT821N-BS 1. Features ------------------------------------------------------------- 2 2. Application ------------------------------------------------------------- 2 3. Absolute Maximum Ratings ------------------------------------------ 2 4. Electro-optical Characteristics ---------------------------------------- 3 5. Rank of SFT821N-BS ---------------------------------------4 5 7 6. R ank of Color ------ - ------ ---- --- ------ ---- --- ------ ---- 7. Soldering Profile ---------------------------------------------------- 8. Outline Dimension ---------------------------------------------------- 8 9. Packing ----------------------------------------------------------------- 9 10. Reel Packing Structure ------------------------------------------11. L ot number - ------------------------ --------------- --------10 11 12. Precaution for Use --------------------------------------------------- 12 13. C haracterist ic Diagram - --------------------------------------- 1 3 14. Handling of Silicone Resin LEDs ---------------------------------------- 14 CUSTOMER Checked by Approved by SUPPLIER Drawn by Checked by Approved by SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT821N-S - 1/14 - 1. Features Pb-free Reflow Soldering application RoHS Compliant Package : white 4-Lead package (upper surface color : black) Suitable for all SMT assembly methods ESD-withstand voltage : up to 2 kV (MIL-STD-883D) Encapsulating Resin : soft silicone resin and diffused (Milky color) High Reliability (silicone resin) 2. Application LDM Indoor and outdoor displays LCD Backlights etc. R G B – displays Automotive Signage and Channel letter Indicator 3. Absolute Maximum Ratings *1 Parameter Forward Current Forward Peak Surge Current Reverse Voltage (per die) Power Dissipation Operating Temperature Storage Temperature *2 (Ta=25ºC) Symbol IF IFM VR Pd Topr Tstg Red 30 100 81*3 Value Green 30 100 5 120*3 263*4 -40 ~ +100 -40 ~ +100 Blue 30 100 114*3 Unit mA mA V mW ºC ºC *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. *3 The value for one LED device.(Single color) *4 The value for total power dissipation when two and more devices are lit simultaneously. SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT821N-S - 2/14 - 4. Electro-Optical Characteristics Parameter Forward Voltage Red Green Blue Red Green Blue Red Green Blue Red Green Blue Red Green Blue Red Green Blue R, G, B Symbol VF Condition IF =20mA IF =20mA IF =20mA VR=10V (per die) IF =20mA (per chip) IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA (per die) Min 1.8 3.0 3.0 620 520 455 Typ 2.1 3.2 3.2 700 1200 400 632 518 453 623 527 460 14 33 23 120 Max 2.3 3.53.51 1 1 1100 1600 560 625 535 465 - (Ta=25ºC) Unit V Reverse Current Luminance Intensity *1 IR µA IV mcd Peak Wavelength λP λd ∆λ 2 θ½ nm Dominant Wavelength nm Spectral Bandwidth Viewing Angle *3 nm deg. *1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2 Please refer to CIE 1931 chromaticity diagram *3 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC. SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT821N-S - 3/14 - 5. Rank of SFT821N-BS SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT821N-S - 4/14 - 6. Rank of Color 0.9 0.8 0.7 0.6 0.5 520 525 515 530 535 540 510 545 550 555 505 560 565 570 500 575 580 585 590 495 595 600 Green AB y 0.4 0.3 0.2 Red 610 620 630 830 490 485 480 Bluish White 0.1 475 2 0 Blue 47460 1 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 x SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT821N-S - 5/14 - 0.30 g 0.28 h f d b e 0.26 y c 0.24 0.22 a 0.20 0.22 0.24 0.26 0.28 0.30 x SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT821N-S - 6/14 - 7. Soldering Profile (1) Reflow Soldering Conditions / Profile (Lead Free Solder) Temp [°C] Tm : Reflow machine setting temp (max 30 sec.) Ts : Surface temp of PCB (max) Ts : Surface temp of PCB (recommend) Ts : Surface temp of PCB (min) 260 240 220 200 180 150 ~ Pre-heating Rising 5 °C/sec Cooling -5 °C/sec 0 Time [Hr] (2) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (3) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT821N-S - 7/14 - 8. Outline Dimension And Material * MATERIALS Package Outlines MATERIALS Heat-Resistant Polymer Silicone Resin (Soft) Ag Plating Copper Alloy Encapsulating Resin Electrodes BlacPARTS k Surfacekage 4 3 Pac Package Marking (Cathode ) 1 2 Front View Right View Rear View ( Tolerance: ±0.2, Unit: mm ) Circuit Diagram Common Anode 4 Red Cat hode 3 Recommended Solder Pad 1 2 Green Cat hode Blue Cat hode * MATERIALS PARTS Package Package upper surface color Encapsulating Resin Electrodes SSC-QP-7-03-08(REV.00) MATERIALS Heat-Resistant Polymer Black Soft Silicone Resin (Diffused) Ag Plating Copper Alloy SSC-SFT821N-S SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 8/14 - 9. Packing 1.55 ± 0.05 Package Marking 8±0.1 3.5±0.1 1.75±0.1 2.0±0.05 4.0±0.1 0.22±0.05 5° 1.0±0.1 3.1±0.1 2.22±0.1 8° 11.4 ± 0.1 180 +0 -3 2.0 ± 0.2 3.83±0.1 LABLE 13 ±0.2 9.0 ± 0.3 30° 10 22 60 ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : 2000 pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT821N-S - 9/14 - 10. Reel Packing Structure Reel XXXX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXX SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag XXXX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXX SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE XXXX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX RoHS c 1 PART NUMBER : XXXXXX b SEOUL SEMICONDUCTOR CO., LTD. a SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT821N-S - 10/14 - 11. Lot Number The lot number is composed of the following characters; SFT○□□◎◎ # ~ # SFT 　First Part Name ○ 　 Year (6 for 2006, 7 for 2007, 8 for 2008 ) □□ 　 Month ( 01 for Jan., 02 for Feb.,‥‥‥11 for Nov., 12 for Dec.) ◎◎ 　 Day ( 01, 02, 03, 04, ‥‥‥‥‥‥28, 29, 30, 31.) # ~# 　 The number of the internal quality control XXX QUANTITY : 700 LOT NUMBER : SFT70426 01 512 PART NUMBER : SFT821N-BS SEOUL SEMICONDUCTOR CO., LTD. SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT821N-S - 11/14 - 12. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT821N-S - 12/14 - 13. Characteristic Diagram Forward Current vs. Forward Voltage (TA=25ºC) 100 Relative Luminous Intensity vs. Forward Current 6 (TA=25ºC) 50 Blue Red Green Relative Luminosity (a.u.) 5 RED BLUE GREEN Forward Current IFP [mA] 4 20 10 3 5 2 1 0 1 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8 0 20 40 60 80 100 120 Forward Voltage VF [V] Forward Current IFP [mA] Forward Current Derating Curve Radiation Diagram (TA=25ºC) Red, Green, Blue 1 CHIP ON 30 Forward Current IF [mA] 0 3 CHIP ON 20 -30 30 10 -60 60 0 0 20 40 60 80 100 -90 90 Ambient Temperature Ta [ºC] SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT821N-S - 13/14 - 14. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT821N-S - 14/14 -