SSC-FR104

*Customer: SPECIFICATION ITEM MODEL Revision NO. CHIP LED DEVICE SSC-FR104-II1 Rev5.2 (060504) [Contents] 1. Features 2. Absolute maximum ratings 3. Electro-optical characteristics 4. Characteristic diagram 5. Soldering profile 6. Outline dimension 7. Packing 8. Reel packing structure 9. Precaution for use Pb Free Customer Approved by Approved by Approved by Supplier Drawn by Checked by Approved by SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 S Semiconductor Seoul SC-FR104-II1 - 1/7 - 1. Features Package : 1.6×0.8×0.4 mm Untinted, Diffused flat mold Wavelength : 625 nm 2. Absolute Maximum Ratings Parameter Power Dissipation Forward Current Peak Forward Current*1 Reverse Voltage Operating Temperature Storage Temperature Symbol Pd IF IFM VR Topr Tstg Value 69 30 50 5 -30 ~ 85 -40 ~ 100 (Ta=25℃) Unit ㎽ ㎃ ㎃ V ℃ ℃ *1 IFM conditions: Pulse width Tw≤ 0.1ms and Duty ratio≤ 1/10 3. Electro-Optical Characteristics Parameter Forward Voltage Reverse Current Luminous Intensity*2 Wavelength Spectral Bandwidth Viewing angle*3 Symbol VF IR IV λ D (Ta=25℃) Condition IF=5㎃ VR=5V IF=5㎃ IF=20㎃ IF=20㎃ IF=5㎃ Min 1.8 16 619 Typ 1.95 28 625 30 120 Max 2.30 10 44 629 Unit V ㎂ mcd ㎚ ㎚ ˚ Δλ 2θ 1/2 *2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *3 θ 1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity. [Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 5, 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC. (Tolerance : Iv ±10 %, λD ±2 nm, VF ±0.1 V) SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 SSC-FR104-II1 - 2/7 - 4. Characteristic Diagrams Forward Current vs Forward Voltage 100 Luminous Intensity vs Forward Current 1000 Luminous Intensity IV(%) Forward Current IF(mA) 10 100 1 10 0.1 1.6 1.8 2.0 2.2 2.4 1 0.1 1 10 100 Forward Voltage VF(V) Forward Current IF(mA) Forward Current Derating Curve Radiation Diagram 50 40 Forward current IF(mA) 30 20 10 0 -25 0 25 50 75 100 Ambient temperature Ta(? ) SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 SSC-FR104-II1 - 3/7 - 5. Soldering Profile (1) Reflow Soldering Conditions / Profile Preliminary heating to be at 150℃max. for 2 minutes max. Soldering heat to be at 230 ± 5℃max. for 5 seconds max. LED Surface temperature LED Surface temperature °C Operation heating 230 150 ~ 120 Pre-heating Temperature rise: 5°C/sec. Cooling: -5°C/sec. Relative Spectral Emission 0 60 to 120 sec. 5sec. max (2) Reflow Soldering Conditions /Lead-Free Solder Preliminary heating to be at 150℃max. for 2 minutes max. Soldering heat to be at 255℃(+5/-0)℃max. for 10 seconds max. °C O p eratio n h ea tin g 255 (+ 5) 150 ~ 120 0 Pre-heatin g Tem p eratu re ris e: 5 °C /s ec. Coolin g : -5 ° C / s e c . 60 t o 1 20 s ec. 5 to 1 0 s ec . (3) Hand Soldering conditions Not more than 3 seconds @MAX280℃, under Soldering iron. [Note] In case the soldered products are reused in soldering process, we don’t guarantee the products. SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 SSC-FR104-II1 - 4/7 - 6. Outline Dimension Tolerance: ±0.1, 0.3 (0.13) Resin 1.1 0.8 1.6 1.2 2.4 Unit: ㎜ PCB 0.3 0.8 0.4 ±0.05 0.8 [Recommended Solder Pattern] 7. Packing 1.5 +0.1 -0 ±0.05 1.85 ±0.05 1.75 2.0 ±0.05 ±0.1 4.0 ±0.1 0.2 ±0.05 3.5 (2.75) 4.0 ±0.1 0.5 ±0.08 0.95 ±0.05 8.0 ±0.2 0.5 ±0.05 180 +0 -3 11.4 9 ±0.3 2 ±0.2 +0.2 -0 22 13 ±0.2 Label 60 Tolerance: ±0.2, Unit: ㎜ (1) Quantity : 4,000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at 10˚ angle to be the carrier tape. (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package. SSC-FR104-II1 SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 - 5/7 - 8. Reel Packing Structure Reel P/N : ########## 제품명 SSC-FR104-II1 ### Lot No ########## 수량: 4000 Aluminum Vinyl Bag P/N : ########## 제품명 SSC-FR104-II1 ### Lot No ########## 수량: 4000 Outer Box *Material: Paper(SW3B(B)) a 7inch 245 c CHIP LED PART : SSC-FR104-II1 CODE : Q'YT : 40,000EA TYPE SIZE(mm) b 220 c 142 CHIP LED b a LOT NO : DATE : SEOUL SEMICONDUCTOR CO.,LTD SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 SSC-FR104-II1 - 6/7 - 9. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in the dry box (or desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5℃~30℃ (2) Attention after opened However LED is corresponded SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. After opened and mounted, the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40℃ components shall be dried 10-12hr. at 60±5℃. (4) In case of supposed the components is humid, shall be dried dip-solder just before. 100Hr at 80±5℃ or 12Hr at 100±5℃. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. (6) Quick cooling shall not be avoid. (7) Components shall not be mounted on warped direction of PCB. (8) Anti radioactive ray design is not considered for the products listed here in. (9) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or smashed in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed. (10) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA should be used. (11) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (12) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (13) The LEDs must be soldered within seven days after opening the moisture-proof packing. (14) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (15) The appearance and specifications of the product may be modified for improvement without notice. Humidity : less than 30% (3) In case of more than 1 week passed after opening or change color of indicator on desiccant Humidity : 60%HR max. SSC-QP-0401-06(REV.0) SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 SSC-FR104-II1 - 7/7 -