SSC-HBMGFRT821

*Customer: SPECIFICATION ITEM MODEL TOP LED DEVICE SSC-HBMGFRT821 [Contents] 1. Features ------------------------------------------------------------- 2 2. Application ------------------------------------------------------------- 2 3. Absolute Maximum Ratings ------------------------------------------ 2 4. Electro-optical Characteristics ---------------------------------------- 3 5. Rank of HBMGFRT821 7. Soldering Profile 9. Packing ---------------------------------------4 6. W hite bala nce Color R ank-------- -------------- -------------- -5 ---------------------------------------------------- 6 8 10 8. Outline Dimension And Material -------------------------------------- 7 --------------------------------------------------------------- -------- - ----------- ---- ----------- ---- ------10. Reel Packing Structure ------------------------------------------------- 9 11. L ot N u m b er 12. Precaution for Use --------------------------------------------------- 11 13. C haracterist ic Diagram - --- --- --- --- -- ---- --- --- --- -- ---- --- --- 1 2 CUSTOMER Checked by Approved by SUPPLIER Drawn by Checked by Approved by SSC-QP-0401-06 (REV.03) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT821 - 1/12 - 1. Features Pb-free Reflow Soldering application RoHS Compliant Material : InGaN(Blue) / InGaN(Green) / AlInGaP(Red) 6-Pin (R,G,B separate) type Suitable for all SMT assembly methods ; Suitable for all soldering methods White colored SMT package and colorless clear window 2. Application Indoor and outdoor displays LCD Backlights etc. R G B – displays Indicator 3. Absolute Maximum Ratings *1 Parameter Forward Current Forward Peak Surge Current Reverse Voltage (per die) Power Dissipation Operating Temperature Storage Temperature *2 (Ta=25ºC) Symbol IF IFM VR Pd Topr Tstg Red 30 100 81 *3 Value Y/Green 30 100 5 120 263 *3 Blue 30 100 114 *3 Unit mA mA V *4 mW ºC ºC -40 ~ +100 -40 ~ +100 *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. *3 The value for one LED device.(Single color) *4 The value for total power dissipation when two and more devices are lit simultaneously. SSC-QP-0401-06 (REV.03) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT821 - 2/12 - 4. Electro-Optical Characteristics Parameter Forward Voltage Red Green Blue Red Green Blue Red Green Blue Red Green Blue Red Green Blue Red Green Blue R, G, B Symbol VF Condition IF =12mA IF =20mA IF =20mA VR=5V IF =12mA IF =20mA IF =20mA IF =12mA IF =20mA IF =20mA IF =12mA IF =20mA IF =20mA IF =12mA IF =20mA IF =20mA IF =52mA Total Min 1.7 2.8 2.8 130 300 60 618 519 464 Typ 1.9 3.3 3.3 240 500 165 632 520 459 625 527 470 20 35 26 120 Max 2.6 4.1 4.0 10 10 10 350 700 270 632 537 477 - (Ta=25ºC) Unit V Reverse Current IR IV µA Luminance Intensity *1 mcd Peak Wavelength λP λd ∆λ 2 θ½ nm Dominant Wavelength nm Spectral Bandwidth Viewing Angle *2 nm deg. *1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC. SSC-QP-0401-06 (REV.03) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT821 - 3/12 - 5. Rank of HBMGFRT821 ▣ Rank Name X2 X1 W rank Total Iv ▣ Luminous Intensity Rank Total Iv Name MIN MAX 1 600 800 2 800 1000 3 1000 1200 WHITE RANK a b c d e f g h x1 y1 0.24 0.31 0.24 0.250 0.265 0.338 0.265 0.283 0.29 0.370 0.29 0.315 0.315 0.400 0.315 0.345 White Color Coordinates x2 x3 y2 y3 0.24 0.265 0.250 0.283 0.24 0.265 0.195 0.228 0.265 0.29 0.283 0.315 0.265 0.29 0.228 0.260 0.29 0.315 0.315 0.345 0.29 0.315 0.260 0.290 0.315 0.34 0.345 0.370 0.315 0.34 0.290 0.315 x4 y4 0.265 0.338 0.265 0.283 0.29 0.370 0.29 0.315 0.315 0.400 0.315 0.345 0.34 0.425 0.34 0.370 SSC-HBMGFRT821 SSC-QP-0401-06 (REV.03) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 4/12 - 6. Color Coordinates 0.9 0.8 0.7 505 515 510 520 525 530 535 540 545 550 555 560 565 500 570 575 580 585 590 595 600 610 620 630 830 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 495 a 490 c d g y 485 480 475 470 460 b e f h 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 x SSC-QP-0401-06 (REV.03) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT821 - 5/12 - 7. Soldering Profile (1) Reflow Soldering Conditions / Profile (Lead Free Solder) Temp [°C] Tm : Reflow machine setting temp (max 30 sec.) Ts : Surface temp of PCB (max) Ts : Surface temp of PCB (recommend) Ts : Surface temp of PCB (min) 260 240 220 200 180 150 ~ Pre-heating Rising 5 °C/sec Cooling -5 °C/sec 0 Time [Hr] (2) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. SSC-QP-0401-06 (REV.03) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT821 - 6/12 - 8. Outline Dimension And Material Package Outlines 43 Package Marking (Cathode) 1 2 Front View Circuit Diagram Common Anode 4 Red Cathode 3 Right View Rear View ( Tolerance: ±0.2, Unit: mm ) Recommended Solder Pad 1 2 Green Cathode Blue Cathode * MATERIALS PARTS Package Encapsulating Resin Electrodes MATERIALS Heat-Resistant Polymer Epoxy Resin Ag Plating Copper Alloy SSC-QP-0401-06 (REV.03) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT821 - 7/12 - 9. Packing Package Marking 8±0.1 3.5±0.1 1.75±0.1 2.0±0.05 4.0±0.1 1.55 ± 0.05 0.22±0.05 5° 1.0±0.1 3.1±0.1 2.22±0.1 8° 11.4 ± 0.1 180 +0 -3 2.0 ± 0.2 3.83±0.1 LABLE 13 ±0.2 9.0 ± 0.3 30° 10 22 60 ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : 2000 pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package SSC-HBMGFRT821 SSC-QP-0401-06 (REV.03) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 8/12 - 10. Reel Packing Structure Reel X or XX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag X or XX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE X or XX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. c 1 TOP LED RoHS b a SSC-QP-0401-06 (REV.03) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT821 - 9/12 - 11. Lot Number The lot number is composed of the following characters; HBM○□□◎◎ # ~ # HBM 　First Part Name ○　 Year (6 for 2006, 7 for 2007, 8 for 2008 ) □□ 　 Month ( 01 for Jan., 02 for Feb.,‥‥‥11 for Nov., 12 for Dec.) ◎◎ 　 Day ( 01, 02, 03, 04, ‥‥‥‥‥‥28, 29, 30, 31.) # ~# 　 The number of the internal quality control X or XX QUANTITY : 2000 LOT NUMBER : HBMGFRT70322 01 512 PART NUMBER : HBMGFRT821 SEOUL SEMICONDUCTOR CO., LTD. SSC-QP-0401-06 (REV.03) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT821 - 10/12 - 12. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. SSC-QP-0401-06 (REV.03) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT821 - 11/12 - 13. Characteristic Diagram Forward Current vs. Forward Voltage (TA=25ºC) Relative Luminous Intensity vs. Forward Current (TA=25ºC) Relative Luminous Intensity IV / IV (20mA) [Rel.] 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 5 10 15 20 25 30 35 Forward Current IF [mA] Red Green Blue R ed B lu e G re e n 10 1 .5 1 .8 2 .1 2 .4 2 .7 3 .0 3 .3 3 .6 3 .9 4 .2 Forward Voltage VF [V] Forward Current IF [mA] Forward Current Derating Curve Radiation Diagram (TA=25ºC) 1 CHIP ON 30 Red, Green, Blue Forward Current IF [mA] 0 3 CHIP ON 20 -30 30 10 -60 60 0 0 20 40 60 80 100 -90 90 Ambient Temperature Ta [ºC] SSC-QP-0401-06 (REV.03) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT821 - 12/12 -