SSC-HBMGFRT825

*Customer: SPECIFICATION ITEM MODEL 1. Features TOP LED DEVICE SSC-HBMGFRT825 [Contents] ------------------------------------------------------------- 2 2. Application ------------------------------------------------------------- 2 3. Absolute Maximum Ratings ------------------------------------------ 2 4. Electro-optical Characteristics ---------------------------------------- 3 5. Rank of HBMGFRT825 ---------------------------------------4 6. W hite bala nce Color R ank-------- -------------- -------------- -5 7. Rank Name Table ---------------------------------------------------- 7 8. Soldering Profile 10. Packing ---------------------------------------------------- 8 -------------------------------------- 9 10 12 9. Outline Dimension And Material --------------------------------------------------------------- -------- - ----------- ---- ----------- ---- ------- 11. Reel Packing Structure ------------------------------------------------- 11 12. L ot N u m b er 13. Precaution for Use --------------------------------------------------- 13 14. C haracterist ic Diagram - --------------------------------------- 1 4 CUSTOMER Checked by Approved by SUPPLIER Drawn by Checked by Approved by SSC-QP-0401-06(REV.22) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT825 - 1/12 - 1. Features Pb-free Reflow Soldering application RoHS Compliant Material : InGaN(Blue) / InGaN(Green) / AlInGaP(Red) 6-Pin (R,G,B separate) type Suitable for all SMT assembly methods ; Suitable for all soldering methods Encapsulating Resin : Epoxy Resin White colored SMT package and colorless clear window 2. Application Full Color Display Indoor and outdoor displays LCD Backlights etc. Indicator 3. Absolute Maximum Ratings *1 Parameter Forward Current Forward Peak Surge Current Reverse Voltage (per die) Power Dissipation Operating Temperature Storage Temperature *2 (Ta=25ºC) Symbol IF IFM VR Pd Topr Tstg Red 30 100 81 *3 Value Green 30 100 5 120 263 *3 Blue 30 100 120 *3 Unit mA mA V *4 mW ºC ºC -40 ~ +100 -40 ~ +100 *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. *3 The value for one LED device.(Single color) *4 The value for total power dissipation when two and more devices are lit simultaneously. SSC-QP-0401-06(REV.22) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT825 - 2/12 - 4. Electro-Optical Characteristics Parameter Forward Voltage Red Green Blue Red Green Blue Red Green Blue Red Green Blue Red Green Blue Red Green Blue R, G, B Symbol VF Condition IF =20mA IF =20mA IF =20mA VR=5V (per die) IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA (per die) Min 1.8 2.8 2.8 120 270 85 623 520 465 Typ 2.25 3.3 3.3 275 578 188 640 521 464 630 528 470 20 35 26 120 Max 2.7 4.0 3.8 10 10 10 430 880 290 636 537 477 - (Ta=25ºC) Unit V Reverse Current Luminance Intensity *1 IR IV µA mcd Peak Wavelength λP λd ∆λ 2 θ½ nm Dominant Wavelength nm Spectral Bandwidth Viewing Angle *2 nm deg. *1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC. SSC-QP-0401-06(REV.22) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT825 - 3/12 - 5. Rank of HBMGFRT825 1) Special binning (White balance) X1 VF X2 Iv X3 Iv X4 λd X5 W-Color Rank 2) General binning (RGB balance binning) X1 VF X2 Iv X3 Iv X4 λd ▣ Luminous Intensity [Iv] Rank R Name MIN MAX N 120 185 O 185 280 P 280 430 Mix Rank Name NN OO PP NO R N O P O N N N O O P O O O P P G N O P N O N O N O O P O P O P Rank Name N O P B N O P N N O O O N O O P P P O G MIN 270 400 600 MAX 400 600 880 Mix Rank Name NP Rank Name N O P R P N N N P P N P O B MIN 85 125 190 G N P N P N P O N P MAX 125 190 290 B N N P P P N P O N Rank Name TN TO TP Total Iv MIN MAX 475 710 710 1070 1070 1600 PN ON XX OP PO ▣ Dominant Wavelength [λd] Rank R Name MIN MAX 620 635 A 620 635 B C 620 635 ▣ Forward Voltage Rank Name MIN 1 2.0 2 1.8 G MIN 520 530 520 MAX 527 537 537 MIN 467.5 472.5 465 B MAX 472 477 477 R MAX 2.5 2.7 MIN 3.1 2.8 G MAX 3.6 4.0 MIN 3.1 2.8 B MAX 3.5 3.8 SSC-QP-0401-06(REV.22) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT825 - 4/12 - 6. White balance Color Rank ◈ Color Group : Natural White - Color Coordinates (typ.): x 0.31 , y 0.32 - IF Condition = 15mA for Red / 20mA for Green / 8mA for Blue - Color Rank : a, b, c, d, e, f, g, h, i (9 BIN) *1Bin Cell Size : x0.03, y0.036 *9Bin Total Cell Size : x0.09, y0.108 0.38 0.36 0.34 0.32 0.30 0.28 0.26 0.26 ghi ed f c ab 0.28 0.30 0.32 0.34 0.36 y x a x 0.265 0.295 0.295 0.265 f x 0.265 0.295 0.295 0.265 y 0.298 0.304 0.334 0.328 x 0.265 0.295 0.295 0.265 y 0.268 0.274 0.304 0.298 x 0.295 0.325 0.325 0.295 b y 0.274 0.280 0.310 0.304 g y 0.328 0.334 0.364 0.358 x 0.295 0.325 0.325 0.295 x 0.325 0.355 0.355 0.325 c y 0.280 0.286 0.316 0.310 h y 0.334 0.340 0.370 0.364 x 0.325 0.355 0.355 0.325 x 0.325 0.355 0.355 0.325 d y 0.310 0.316 0.346 0.340 i y 0.340 0.346 0.376 0.370 x 0.295 0.325 0.325 0.295 e y 0.304 0.310 0.340 0.334 SSC-QP-0401-06(REV.22) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT825 - 5/12 - 0.9 0.8 0.7 505 520 525 515 530 510 535 540 545 550 555 560 565 570 575 580 585 590 595 600 610 620 630 830 0.6 500 0.5 y 0.4 0.3 0.2 0.1 0.0 0.0 495 490 485 480 475 470 460 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 x SSC-QP-0401-06(REV.22) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT825 - 6/12 - 7. Rank Name Table 1) Special binning (White balance) X1 Mix VF Label Name 1 2 3 4 5 6 7 8 9 X2 Mix Iv Rank Name 1TNCa 1TNCb 1TNCc 1TNCd 1TNCe 1TNCf 1TNCg 1TNCh 1TNCi X3 Mix Iv Label Name 10 11 12 13 14 15 16 17 18 X4 Mix λd Rank Name 1TOCa 1TOCb 1TOCc 1TOCd 1TOCe 1TOCf 1TOCg 1TOCh 1TOCi X5 W-Color Rank Label Name 19 20 21 22 23 24 25 26 27 Rank Name 1TPCa 1TPCb 1TPCc 1TPCd 1TPCe 1TPCf 1TPCg 1TPCh 1TPCi 2) General binning (RGB balance binning) X1 Mix VF Label Name 28 29 30 31 32 33 34 35 36 37 X2 Mix Iv Rank Name 2NNA 2OOA 2PPA 2NOA 2ONA 2OPA 2POA 2NPA 2PNA 2XXA X3 Mix Iv Label Name 38 39 40 41 42 43 44 45 46 47 X4 Mix λd Rank Name 2NNB 2OOB 2PPB 2NOB 2ONB 2OPB 2POB 2NPB 2PNB 2XXB Label Name 48 49 50 51 52 53 54 55 56 57 Rank Name 2NNC 2OOC 2PPC 2NOC 2ONC 2OPC 2POC 2NPC 2PNC 2XXC SSC-QP-0401-06(REV.22) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT825 - 7/12 - 8. Soldering Profile (1) Reflow Soldering Conditions / Profile (Lead Free Solder) Temp [°C] Tm : Reflow machine setting temp (max 30 sec.) Ts : Surface temp of PCB (max) Ts : Surface temp of PCB (recommend) Ts : Surface temp of PCB (min) 260 240 220 200 180 150 ~ Pre-heating Rising 5 °C/sec Cooling -5 °C/sec 0 Time [Hr] (2) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. SSC-QP-0401-06(REV.22) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT825 - 8/12 - 9. Outline Dimension And Material ( Tolerance: ±0.2, Unit: mm ) * MATERIALS PARTS Package Encapsulating Resin Electrodes MATERIALS Heat-Resistant Polymer Epoxy Resin Ag Plating Copper Alloy SSC-QP-0401-06(REV.22) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT825 - 9/12 - 10. Packing Package Marking 2.0±0.05 MA X.5 3.7±0.1 1.7±0.1 2.9±0.1 MA X.5 4±0.1 11.4 ± 0.1 180 +0 -3 2.0 ± 0.2 LABLE 13 ±0.2 9.0 ± 0.3 30° 10 22 (1) Quantity : 2000 pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm 60 ( Tolerance: ±0.2, Unit: mm ) (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package SSC-QP-0401-06(REV.22) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT825 - 10/12 - 11. Reel Packing Structure Reel X or XX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag X or XX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE X or XX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. c 1 TOP LED RoHS b a SSC-QP-0401-06(REV.22) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT825 - 11/12 - 12. Lot Number The lot number is composed of the following characters; HBMGFRT○□□◎◎ # ~ # HBMGFRT 　First Part Name ○　 Year (6 for 2006, 7 for 2007, 8 for 2008 ) □□ 　 Month ( 01 for Jan., 02 for Feb.,‥‥‥11 for Nov., 12 for Dec.) ◎◎ 　 Day ( 01, 02, 03, 04, ‥‥‥‥‥‥28, 29, 30, 31.) # ~# 　 The number of the internal quality control X or XX QUANTITY : 2000 LOT NUMBER : HBMGFRT70322 01 512 PART NUMBER : HBMGFRT825 SEOUL SEMICONDUCTOR CO., LTD. SSC-QP-0401-06(REV.22) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT825 - 12/12 - 13. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. SSC-QP-0401-06(REV.22) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT825 - 13/12 - 14. Characteristic Diagram Relative Luminous Intensity vs. Forward Current (TA=25ºC) Forward Current vs. Forward Voltage (TA=25ºC) Relative Luminous Intensity IV / IV (20mA) [Rel.] 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 IF [mA] B lu e R ed G re e n Forward Current Red Green Blue 10 1 .5 1 .8 2 .1 2 .4 2 .7 3 .0 3 .3 3 .6 3 .9 4 .2 0 5 10 15 20 25 30 35 Forward Voltage VF [V] Forward Current IF [mA] Ambient Temperature vs. Power Dissipation Radiation Diagram (TA=25ºC) 1 CHIP ON 30 Red, Green, Blue IF [mA] 0 3 CHIP ON 20 -30 30 Forward Current -60 10 60 0 -40 0 40 80 -90 90 Ambient Temperature Ta [ºC] SSC-QP-0401-06(REV.22) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HBMGFRT825 - 14/12 -