SSC-HYT7423

*Customer: SPECIFICATION ITEM MODEL TOP LED DEVICE SSC-HYT722 [Contents] 1. Features ------------------------------------------------------------- 2 2. Application ------------------------------------------------------------- 2 3. Absolute Maximum Ratings ------------------------------------------ 2 4. Electro-optical Characteristics ---------------------------------------- 3 5. R ank of H YT722 6. Soldering Profile 8. Packing - -- --------- ----- --------- ----- --------- -4 ---------------------------------------------------- 5 -------------------------------------- 6 7 9 7. Outline Dimension And Material -------------------------------------------------------------- -- -- --- - --- -- --- -- -- -- --- -- --- -- -- -- --- -- --- -- - 9. Reel Packing Structure ------------------------------------------------- 8 10. L ot N u mber 11. Precaution for Use --------------------------------------------------- 10 12. C haracteristic Diagram - --------------------------------------- 11 CUSTOMER Checked by Approved by SUPPLIER Drawn by Checked by Approved by SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HYT722 - 1/11 - 1. Features Pb-free Reflow Soldering application RoHS Compliant Material : AlInGaP Suitable for all SMT assembly methods ; Suitable for all soldering methods White colored SMT package and colorless clear window Encapsulating Resin : Epoxy Resin 2. Application Indoor and outdoor displays LCD Backlights etc. Yellow – displays Automotive Signage and Channel letter Indicator 3. Absolute Maximum Ratings *1 Parameter Power Dissipation Forward Current Forward Peak Surge Current (per die) Reverse Voltage (per die) Operating Temperature Storage Temperature Symbol Pd IF IFM VR Topr Tstg *2 (Ta=25ºC) Value 252 90 100 5 -30 ~ +85 -40 ~ +100 Unit mW mA mA V ºC ºC *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HYT722 - 2/11 - 4. Electro-Optical Characteristics Parameter Forward Voltage (per die) Reverse Current (per die) Luminance Intensity *1 Luminance Flux Dominant Wavelength Peak Wavelength Spectral Bandwidth Viewing Angle *2 Optical Efficiency Symbol VF IR IV ΦV Condition IF =20 mA VR=5V IF =60 mA IF =60 mA IF =60 mA IF =60mA IF =60 mA IF =60 mA IF =60 mA Min 1.6 950 582 Typ 2.2 1400 4 590 593 18 120 30 Max 2.8 10 1700 598 - (Ta=25ºC) Unit V µA mcd lm nm nm nm deg lm/W λd λP ∆λ 2 θ½ η opt *1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10%. *2 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC. SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HYT722 - 3/11 - 5. Rank of HYT722 ▣ Rank Name Table X1 Iv ▣ L u mi no u s Rank Name N O P X2 λd X3 Vf Inte n si ty [ Iv ] Iv (mcd) MIN M AX 950 1150 1150 1400 1400 1700 ▣ Do minant Wav e le ng th [λd] Rank λd (nm) Name MIN M AX 582 586 A B 586 594 C 594 598 ▣ Fo rward Vo ltag e Vf (V) Rank Name MIN M AX 1 1 .6 2 .0 2 2 .0 2 .4 3 2 .4 2 .8 SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HYT722 - 4/11 - 6.Soldering Profile (1) Reflow Soldering Conditions / Profile (Lead Free Solder) Temp [°C] Tm : Reflow machine setting temp (max 30 sec.) Ts : Surface temp of PCB (max) Ts : Surface temp of PCB (recommend) Ts : Surface temp of PCB (min) 260 240 220 200 180 150 ~ Pre-heating Rising 5 °C/sec Cooling -5 °C/sec 0 Time [Hr] (2) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HYT722 - 5/11 - 7. Outline Dimension And Material Package Outlines 6 5 4 Package Marking (Anode) 1 2 3 Front View Right View Rear View ( Tolerance: ±0.2, Unit: mm ) C ircuit D iagram Yellow C athode 6 Recommended Solder Pad Yellow Cathode 5 Yellow Cathode 4 Y1 1 Y2 2 Y3 3 Yellow A node Yellow A node Yellow A node * MATERIALS PARTS Package Encapsulating Resin Electrodes MATERIALS Heat-Resistant Polymer Epoxy Resin Ag Plating Copper Alloy SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HYT722 - 6/11 - 8. Packing Package Marking ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : 700pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package SSC-HYT722 SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 7/11 - 9. Reel Packing Structure Reel XXX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag XXX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE XXX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. c 1 TOP LED RoHS b a SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HYT722 - 8/11 - 10. Lot Number The lot number is composed of the following characters; HYT○□□◎◎ # ~ # HYT 　First Part Name ○　 Year (6 for 2006, 7 for 2007, 8 for 2008 ) □□ 　 Month ( 01 for Jan., 02 for Feb.,‥‥‥11 for Nov., 12 for Dec.) ◎◎ 　 Day ( 01, 02, 03, 04, ‥‥‥‥‥‥28, 29, 30, 31.) # ~# 　 The number of the internal quality control XXX QUANTITY : 700 LOT NUMBER : HYT70426 01 512 PART NUMBER : HYT722 SEOUL SEMICONDUCTOR CO., LTD. SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HYT722 - 9/11 - 11. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HYT722 - 10/11 - 12. Characteristic Diagram Forward Current vs Forward Voltage (per die) (Ta=25ºC) 6 Relative Luminous Intensity vs Forward Current (Total) Relative Luminous Intensity IV/IV(25oC)[a.u.] (Ta=25ºC) 100 50 5 Forward Current IF[mA] 4 20 3 10 5 2 1 1 1.6 0 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 0 Forward Voltage VF[V] 30 (10) 60 (20) 90 (30) 120 (40) 150 (50) 180 (60) 210 (70) 240 (80) 270 300 < total (90) (100)< per die Forward Current IF[mA] Forward Current Derating Curve (per die) 40 Radiation Diagram (TA=25ºC) 3 Chip ON 0 30 Foward Current IF[mA] -30 30 20 -60 10 60 0 -90 0 20 40 60 o 90 80 100 Ambient Temperature TA[ C] SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-HYT722 - 11/11 -