*Customer:
SPECIFICATION
ITEM MODEL TOP LED DEVICE SSC-MGT722
[Contents]
1. Features
------------------------------------------------------------- 2
2. Application ------------------------------------------------------------- 2 3. Absolute Maximum Ratings ------------------------------------------ 2 4. Electro-optical Characteristics ---------------------------------------- 3 5. R ank of M G T722 6. Soldering Profile 8. Packing ---------- ------------------- ------------4 ---------------------------------------------------- 5 -------------------------------------- 6 7 9
7. Outline Dimension And Material
-------------------------------------------------------------- -- -- --- - --- -- --- -- -- -- --- -- --- -- -- -- --- -- --- -- -
9. Reel Packing Structure ------------------------------------------------- 8 10. L ot N u mber 11. Precaution for Use --------------------------------------------------- 10 12. C haracteristic Diagram - --------------------------------------- 11
CUSTOMER Checked by Approved by
SUPPLIER Drawn by Checked by Approved by
SSC-QP-7-03-08(REV.07)
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6
SSC-MGT722
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1. Features
Pb-free Reflow Soldering application RoHS Compliant Material : InGaN Suitable for all SMT assembly methods ; Suitable for all soldering methods White colored SMT package and colorless clear window Encapsulating Resin : Epoxy Resin
2. Application
Indoor and outdoor displays LCD Backlights etc. Green – displays Automotive Signage and Channel letter Indicator
3. Absolute Maximum Ratings *1
Parameter Power Dissipation Forward Current Forward Peak Surge Current (per die) Reverse Voltage (per die) Operating Temperature Storage Temperature Symbol Pd IF IFM VR Topr Tstg
*2
(Ta=25ºC)
Value 369 90 100 5 -30 ~ +85 -40 ~ +100
Unit mW mA mA V ºC ºC
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio.
SSC-QP-7-03-08(REV.07)
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6
SSC-MGT722
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4. Electro-Optical Characteristics
Parameter Forward Voltage (per die) Reverse Current (per die) Luminance Intensity *1 Dominant Wavelength
Peak Wavelength
(Ta=25ºC)
Symbol VF IR IV
Condition IF =20 mA VR=5V IF =60 mA IF =60 mA
IF =60mA
Min 2.7 519
-
Typ 3.3 1800 527
520
Max 4.1 10 537
-
Unit V µA mcd nm
nm
λd
λP
Spectral Bandwidth Viewing Angle *2
∆λ
2 θ½
IF =60 mA IF =60 mA
-
20 120
-
nm deg
*1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10%. *2 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC.
SSC-QP-7-03-08(REV.07)
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6
SSC-MGT722
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5. Rank of MGT722
▣ Rank Name Table X1 Iv X2 λd X3 Vf
▣ Luminous Intensity [Iv] Rank Iv (mcd) Name MIN MAX N 1000 1600 O 1600 2000 P 2000 2500 ▣ Dominant Wavelength [λd] Rank λd (nm) Name MIN MAX 519 525 A 525 531 B C 531 537 ▣ Forward Voltage Rank Name 1 2 3 Vf (V) MIN 2.7 3.1 3.6 MAX 3.1 3.6 4.1
SSC-QP-7-03-08(REV.07)
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6
SSC-MGT722
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6.Soldering Profile (1) Reflow Soldering Conditions / Profile (Lead Free Solder)
Temp [°C]
Tm : Reflow machine setting temp (max 30 sec.) Ts : Surface temp of PCB (max) Ts : Surface temp of PCB (recommend) Ts : Surface temp of PCB (min)
260 240 220 200
180 150 ~
Pre-heating
Rising 5 °C/sec
Cooling -5 °C/sec
0 Time [Hr]
(2) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
SSC-QP-7-03-08(REV.07)
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6
SSC-MGT722
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7. Outline Dimension And Material
Package Outlines
6
5
4
Package Marking (Cathode)
1 2 3 Front View
Right View
Rear View
( Tolerance: ±0.2,
Unit: mm )
Circuit Diagram
Green Anode
6
Recommended Solder Pad
Green Anode
5
Green Anode
4
G1
1
G2
2
G3
3
Green Cathode
Green Cathode
Green Cathode
* MATERIALS PARTS Package Encapsulating Resin Electrodes MATERIALS Heat-Resistant Polymer Epoxy Resin Ag Plating Copper Alloy
SSC-QP-7-03-08(REV.07)
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6
SSC-MGT722
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8. Packing
Package Marking
( Tolerance: ±0.2,
Unit: mm )
(1) Quantity : 700pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package SSC-MGT722
SSC-QP-7-03-08(REV.07)
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6
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9. Reel Packing Structure
Reel
XXX
QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER :
XXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR DESI PAK
Aluminum Vinyl Bag
XXX
QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER :
XXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 245 220 142 7inch
1 SIDE
XXX
QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER :
c
1
TOP LED
RoHS
XXXXXX
b
SEOUL SEMICONDUCTOR CO., LTD.
a
SSC-QP-7-03-08(REV.07)
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6
SSC-MGT722
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10. Lot Number
The lot number is composed of the following characters; MGT○ □ □ ◎ ◎
#~#
MGT – First Part Name ○– □□ – ◎◎ – # ~# – Year (6 for 2006, 7 for 2007, 8 for 2008 ) Month ( 01 for Jan., 02 for Feb.,‥ ‥ ‥ 11 for Nov., 12 for Dec.) Day ( 01, 02, 03, 04, ‥ ‥ ‥ ‥ ‥ ‥ 28, 29, 30, 31.)
The number of the internal quality control
XXX
QUANTITY : 2000 LOT NUMBER : MGT70426 01 512 PART NUMBER : MGT722
SEOUL SEMICONDUCTOR CO., LTD.
SSC-QP-7-03-08(REV.07)
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6
SSC-MGT722
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11. Precaution for use
(1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice.
SSC-QP-7-03-08(REV.07)
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6
SSC-MGT722
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12. Characteristic Diagram
Forward Current vs Forward Voltage (per die)
(Ta=25ºC)
6
Relative Luminous Intensity vs Forward Current (Total)
(Ta=25ºC)
100
Relative Luminous Intensity IV / IV (25ºC)
5
Forward Current IF [mA]
50
4
20
10
3
2
5
1
1 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4
0
0
30 (10)
60 (20)
90 (30)
120 (40)
150 (50)
180 (60)
210 (70)
240 (80)
270 300 < total (90) (100)< per die
Forward Voltage VF [V]
Forward Current IF [mA]
Forward Current Derating Curve (per die)
40
Radiation Diagram
(TA=25ºC)
3 Chip ON
Forward Current IF [mA]
0
30
-30
30
20
-60
10
60
0
-90
0 20 40 60 80 100
90
Ambient Temperature
TA [oC ]
SSC-QP-7-03-08(REV.07)
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6
SSC-MGT722
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