SSC-SRT801

*Customer: SPECIFICATION ITEM MODEL TOP LED DEVICE SSC-SRT801 [Contents] 1. Features ------------------------------------------------------------- 2 2. Absolute Maximum Ratings ------------------------------------------ 2 3. Electro-optical Characteristics ---------------------------------------- 2 4. Soldering Profile 5. Outline Dimension 6. Packing ---------------------------------------------------- 3 ----------------------------------------------4 4 ------------------------------------------------------------- 7. Reel Packing Structure ------------------------------------------------- 5 8. Precaution for Use --------------------------------------------------- 6 9. Characteristic Diagram -------------------------------------------7 SSC-QP-0401-06(REV.0.2) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SRT801 - 1/7 - 1. Features White colored SMT package and colorless clear window Material : : AlGaInP Suitable for all SMT assembly methods ; Suitable for all soldering methods 2. Absolute Maximum Ratings *1 (TA=25ºC) Parameter Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature *2 IFM was measured at TW Symbol Pd IF IFM VR Topr Tstg 1/10 of duty ratio. *2 Value 78 30 60 5 -40 ~ +100 -40 ~ +100 Unit mW mA mA V ºC ºC *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. 0.1msec of pulse width and D 3. Electro-Optical Characteristics (TA=25ºC) Parameter Forward Voltage Reverse Current Luminance Intensity Peak Wavelength Dominant Wavelength Spectral Bandwidth 50% Viewing Angle *2 *1 Symbol VF IR IV Condition IF =20mA VR=5V IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA Min 80 619 - Typ 2.1 140 633 625 24 120 Max 2.5 10 631 - Unit V µA mcd nm nm nm deg. λP λd ∆λ 2 θ½ *1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *2 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC. SSC-QP-0401-06(REV.0.2) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SRT801 - 2/7 - 4. Soldering Profile (1) Reflow Soldering Conditions / Profile Preliminary heat to be at maximum 150ºC for maximum 2 minutes. Soldering heat to be at maximum 240ºC for maximum 10 seconds. 280 Device Surface Temperature [ C] 240 200 160 120 80 40 0 o 0 15 30 45 60 75 90 105 120 135 150 165 180 195 Soldering Times [sec] (2) Lead-free solder Preliminary heating to be at maximum 220°C for maximum 2 minutes. Soldering heat to be at maximum 260°C for maximum 10 seconds. 280 Device Surface Temperature [ C] 240 200 160 120 80 40 0 0 15 30 45 60 75 90 105 120 135 150 165 180 195 o Soldering Times [sec] (3) Hand Soldering conditions Do not exceed 3 seconds at maximum 300ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. SSC-QP-0401-06(REV.0.2) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SRT801 - 3/7 - 5. Outline Dimension ( Tolerance: ±0.2, Unit: mm ) 6. Packing 1.75±0.1 2.0±0.05 4.0±0.1 1.55 ± 0.05 0.22±0.05 3.5±0.1 8±0.1 5° 1.0±0.1 3.1±0.1 2.22±0.1 8° 11.4 ± 0.1 180 +0 -3 2.0 ± 0.2 LABLE 13 ±0.2 3.83±0.1 9.0 ± 0.3 30° 10 22 60 ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : 2000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package SSC-QP-0401-06(REV.0.2) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SRT801 - 4/7 - 7. Reel Packing Structure Reel RANK : QUANTITY : XXXX XXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SSCXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR 6HIC-60N 50% 60% Aluminum Vinyl Bag RANK : QUANTITY : XXXX 10% 20% 30% 40% XXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SSCXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE c 1 RANK : QUANTITY : XXXX XXX TOP LED b a LOT NUMBER : XXXXXXXXXX PART NUMBER : SSCXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. SSC-QP-0401-06(REV.0.2) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SRT801 - 5/7 - 8. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 65%HR (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened the device shall be soldered within a week. b. Keeping of a fraction Temperature : 5 ~ 30ºC Humidity : less than 30% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) In the case of that the components is humided, the components shall be dried; 24Hr at 80±5ºC or 12Hr at 100±5ºC. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (6) Quick cooling shall be avoided. (7) Components shall not be mounted on warped direction of L/F. (8) Anti radioactive ray design is not considered for the products. (9) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (10) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (11) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (12) The LEDs must be soldered within seven days after opening the moisture-proof packing. (13) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (14) The appearance and specifications of the product may be modified for improvement without notice. SSC-QP-0401-06(REV.0.2) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SRT801 - 6/7 - 9. Characteristic Diagram Relative Luminous Intensity vs. Forward Current (TA=25ºC) 250 Forward Current vs. Forward Voltage 100 (TA=25ºC) Relative Luminous Intensity IV / IV (20mA) [Rel.] 200 Forward Current IF [mA] 10 150 100 50 1 1.70 1.75 1.80 1.85 1.90 1.95 0 0 5 10 15 20 25 30 Forward Voltage VF [V] Forward Current IF [mA] Forward Current Derating Curve 40 Radiation Diagram (TA=25ºC) 0 Forward Current IF [mA] 30 -30 30 20 -60 10 60 0 -60 -90 -40 -20 0 20 40 60 80 100 120 90 Ambient Temperature TA [ºC] SSC-QP-0401-06(REV.0.2) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SRT801 - 7/7 -