SSC-YGURHT811

*Customer: SPECIFICATION ITEM MODEL TOP LED DEVICE SSC-YGURHT811 [Contents] 1. Features ------------------------------------------------------------- 2 2. Absolute Maximum Ratings ------------------------------------------ 2 3. Electro-optical Characteristics ---------------------------------------- 3 4. Soldering Profile 5. Outline Dimension 6. Packing ---------------------------------------------------- 4 ----------------------------------------------5 5 ------------------------------------------------------------- 7. Reel Packing Structure ------------------------------------------------- 6 8. Precaution for Use --------------------------------------------------- 7 Drawn by Checked by Approved by SSC-QP-0401-06(REV.0.2) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-YGURHT811 - 1/7 - 1. Features White colored SMT package and colorless clear window Material : GaP(Yellowish Green) / AlGaAs(Red) Suitable for all SMT assembly methods ; Suitable for all soldering methods 2. Absolute Maximum Ratings *1 Parameter Power Dissipation Forward Current Forward Peak Surge Current Reverse Voltage Operating Temperature Storage Temperature *2 IFM was measured at TW 0.1msec of pulse width and D (Ta=25ºC) Symbol Pd IF IFM VR Topr Tstg 1/10 of duty ratio. *2 Value Yellowish Green 90 30 90 5 -30 ~ +85 -40 ~ +100 Red 90 30 90 Unit mW mA mA V ºC ºC *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. SSC-QP-0401-06(REV.0.2) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-YGURHT811 - 2/7 - 3. Electro-Optical Characteristics Parameter Yellowish Green Red Yellowish Green Red Luminance Intensity *1 Yellowish Green Red Yellowish Green Red Yellowish Green Red Viewing Angle *2 R, G 2 θ½ IF =40mA Total IV IF =20mA 20 30 570 640 20 30 120 40 575 565 IF =20mA 635 IF =20mA 645 IR VR=5V 30 50 10 70 Symbol Condition Min 1.9 1.5 Typ 2.1 1.9 Max 2.5 (Ta=25ºC) Unit Forward Voltage VF IF =20mA V 2.3 10 Reverse Current µA mcd Dominant Wavelength λd nm Spectral Bandwidth ∆λ nm deg. *1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC. SSC-QP-0401-06(REV.0.2) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-YGURHT811 - 3/7 - 4. Soldering Profile (1) Reflow Soldering Conditions / Profile Preliminary heat to be at maximum 150ºC for maximum 2 minutes. Soldering heat to be at maximum 240ºC for maximum 10 seconds. 280 Device Surface Temperature [ C] 240 200 160 120 80 40 0 o 0 15 30 45 60 75 90 105 120 135 150 165 180 195 Soldering Times [sec] (2) Wave Soldering Conditions / Profile Preliminary heat to be at maximum 120ºC for maximum 1 minutes. Soldering heat to be at maximum 260ºC for maximum 10 seconds 280 Device Surface Temperature [ C] 240 200 160 120 80 40 0 o 0 15 30 45 60 75 90 105 120 135 150 165 180 195 Soldering Time [sec] (3) Hand Soldering conditions Do not exceed 3 seconds at maximum 300ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. SSC-QP-0401-06(REV.0.2) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-YGURHT811 - 4/7 - 5. Outline Dimension Packa ge Outlines 43 Circuit D iagram Red Anode 4 Yellowish/Green Anode 3 R ecommended Solder Pad Pack age Mark ing (Cathode) 1 2 Front V iew Right View Rear View 1 Red Cath ode 2 Yellowish/Green Cath ode ( Tolerance: ±0.2, Unit: mm ) 6. Packing 1.75±0.1 2.0±0.05 4.0±0.1 1.55 ± 0.05 0.22±0.05 3.5±0.1 8±0.1 5° 1.0±0.1 3.1±0.1 2.22±0.1 8° 11.4 ± 0.1 180 +0 -3 2.0 ± 0.2 LABLE 13 ±0.2 30° 10 22 60 3.83±0.1 9.0 ± 0.3 ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : 2000 pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package SSC-QP-0401-06(REV.0.2) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-YGURHT811 - 5/7 - 7. Reel Packing Structure Reel RANK : QUANTITY : XXXX XXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SSCXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. Aluminum Vinyl Bag RANK : QUANTITY : XXXX XXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SSCXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE c 1 RANK : QUANTITY : XXXX XXX TOP LED b a LOT NUMBER : XXXXXXXXXX PART NUMBER : SSCXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. SSC-QP-0401-06(REV.0.2) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-YGURHT811 - 6/7 - 8. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 65%HR (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 30% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) In the case of that the components is humided, the components shall be dried; 24Hr at 80±5ºC or 12Hr at 100±5ºC. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (6) Quick cooling shall be avoided. (7) Components shall not be mounted on warped direction of L/F. (8) Anti radioactive ray design is not considered for the products. (9) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (10) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (11) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (12) The LEDs must be soldered within seven days after opening the moisture-proof packing. (13) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (14) The appearance and specifications of the product may be modified for improvement without notice. SSC-QP-0401-06(REV.0.2) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-YGURHT811 - 7/7 -