STW8Q2PA

Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Specification STW8Q2PA SSC Drawn Approval CUSTOMER Approval Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. Packing 11. Soldering CONTENTS Description Absolute Maximum Ratings Electro-Optical Characteristics Optical characteristics Reliability Test Color & Binning Bin Code Description Outline Dimension Reel Structure 12. Precaution for use 13. Handling of Silicone Resin LEDs Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Technical Data Sheet STW8Q2PA 1. Description This surface-mount LED comes in standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by silicone. The package design coupled with careful selection of component materials allow these products to perform with high reliability. Features • • • • Pb-Free Reflow soldering application RoHS compliant White colored SMT package Suitable for all SMT assembly and soldering methods • • High Reliability (silicone resin) High CRI = Ra 80 (Typ.) Applications • • • Electric Signs and Signals Interior automotive Office Automation, Electrical Appliances, Industrial Equipment Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings Parameter Power Dissipation Forward Current Peak Forward Current Operating Temperature Storage Temperature Junction Temperature [1] Symbol Pd IF IFM [2] Topr Tstg Tj Value 592 160 300 -40~+85 -40~+100 125 Unit mW mA mA ℃ ℃ ℃ [1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. [2] IFM was measured at Tw≤1 msec of pulse width and D≤1/10 of duty ratio. [3] LED’s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. 3. Electro-Optical characteristics Parameter Forward Voltage * Reverse Voltage Luminous Intensity* (2600~3700K) [2] [1] Symbol VF VR Iv Iv CCT 2Θ1/2 Ra Condition IF=100mA IR=5mA IF=100mA IF=100mA IF=100mA IF=100mA IF=100mA 1.5kΩ;100pF Min. 2.9 2,600 75 1 - Typ. 3.2 0.9 8.5 9.0 120 80 15 Max. 3.4 1.2 - Unit V V Luminous Intensity*[2] (3700~7000K) Color Correlated Temperature Viewing Angle [3] cd 7,000 K deg. KV Color Rendering Index* ESD (HBM) Thermal resistance [4] RthJS IF=100mA ºC/W [1] Forward current is 50mA per die for parallel inner circuit. Package Total Forward Current is 100mA [2] The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. [3] 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. [4] Thermal resistance: RthJS (Junction / solder) * Tolerance : VF :±0.1V, IV :±10%, Ra :±3, x,y :±0.01 [Note] All measurements were made under the standardized environment of SSC. Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Relative Luminous Intensity Forward Current IF [mA] y Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics Forward Voltage vs. Forward Current Ta=25℃ Forward Current vs. Relative Luminous Intensity Ta=25℃ 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 100 10 1 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 0 20 40 60 80 100 120 140 160 Forward Voltage VF [V] Forward Current IF [mA] Forward Current vs. Chromaticity Coordinate Ta=25℃ 0.368 Directivity Ta=25℃ 0 0.366 -30 20mA 60mA 30 0.364 100mA 150mA 200mA -60 60 0.362 -90 0.360 0.336 0.337 0.338 0.339 0.340 0.341 90 x Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Relative Forward Voltage Relative Light Output y Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Forward Voltage Shift vs. Junction Temperature IF=100mA 1.0 Relative Light Output vs. Junction Temperature IF=100mA 1.0 0.8 0.8 0.6 0.6 0.4 0.4 0.2 0.2 0.0 25 50 75 100 O 0.0 125 25 50 75 100 O 125 Ju n ctio n te m p e ra tu re Tj( C ) Ju n ctio n tem pe ratu re Tj( C ) Junction Temperature (℃) vs. Chromaticity Coordinate IF=100mA 0.335 0.330 25 0.325 45 65 85 105 0.320 0.315 0.310 0.315 0.320 0.325 0.330 x Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Forward Current IF[mA] 140 120 100 80 60 40 20 0 -4 0 -20 0 20 40 60 O R th J-A = 1 0 0 C /W o Relative Emission Intensity Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Ambient Temperature vs. Maximum Forward Current 200 180 160 1.0 Spectrum Ta=25℃, IF=100mA 2600~3700K 3700~4700K 4700~7000K 0.5 80 100 0.0 300 400 500 600 700 800 A m b ie n t te m p e ra tu re T a ( C ) Wavelength [nm] Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 5. Reliability Test Duration / Cycle 100 Cycle 1000 Hours 1000 Hours 1000 Hours 1000 Hours Item Reference EIAJ ED-4701 EIAJ ED-4701 EIAJ ED-4701 EIAJ ED-4701 Internal Reference Internal Reference Internal Reference Internal Reference MIL-STD883D Test Conditions Ta =-40oC(30min) ~ 100oC(30min) Ta =100oC Ta =60oC, RH=90% Ta =-40oC Ta =25oC, IF =100mA Ta =60oC, RH=90%, IF =100mA Number of Damaged 0/22 0/22 0/22 0/22 0/22 Thermal Shock High Temperature Storage High Temp. High Humidity Storage Low Temperature Storage Operating Endurance Test High Temperature High Humidity Life Test High Temperature Life Test Low Temperature Life Test ESD(HBM) Reflow 500 Hours 0/22 Ta =85oC, IF =100mA Ta =-40oC, IF =100mA 1KV at 1.5kΩ; 100pF 260℃< 10sec. Reflow Soldering 500 Hours 1000 Hours 3 Time 3 Time 0/22 0/22 0/22 0/22 Tsol □ CRITERIA FOR JUDGING THE DAMAGE Item Forward Voltage Luminous Intensity Symbol VF IV Condition IF =100mA IF =100mA Criteria for Judgment MIN LSL [2] × 0.5 MAX USL [1] × 1.2 - Note : [1] USL : Upper Standard Level [2] LSL : Lower Standard Level Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 CIE Y Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 6. Color & Binning 0.9 0.8 0.7 505 515 510 520 525 530 535 540 545 550 555 560 565 500 570 575 580 585 590 595 600 610 620 630 830 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 495 490 485 480 475 470 460 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 CIEX Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 CIE Y Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 6. Color & Binning 0.46 0.44 0.42 Energy Star Rank 3200K 3500K 3700K 4000K F8 E9 F0 E1 F2 E3 F4 E5 F6 E7 F7 F5 G6 F3 G4 G7 F1 G2 G5 F9 G0 2700K 2900K 3000K H8 G9 G8 H0 G1 G3 H4 H6 H7 H2 H5 H3 H1 H9 2600K 0.40 4700K 5000K 4200K 4500K D9 D8 D1 D3 E8 E0 0.38 0.36 0.34 0.32 0.30 0.28 0.28 6000K 5300K 5600K B9 B8 6500K 7000K A0 A2 A4 A6 A8 B0 A1 A3 A5 A7 A9 B2 C8 C9 D0 C1 C0 D2 C3 C5 D6 C7 D4 E2 E4 E6 D5 D7 B1 C2 B3 C4 B5 C6 B4 B7 B6 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 CIE X Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 6. Color & Binning ● COLOR RANK 6500~7000K A0 CIE X 0.3028 0.3041 0.3126 0.3115 CIE Y 0.3304 0.324 0.3324 0.3393 CIE X 0.3041 0.3055 0.3136 0.3126 A2 CIE Y 0.324 0.3177 0.3256 0.3324 CIE X 0.3055 0.3068 0.3146 0.3136 A4 CIE Y 0.3177 0.3113 0.3187 0.3256 CIE X 0.3068 0.3082 0.3155 0.3146 A6 CIE Y 0.3113 0.3046 0.312 0.3187 CIE X 0.3082 0.3096 0.3164 0.3155 A8 CIE Y 0.3046 0.298 0.3046 0.312 6000~6500K A1 CIE X 0.3115 0.3126 0.321 0.3205 CIE Y 0.3393 0.3324 0.3408 0.3481 CIE X 0.3126 0.3136 0.3216 0.321 A3 CIE Y 0.3324 0.3256 0.3334 0.3408 CIE X 0.3136 0.3146 0.3221 0.3216 A5 CIE Y 0.3256 0.3187 0.3261 0.3334 CIE X 0.3146 0.3155 0.3225 0.3221 A7 CIE Y 0.3187 0.312 0.319 0.3261 CIE X 0.3155 0.3164 0.323 0.3225 A9 CIE Y 0.312 0.3046 0.311 0.319 5600~6000K B0 CIE X 0.3207 0.3212 0.3293 0.3292 CIE Y 0.3462 0.3389 0.3461 0.3539 CIE X 0.3212 0.3217 0.3293 0.3293 B2 CIE Y 0.3389 0.3316 0.3384 0.3461 CIE X 0.3217 0.3222 0.3294 0.3293 B4 CIE Y 0.3316 0.3243 0.3306 0.3384 CIE X 0.3222 0.3226 0.3295 0.3294 B6 CIE Y 0.3243 0.3178 0.3234 0.3306 CIE X 0.32 0.3207 0.3292 0.329 B8 CIE Y 0.3572 0.3462 0.3539 0.3656 5300~5600K B1 CIE X 0.3292 0.3293 0.3373 0.3376 CIE Y 0.3539 0.3461 0.3534 0.3616 CIE X 0.3293 0.3293 0.3369 0.3373 B3 CIE Y 0.3461 0.3384 0.3451 0.3534 CIE X 0.3293 0.3294 0.3366 0.3369 B5 CIE Y 0.3384 0.3306 0.3369 0.3451 CIE X 0.3294 0.3295 0.3364 0.3366 B7 CIE Y 0.3306 0.3234 0.3288 0.3369 CIE X 0.329 0.3292 0.3376 0.3381 B9 CIE Y 0.3656 0.3539 0.3616 0.374 Rev. 05 * Measurement Uncertainty of the Color Coordinates : ± 0.01 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 6. Color & Binning ● COLOR RANK 5000~5300K C0 CIE X 0.3376 0.3373 0.3456 0.3463 CIE Y 0.3616 0.3534 0.3601 0.3687 CIE X 0.3373 0.3369 0.3448 0.3456 C2 CIE Y 0.3534 0.3451 0.3514 0.3601 CIE X 0.3369 0.3366 0.344 0.3448 C4 CIE Y 0.3451 0.3369 0.3428 0.3514 CIE X 0.3366 0.3364 0.3433 0.344 C6 CIE Y 0.3369 0.3288 0.3345 0.3428 CIE X 0.3381 0.347 0.3463 0.3376 C8 CIE Y 0.374 0.381 0.3687 0.3616 4700~5000K C1 CIE X 0.3463 0.3456 0.3539 0.3552 CIE Y 0.3687 0.3601 0.3669 0.376 CIE X 0.3456 0.3448 0.3526 0.3539 C3 CIE Y 0.3601 0.3514 0.3578 0.3669 CIE X 0.3448 0.344 0.3514 0.3526 C5 CIE Y 0.3514 0.3428 0.3487 0.3578 CIE X 0.344 0.3433 0.35 0.3514 C7 CIE Y 0.3428 0.3345 0.34 0.3487 CIE X 0.347 0.3572 0.3552 0.3463 C9 CIE Y 0.381 0.3891 0.376 0.3687 4500~4700K D0 CIE X 0.3548 0.3536 0.3625 0.3641 CIE Y 0.3736 0.3646 0.3711 0.3804 CIE X 0.3536 0.3523 0.3608 0.3625 D2 CIE Y 0.3646 0.3555 0.3616 0.3711 CIE X 0.3523 0.3511 0.359 0.3608 D4 CIE Y 0.3555 0.3465 0.3521 0.3616 CIE X 0.3511 0.3498 0.3575 0.359 D6 CIE Y 0.3465 0.3385 0.3441 0.3521 CIE X 0.3562 0.3548 0.3641 0.3661 D8 CIE Y 0.3826 0.3736 0.3804 0.39 4200~4500K D1 CIE X 0.3641 0.3625 0.3714 0.3736 CIE Y 0.3804 0.3711 0.3775 0.3874 CIE X 0.3625 0.3608 0.3692 0.3714 D3 CIE Y 0.3711 0.3616 0.3677 0.3775 CIE X 0.3608 0.359 0.367 0.3692 D5 CIE Y 0.3616 0.3521 0.3578 0.3677 CIE X 0.359 0.3575 0.365 0.367 D7 CIE Y 0.3521 0.3441 0.3489 0.3578 CIE X 0.3661 0.3641 0.3736 0.376 D9 CIE Y 0.39 0.3804 0.3874 0.3974 Rev. 05 * Measurement Uncertainty of the Color Coordinates : ± 0.01 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 6. Color & Binning ● COLOR RANK 4000~4200K E0 CIE X 0.3736 0.3714 0.3842 0.3869 CIE Y 0.3874 0.3775 0.3855 0.3958 CIE X 0.3714 0.3692 0.3813 0.3842 E2 CIE Y 0.3775 0.3677 0.3751 0.3855 CIE X 0.3692 0.367 0.3783 0.3813 E4 CIE Y 0.3677 0.3578 0.3646 0.3751 CIE X 0.367 0.365 0.3758 0.3783 E6 E8 CIE Y 0.3578 0.3489 0.355 0.3646 CIE X 0.376 0.3736 0.3869 0.3902 CIE Y 0.3974 0.3874 0.3958 0.4067 3700~4000K E1 CIE X 0.3869 0.3842 0.397 0.4006 CIE Y 0.3958 0.3855 0.3935 0.4044 CIE X 0.3842 0.3813 0.3934 0.397 E3 CIE Y 0.3855 0.3751 0.3825 0.3935 CIE X 0.3813 0.3783 0.3898 0.3934 E5 CIE Y 0.3751 0.3646 0.3716 0.3825 CIE X 0.3783 0.3758 0.3863 0.3898 E7 CIE Y 0.3646 0.355 0.361 0.3716 CIE X 0.3902 0.3869 0.4006 0.4044 E9 CIE Y 0.4067 0.3958 0.4044 0.416 3500~3700K F0 CIE X 0.3996 0.396 0.4104 0.4146 CIE Y 0.4015 0.3907 0.3978 0.4089 CIE X 0.396 0.3925 0.4062 0.4104 F2 CIE Y 0.3907 0.3798 0.3865 0.3978 CIE X 0.3925 0.3889 0.4017 0.4062 F4 CIE Y 0.3798 0.369 0.3751 0.3865 CIE X 0.3889 0.386 0.3983 0.4017 F6 CIE Y 0.369 0.36 0.366 0.3751 CIE X 0.4037 0.3996 0.4146 0.4197 F8 CIE Y 0.414 0.4015 0.4089 0.4217 3200~3500K F1 CIE X 0.4146 0.4104 0.4248 0.4299 CIE Y 0.4089 0.3978 0.4048 0.4165 CIE X 0.4104 0.4062 0.4198 0.4248 F3 CIE Y 0.3978 0.3865 0.3931 0.4048 CIE X 0.4062 0.4017 0.4147 0.4198 F5 CIE Y 0.3865 0.3751 0.3814 0.3931 CIE X 0.4017 0.3983 0.4104 0.4147 F7 CIE Y 0.3751 0.366 0.3715 0.3814 CIE X 0.4197 0.4146 0.4299 0.4354 F9 CIE Y 0.4217 0.4089 0.4165 0.4288 Rev. 05 * Measurement Uncertainty of the Color Coordinates : ± 0.01 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 6. Color & Binning ● COLOR RANK 3000~3200K G0 CIE X 0.4299 0.4248 0.4374 0.443 CIE Y 0.4165 0.4048 0.4093 0.4212 CIE X 0.4248 0.4198 0.4317 0.4374 G2 CIE Y 0.4048 0.3931 0.3973 0.4093 CIE X 0.4198 0.4147 0.4259 0.4317 G4 CIE Y 0.3931 0.3814 0.3853 0.3973 CIE X 0.4147 0.4102 0.4207 0.4259 G6 CIE Y 0.3814 0.371 0.3744 0.3853 CIE X 0.4354 0.4299 0.443 0.4487 G8 CIE Y 0.4288 0.4165 0.4212 0.4333 2900~3000K G1 CIE X 0.443 0.4374 0.4499 0.4562 CIE Y 0.4212 0.4093 0.4138 0.426 CIE X 0.4374 0.4317 0.4436 0.4499 G3 CIE Y 0.4093 0.3973 0.4015 0.4138 CIE X 0.4317 0.4259 0.4373 0.4436 G5 CIE Y 0.3973 0.3853 0.3893 0.4015 CIE X 0.4259 0.4207 0.4312 0.4373 G7 CIE Y 0.3853 0.3744 0.3778 0.3893 CIE X 0.4487 0.443 0.4562 0.4619 G9 CIE Y 0.4333 0.4212 0.426 0.4378 2700~2900K H0 CIE X 0.4562 0.4499 0.462 0.4687 CIE Y 0.426 0.4138 0.4166 0.4289 CIE X 0.4499 0.4436 0.4551 0.462 H2 CIE Y 0.4138 0.4015 0.4042 0.4166 CIE X 0.4436 0.4373 0.4483 0.4551 H4 CIE Y 0.4015 0.3893 0.3919 0.4042 CIE X 0.4373 0.4312 0.4422 0.4483 H6 CIE Y 0.3893 0.3778 0.3805 0.3919 CIE X 0.4619 0.4562 0.4687 0.4747 H8 CIE Y 0.4378 0.426 0.4289 0.441 2600~2700K H1 CIE X 0.4687 0.462 0.474 0.481 CIE Y 0.4289 0.4166 0.4194 0.4319 CIE X 0.462 0.4551 0.4666 0.474 H3 CIE Y 0.4166 0.4042 0.4069 0.4194 CIE X 0.4551 0.4483 0.4593 0.4666 H5 CIE Y 0.4042 0.3919 0.3944 0.4069 CIE X 0.4483 0.4422 0.4527 0.4593 H7 CIE Y 0.3919 0.3805 0.383 0.3944 CIE X 0.4747 0.4687 0.481 0.4875 H9 CIE Y 0.441 0.4289 0.4319 0.4435 Rev. 05 * Measurement Uncertainty of the Color Coordinates : ± 0.01 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Bin Code Q5 R0 R5 S0 S5 T0 T5 V0 7. Bin Code Description Bin Code Luminous Intensity S5 CIE G5 Forward Voltage Z1 Luminous Intensity (mcd) @ IF = 100mA Min. 7500 8000 8500 9000 9500 10000 10500 11000 Max. 8000 8500 9000 9500 10000 10500 11000 11500 Flux (lm) Typ 25.8 27.7 28.7 30.6 33 34 35.6 36 Color Rank @ IF = 100mA A~H Forward Voltage (V) @ IF = 100mA Bin Code Y3 Z1 Z2 Z3 A1 Min. 2.9 3.0 3.1 3.2 3.3 Max. 3.0 3.1 3.2 3.3 3.4 Available ranks Not yet available ranks CCT 5300~7000 K (CIE A,B) 3700~5300 K (CIE C,D,E) 2600~3700 K (CIE F,G,H) Q5 Q5 Q5 R0 R0 R0 R5 R5 R5 IV Rank S0 S0 S0 S5 S5 S5 T0 T0 T0 T5 T5 T5 V0 V0 V0 Rev. 05 [Note] All measurements were made under the standardized environment of SSC. In order to ensure availability, single color rank will not be orderable. October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 8. Outline Dimension ( Tolerance: ±0.1, Unit: mm ) Package Marking N.C C1 A C2 Slug (Anode) [Recommended Solder Pattern] [Note] Forward current is 50mA per die for parallel inner circuit. Package Total Forward Current is 100mA Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 22 13 60 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 9. Reel Structure 180 15.4±1.0 13±0.3 2 ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : 3,500pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape Rev. 05 (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 10. Soldering (1) Lead Solder Lead Solder Lead Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 120~150℃ 120 sec. Max. 240℃ Max. 10 sec. Max. 2.5~5 C / sec. 2.5~5 o C / sec. 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC Pre-heating 120~150 oC 120sec. Max. (2) Lead-Free Solder Lead-free Solder Lead Free Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 150~200℃ 120 sec. Max. 260℃ Max. 10 sec. Max. 1~5 oC / sec. 1~5 oC / sec. 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC Pre-heating 150~200 o C 120sec. Max. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. (5) It is recommended that the customer use the nitrogen reflow method. (6) Repairing should not be done after the LEDs have been soldered. (7) Reflow soldering should not be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 11. Packing Reel QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE c 1 QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX RoHS PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. b Rev. 05 October 2010 a www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 12. precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desicator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMT, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 4 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Silver plating might be tarnished in the environment that contains corrosive gases and materials. Also any product that has tarnished lead might be decreased the solder-ability and optical-electrical properties compare to normal ones. Please do not expose the product in the corrosive environment during the storage. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (6) Quick cooling shall be avoided. (7) Components shall not be mounted on warped direction of PCB. (8) Anti radioactive ray design is not considered for the products. (9) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (10) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (11) The LEDs must be soldered within seven days after opening the moisture-proof packing. (12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (13) The appearance and specifications of the product may be modified for improvement without notice. Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 13. Handling of Silicone Resin LEDs 1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. 2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. 3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. 4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. 5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. 6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. Rev. 05 October 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24