SG2011-2.8XK3

SG2011 GENERAL DESCRIPTION The SG2011 low-power, low-dropout, CMOS linear voltage regulators operate from a 2.5V to 5.5V input and deliver up to 300mA. They are perfect choice for low voltage, low power applications. An ultra low ground current (110µA at 300mA output) makes them attractive for battery operated power systems. The SG2011 series also offer ultra low dropout voltage (210mV at 300mA output) to prolong battery life in portable electronics. The output voltage is preset to voltages in the range of 1.5V to 5.0V. Other features include foldback current limit and thermal shut-down protection. SG2011 comes in 3-pin SOT23 and 3-pin SOT89 packages. 300mA , Low Power, Low Dropout, Linear Regulators FEATURES - Ultra-Low Dropout Voltage: 210mV at 300mA output - Low 80µA No-Load Supply Current - Low 110µA Operating Supply Current - at 300mA Output Thermal-Overload Protection Output Current Limit Preset Output Voltages (±1.8% Accuracy) Output Voltage: Available in Fixed Outputs of 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, and 3.6V APPLICATIONS Cellular Telephones Digital Cameras MP3、MP4 USB 2.0 Modems PC Cameras Hand-Held Instruments Electronic Dictionarys Portable/Battery-Powered Equipment PIN CONFIGURATIONS（TOP VIEW） GND 1 3 IN OUT 2 SOT23-3 GND IN TYPICAL OPERATION CIRCUIT 1 OUT 2 GND 3 IN 1 GND 2 IN 3 OUT INPUT IN CIN 1μ F OUT OUTPUT SOT89-3 SOT89-3(L-Type) GND COUT 1μ F SG Microelectronics Co, Ltd Tel: 86/451/84348461 www.sg-micro.com REV. B ORDERING INFORMATION MODEL VOUT (V) PINPACKAGE SOT23-3 SOT89-3 SOT89-3(L-Type) SOT23-3 SOT89-3 SOT89-3(L-Type) SOT23-3 SG2011-2.5 2.5V SOT89-3 SOT89-3(L-Type) SOT23-3 SOT89-3 SOT89-3(L-Type) SOT23-3 SOT89-3 SOT89-3(L-Type) SG2011-3.3 3.3V SOT23-3 SOT89-3 SOT89-3(L-Type) SOT23-3 SOT89-3 SOT89-3(L-Type) - 40°C to +125°C - 40°C to +125°C SPECIFIED TEMPERATURE RANGE - 40°C to +125°C ORDERING NUMBER SG2011-1.5XN3/TR SG2011-1.5XK3/TR SG2011-1.5XK3L/TR SG2011-1.8XN3/TR SG2011-1.8XK3/TR SG2011-1.8XK3L/TR SG2011-2.5XN3/TR SG2011-2.5XK3/TR SG2011-2.5XK3L/TR SG2011-2.8XN3/TR SG2011-2.8XK3/TR SG2011-2.8XK3L/TR SG2011-3.0XN3/TR SG2011-3.0XK3/TR SG2011-3.0XK3L/TR SG2011-3.3XN3/TR SG2011-3.3XK3/TR SG2011-3.3XK3L/TR SG2011-3.6XN3/TR SG2011-3.6XK3/TR SG2011-3.6XK3L/TR PACKAGE MARKING XB15 SG2011-1.5XK3 SG2011-1.5XK3L XB18 SG2011-1.8XK3 SG2011-1.8XK3L XB25 SG2011-2.5XK3 SG2011-2.5XK3L XB28 SG2011-2.8XK3 SG2011-2.8XK3L XB30 SG2011-3.0XK3 SG2011-3.0XK3L XB33 SG2011-3.3XK3 SG2011-3.3XK3L XB36 SG2011-3.6XK3 SG2011-3.6XK3L PACKAGE OPTION Tape and Reel, 3000 Tape and Reel, 1000 Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 Tape and Reel, 1000 Tape and Reel, 3000 Tape and Reel, 1000 Tape and Reel, 1000 SG2011-1.5 1.5V SG2011-1.8 1.8V - 40°C to +125°C SG2011-2.8 2.8V - 40°C to +125°C SG2011-3.0 3.0V - 40°C to +125°C SG2011-3.6 3.6V - 40°C to +125°C ABSOLUTE MAXIMUM RATINGS IN to GND.....................................................................- 0.3V to +6V Output Short-Circuit Duration............................................Infinite OUT to GND...................................................- 0.3V to (VIN + 0.3V) Power Dissipation, PD @ TA = 25℃ SOT23-3 .....................................................................................0.4W SOT89-3 ................................................................................0.571W Package Thermal Resistance SOT23-3, θJA....................................................................... 250℃/W SOT89-3, θJA.........................................................................175°C/W Operating Temperature Range............................- 40°C to +125°C Junction Temperature...........................................................+150°C Storage Temperature.............................................- 65°C to +150°C Lead Temperature (soldering, 10s).......................................260°C ESD Susceptibility HBM..........................................................................................7000V MM..............................................................................................400V Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PIN DESCRIPTION NAME IN GND OUT FUNCTION Regulator Input. Supply voltage can range from 2.5V to 5.5V. Ground. Regulator Output. ２ SG2011 ELECTRICAL CHARACTERISTICS (VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), TA = - 40°C to +125°C, unless otherwise noted. Typical values are at TA = + 25°C.) PARAMETER Input Voltage SYMBOL VIN IOUT = 0.1mA, TA = +25°C IOUT = 0.1mA to 300mA, Output Voltage Accuracy TA = 0°C to +70°C IOUT = 0.1mA to 300mA, TA = - 40°C to +125°C Output Current Current Limit Ground Pin Current Dropout Voltage(Note1) Line Regulation Load Regulation Output Voltage Noise Power Supply Rejection Rate THERMAL PROTECTION Thermal Shutdown Temperature Thermal Shutdown Hysteresis TSHDN ΔTSHDN 160 15 ℃ ℃ ΔVLNR ΔVLDR ILIM IQ No load IOUT = 300mA IOUT = 1mA IOUT = 300mA VIN = 2.5V or (VOUT + 0.1V) to 5.5V, IOUT = 1mA IOUT = 0.1mA to 300mA, COUT = 1µF f = 10Hz to 100KHz, COUT = 10µF ILOAD = 50mA, COUT = 1µF f = 100Hz, f = 1KHz, 300 310 750 80 110 0.8 210 0.004 0.0005 120 74 54 340 0.15 0.002 140 CONDITIONS MIN 2.5 -1.8 TYP MAX 5.5 1.8 2.5 2.9 mA mA µA mV %/V %/mA µVRMS dB dB % UNITS V en PSRR Specifications subject to change without notice. Note 1: The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT + 0.5V. (Only applicable for VOUT = +2.5V to +5.0V) ３ SG2011 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, TA = +25℃, unless otherwise noted. Ground Pin Current vs.Input Voltage 100 80 60 No Load 40 20 VOUT = 2.5V 0 0 1 2 3 4 Input Voltage(V) 5 6 Iload = 50mA Ground Pin Current vs.Input Voltage 200 Ground Pin Current(µA) Ground Pin Current(µA) 150 Iload = 50mA 100 50 No Load VOUT = 3.3V 0 0 1 2 3 4 Input Voltage(V) 5 6 Output Voltage vs.Input Voltage 6 No Load 5 Ground Pin Current vs.Load Current 160 150 140 Ground Current(µA) 130 120 110 100 90 80 70 60 VOUT = 2.5V VOUT = 3.3V Output Voltage(V) 4 VOUT = 3.3V 3 2 VOUT = 2.5V 1 0 0 1 2 3 4 Input Voltage(V) 5 6 0 50 100 150 200 Load Current(mA) 250 300 Output Voltage vs.Load Current 2.6 3.35 Output Vlotage vs.Load Current Output Voltage(V) Output Voltage(V) 2.55 3.325 2.5 3.3 2.45 VOUT = 2.5V 2.4 0 100 200 Load Current(mA) 300 3.275 VOUT = 3.3V 3.25 0 100 200 Load Current(mA) 300 ４ SG2011 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, TA = +25℃, unless otherwise noted. Line-Transient Response 4.5V 3.5V ILOAD = 150mA 3.1V 3V 2.9V VOUT 50mA 0mA VOUT = 3V 100µS/div VIN 3.05V 3V 2.95V Load-Transient Response VIN = VOUT + 0.5V ILOAD = 0mA to 50mA CIN = 1μF VOUT ILOAD VOUT = 3V 40µS/div Load-Transient Response Near Dropout 3.05V 3V 2.95V VOUT = 3V VOUT Power-Supply Rejection Ratio vs.Frequency 80 70 60 PSRR(dB) 50 40 30 20 10 0 0.01 COUT = 1μF COUT = 10μF ILOAD = 50mA 50mA 0mA CIN = 1μF VIN = VOUT + 0.1V ILOAD = 0mA to 50mA 40µS/div ILOAD 0.1 1 10 100 1000 Frequency(kHz) Region of Stable COUT ESR vs.Load Current 100 1200 1100 Current limit(mA) Current limit vs.Temperature VOUT = 3.3V 10 COUT ESR(Ω) COUT = 10μF 1000 900 800 700 600 500 400 300 1 Stable Region 0.1 COUT = 1μF 0.02 0.01 0 50 100 150 200 Load Current(mA) 250 300 -40 -20 0 20 40 60 80 Temperature(℃) 100 120 140 ５ SG2011 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT (NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, TA = +25℃, unless otherwise noted. Output Voltage vs.Temperature 2.6 ILOAD = 300mA Output Voltage(V) 2.55 Output Voltage(V) Output Voltage vs.Temperature 3.4 ILOAD = 300mA 3.35 2.5 3.3 2.45 VOUT = 2.5V 2.4 -40 -20 0 20 40 60 80 Temperature(℃) 100 120 140 3.25 VOUT = 3.3V 3.2 -40 -20 0 20 40 60 80 100 120 140 Temperature(℃) Ground Pin Current vs.Temperature 200 180 Ground Pin Current(μA) Dropout Voltage vs.Load Current 360 320 Dropout Voltage(mV) 160 140 120 100 80 60 40 -40 -20 0 VOUT = 3.3V 280 240 200 160 120 80 40 0 0 30 60 TA = +125℃ TA = +85℃ TA = +25℃ TA = -40℃ VOUT = 2.5V ILOAD = 300mA 20 40 60 80 Temperature(℃) 100 120 140 VOUT = 2.5V 90 120 150 180 210 240 270 300 Load Current(mA) Dropout Voltage vs.Load Current 350 Input Voltage(V) 6 4 2 0 Output Voltage(V) 2 1 0 Start Up VOUT = 2.5V ILOAD = 1mA 300 Dropout Voltage(mV) 250 200 150 100 50 0 0 50 100 150 200 250 300 Load Current(mA) VOUT = 3.3V TA = -40℃ TA = +125℃ TA = +85℃ TA = +25℃ Time(10µs/div) ６ SG2011 Application Notes When LDO is used in handheld products, Attention must be paid to voltage spike which would damage SG2011. In such applications, voltage spike will be generated at changer interface and VBUS pin of USB interface when changer adapters and USB equipments are hot-inserted. Besides this, handheld products will be tested on the production line on the condition of no battery. Test Engineer will apply power from the connector pin which connects with positive pole of the battery. When external power supply is turned on suddenly, the voltage spike will be generated at the battery connector. The voltage spike will be very high, it always exceeds the absolute maximum input voltage (6.0V) of LDO. In order to get robust design. Design Engineer needs to clear up this voltage spike. Zener diode is a cheap and effective solution to eliminate such voltage spike. For example, BZM55B5V6 is a 5.6V small package Zener diode which can be used to remove voltage spike in cell phone design. The schematic is shown in below: Vcc Input BZM55B5V6 1uF C1 IN SG2011 GND VOUT C2 4.7uF VOUT ７ SG2011 PACKAGE OUTLINE DIMENSIONS SOT23-3 D b L 0 θ 0.20 Symbol A A1 Dimensions In Millimeters Min 1.050 0.000 1.050 0.300 0.100 2.820 1.500 2.650 1.800 0.300 0° Dimensions In Inches Min 0.041 0.000 0.041 0.012 0.004 0.111 0.059 0.104 0.071 0.012 0° Max 1.250 0.100 1.150 0.400 0.200 3.020 1.700 2.950 2.000 0.600 8° Max 0.049 0.004 0.045 0.016 0.008 0.119 0.067 0.116 0.079 0.024 8° E1 A2 b c D E E e e1 A1 C L E1 e e1 L 0.950TYP 0.700REF 0.037TYP 0.028REF A2 A L1 θ ８ SG2011 PACKAGE OUTLINE DIMENSIONS SOT89-3 D D1 A Symbol A b b1 c D D1 E E1 e e1 L Dimensions In Millimeters Min Max 1.400 1.600 0.320 0.520 0.360 0.560 0.350 0.440 4.400 4.600 1.400 1.800 2.300 2.600 3.940 4.250 1.500TYP 2.900 3.100 0.900 1.100 Dimensions In Inches Min Max 0.055 0.063 0.013 0.020 0.014 0.022 0.014 0.017 0.173 0.181 0.055 0.071 0.091 0.102 0.155 0.167 0.060TYP 0.114 0.122 0.035 0.043 E1 L b e1 e c E ９ SG2011 REVISION HISTORY Location 9/05— Data Sheet changed from preliminary to REV. A 12/06— Data Sheet changed from REV. A to REV. B Changed to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Added Application Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 Page Shengbang Microelectronics Co, Ltd Unit 3, ChuangYe Plaza No.5, TaiHu Northern Street, YingBin Road Centralized Industrial Park Harbin Development Zone Harbin, HeiLongJiang 150078 P.R. China Tel.: 86-451-84348461 Fax: 86-451-84308461 www.sg-micro.com １０ SG2011